JPS6137803B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for integrating triple-plate strip lines with excellent mechanical and electrical properties.

Here, it is assumed that a microwave circuit having various functions is formed in the triplate stripline section.

FIG. 1 is a schematic cross-sectional view showing a conventional method of integrating triple-plate strip lines, and in the figure, 1
2 is a ground conductor, 3a and 3b are dielectric substrates, 4 is an internal conductor, and 5 is an adhesive.

This conventional method of integrating triplate strip lines will be briefly described below.

Conventionally, an internal conductor 4 and an adhesive 5 are sandwiched between dielectric substrates 3a and 3b, each of which has a ground conductor 2 adhered to one side, and heat and pressure 1 are applied to the whole to integrate the triplate strip line. I was planning.

However, the disadvantage of this integration method is that electrical and mechanical performance deteriorates due to thickness errors, losses, and adhesive strength of the adhesive 5, and this type of failure occurs frequently during the manufacturing process. It is. The reason for the deterioration in electrical performance is that the impedance of the triplate strip line shifts due to the uneven thickness of the adhesive 5, and the dielectric loss of the adhesive 5 is greater than that of the dielectric substrates 3a and 3b. This is because loss increases when a microwave electric field is applied to the adhesive 5.

On the other hand, the reason why the mechanical performance deteriorates is that the dielectric substrates 3a and 3b of the triplate stripline are generally made of tetrafluoroethylene-based material for ease of construction; This is because even if the surface is chemically treated, the bonding strength is weak and the bonding surface is soft and easily peels off due to stress such as bending or twisting.

The method of integrating triplate strip lines of this invention eliminates the above-mentioned conventional drawbacks.
The purpose is to reduce defects that occur during the manufacturing process.

FIG. 2 is a schematic cross-sectional view showing a method of integrating a triplate strip line according to an embodiment of the present invention, in which 1 is pressure and heat, 2 is a ground conductor, 3a,
3b is a dielectric substrate, 4 is an internal conductor, 6 is a through-hole conductor, and 7 is a solder layer.

Hereinafter, the method for integrating triplate strip lines according to the present invention will be explained in detail. In this invention, an internal conductor 4 is sandwiched between dielectric substrates 3a and 3b each having a ground conductor 2 adhered to one side thereof, and a dielectric substrate 3 is disposed within the dielectric substrates 3a and 3b.
A large number of through-hole conductors 6 having the same potential as the ground conductor 2 that are in contact between a and 3b are provided, a solder layer 7 is provided on each contact surface of the through-hole conductors 6, and pressure and heat 1 are applied to the entirety of these conductors to form a tri-plate. Realized the integration of strip lines.

According to this integration method, between the dielectric substrates 3a and 3b between which the internal conductor 4 is sandwiched, the dielectric substrate 3
It is mechanically fixed by a through-hole conductor 6 which has the same potential as the ground conductor 2 provided in a, 3b, and a solder layer 7, and the through-hole conductor 6, which is further bonded by the solder layer 7, is connected to the dielectric substrates 3a, 3b. It also serves as a reinforcing material, and is also effective against heat generated within the dielectric substrates 3a and 3b, as well as abnormal resonance, and eliminates problems caused by the integration of triple-plate strip lines that previously occurred during the manufacturing process. can be significantly reduced.

Although the method for integrating triplate striplines has been described above, the present invention is not limited to this, and can also be used for a method for integrating multilayer triplate striplines.

As described above, according to the method for integrating triplate strip lines according to the present invention, electrical and mechanical defects that occur during the manufacturing process can be prevented by the effect of the through-hole conductor provided in the dielectric substrate and the solder layer provided on the contact surface thereof. It can be reduced to a large extent.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing a method for integrating triplate striplines, and FIG. 2 is a schematic sectional view showing a method for integrating triplate striplines of the present invention. In the figure, 1 is pressure, heat, 2 is ground conductor, 3a, 3b
4 is a dielectric substrate, 4 is an internal conductor, 5 is an adhesive, 6 is a through-hole conductor, and 7 is a solder layer. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

Claims (1)

[Claims] 1 Inside the two dielectric substrates forming the triplate stripline, a large number of through-hole conductors with the same potential as the ground conductor that contacts between the dielectric substrates are provided.
A method for integrating a triple plate strip line, characterized in that a solder layer is provided on each contact surface of the through-hole conductor, and the whole is integrated by applying pressure and heat.