JPS6135263B2 - - Google Patents
Info
- Publication number
- JPS6135263B2 JPS6135263B2 JP3660979A JP3660979A JPS6135263B2 JP S6135263 B2 JPS6135263 B2 JP S6135263B2 JP 3660979 A JP3660979 A JP 3660979A JP 3660979 A JP3660979 A JP 3660979A JP S6135263 B2 JPS6135263 B2 JP S6135263B2
- Authority
- JP
- Japan
- Prior art keywords
- foil
- aluminum
- capacitance
- beryllium
- aluminum alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011888 foil Substances 0.000 claims description 45
- 229910000838 Al alloy Inorganic materials 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- 229910052790 beryllium Inorganic materials 0.000 claims description 16
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 description 7
- 238000005266 casting Methods 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- ing And Chemical Polishing (AREA)
Description
この発明は、電解コンデンサ陰極用アルミニウ
ム合金箔に関する。
電解コンデンサの性能を向上させるためには、
陽極用箔の静電容量だけでなく、陰極用箔の静電
容量も増大させることが必要である。箔の静電容
量を増大させるには、箔にエツチングを施して箔
の表面積を増大させることがで有効であるが、エ
ツチングのさいの腐食減量が多いと結果的に箔の
静電容量は低下する。したがつて、電解コンデン
サ陰極用アルミニウム合金箔の具備すべき条件
は、静電容量が大きくかつエツチングのさいの腐
食減量が少ないことである。
この発明は、上記の条件を満足しうる電解コン
デンサ陰極用アルミニウム合金箔を提供すること
を目的とする。
この発明の1つの電解コンデンサ陰極用アルミ
ニウム合金箔は、原料としての使用アルミニウム
の純度が99.7%以上であつて、銅を0.03〜0.5%、
ベリリウムを0.001〜0.2%含有し、不純物として
のケイ素および鉄の合計含有量が0.3%以下であ
ることを特徴とするものであり、この発明の他の
1つの発明の電解コンデンサ陰極用アルミニウム
合金箔は、原料としての使用アルミニウムの純度
が99.7%以上であつて、銅を0.03〜0.5%、ベリリ
ウムを0.01〜0.2%、チタンを0.002〜0.05%含有
し、不純物としてのケイ素および鉄の合計含有量
が0.3%以下であることを特徴とするものであ
る。
上記において、原料として使用するアルミニウ
ムの純度を99.7%以上としたのは、99.7%満であ
ると箔の静電容量を増大させる効果が得られない
からである。銅は、これがアルミニウム中に含有
せられることにより、アルミニウム合金箔の静電
容量を増大させる性質を有する。すなわち、周知
のごとく箔の静電容量は箔の表面積と比例し、箔
の表面積を増大させるためには、エツチングによ
つて箔の表面に凹部を均一かつ高密度に生じさせ
ることが必要である。鉄は電位的にアルミニウム
よりも貴であるとともに、そのアルミニウムに対
〓〓〓〓
する固溶範囲が広いために、アルミニウム中にこ
れを含有せしめることにより、これを含有しない
アルミニウム箔に較べて、エツチングのさい箔の
表面に均一かつ高密度に凹部が生ずる。しかしな
がら、銅の含有量が0.03%未満では箔の静電容量
を増大させる効果はなく、0.5%を越えるとエツ
チングが過度になり箔表面の凹部が多くなる反
面、腐食減量が多くなつて、結果的には静電容量
が低下する。したがつて、銅の含有量を0.03〜
0.5%の範囲内で選ぶべきであるが、とくに0.1〜
0.3%が好ましい。ベリリウムも、これがアルミ
ニウム中に含有せられることにより、アルミニウ
ム合金箔の静電容量を増大させる性質を有する。
すなわち、ベリリウムは固溶限が小さいために、
これをアルミニウム中に含有せしめるとアルミニ
ウム中に微細に折出するので、このアルミニウム
合金箔をエツチングしたさいに、ベリリウムを含
有しないアルミニウム箔に比べて、箔表面に均一
かつ高密度の凹部が生ずる。しかしながら、ベリ
リウムの含有量が0.001%未満では箔の静電容量
を増大させる効果は得られず、0.2%を越えると
腐食減量が多くなる。したがつて、ベリリウムの
含有量を0.001〜0.2%の範囲内で選ぶべきである
が、とくに0.005〜0.05%が好ましい。不純物と
してのケイ素および鉄の合計含有量が0.3%を越
えると、純度が99.7%以上の原料アルミニウムに
銅を0.03〜0.5%、ベリリウムを0.001〜0.2%の範
囲内で含有せしめても、箔の静電容量を増大させ
る効果は得られない。したがつて、不純物として
のケイ素および鉄の合計含有量は0.3%以下にす
べきである。
上記において、アルミニウムの合金箔の静電容
量を増大させるために銅を0.03%以上含有させる
と、この合金箔の製箔工程中スラブを鋳造するさ
いに、スラブに割れが発生することがある。この
割れが発生するということは箔の生産上大きな問
題となる。ところが上記ベリリウムは、スラブの
割れを防止する性質をも有しており、この割れを
ある程度防止しうる。しかしながら、ベリリウム
が上記割れを防止する効果を奏するのは、ベリリ
ウムの含有量が0.02%を越えた場合だけである。
そこで、鋳造のさいスラブに割れが生ずるのを完
全に防止するために、原料としての使用アルミニ
ウムの純度が99.7%以上であつて、銅を0.03〜0.5
%、ベリリウムを0.001〜0.2%含有し、不純物と
してのケイ素および鉄の合計含有量が0.3%以下
であるアルミニウム合金箔にチタンを含有させ
る。上記において、チタンの含有量を限定したの
は、0.002%未満であると、このアルミニウム合
金箔の箔工程中スラブを鋳造するさいに、スラブ
に割れが生ずるのを防止する効果が得られず、
0.05%を越えると箔の静電容量が低下するからで
ある。
上述のように、この発明の電解コンデンサ陰極
用アルミニウム合金箔は、原料としての使用アル
ミニウムの純度が99.7%以上であつて、銅を〜
0.03〜0.5%、ベリリウムを0.001〜0.2%含有し、
不純物としてのケイ素および鉄の合計含有量が
0.3%であるから、このアルミニウム合金箔の静
電容量は従来のものに比べてはるかに増大すると
ともに、腐食減量は少ない。また、ベリリウムの
含有量が0.02〜0.2%である場合には、このアル
ミニウム合金箔の製箔工程中、スラブを鋳造する
さいにスラブに生ずる割れをある程度防止するこ
とができる。またとくに第2の発明においては、
第1の発明の電解コンデンサ陰極用アルミニウム
合金箔に、チタンを0.002〜0.05%の範囲内で含
有せしめることによつて、この合金箔の製箔工程
中、スラブを鋳造するさいにスラブに生ずる割れ
を完全に片止することができ、生産が容易にな
り、生産上好ましい。
つぎにこの発明の実施例を対照例とともに示す
る。
表1に示す8種類の合金箔の製箔工程中スラブ
を鋳造するさいのスラブの割れの有無の観察結
果、ならびに、通常の製箔法によつて箔とした
後、液温60℃の3%塩酸および0.5%シユウ酸水
溶液中に浸漬し、電流密度30A/dm3の光流電流を
通じて1分30秒間エツチングを行なつた場合の静
電容量の測定結果は表2のとおりであつた。
〓〓〓〓
The present invention relates to an aluminum alloy foil for electrolytic capacitor cathodes. In order to improve the performance of electrolytic capacitors,
It is necessary to increase not only the capacitance of the anode foil but also the capacitance of the cathode foil. To increase the capacitance of foil, it is effective to increase the surface area of the foil by etching it, but if there is a lot of corrosion loss during etching, the capacitance of the foil will decrease as a result. do. Therefore, the aluminum alloy foil for an electrolytic capacitor cathode must have a large capacitance and a small loss of corrosion during etching. An object of the present invention is to provide an aluminum alloy foil for an electrolytic capacitor cathode that can satisfy the above conditions. One of the aluminum alloy foils for electrolytic capacitor cathodes of this invention has a purity of 99.7% or more of aluminum used as a raw material, 0.03 to 0.5% of copper, and 0.03 to 0.5% of copper.
An aluminum alloy foil for an electrolytic capacitor cathode according to another invention of the present invention, which is characterized by containing 0.001 to 0.2% beryllium and having a total content of silicon and iron as impurities of 0.3% or less. The purity of the aluminum used as a raw material is 99.7% or more, and it contains 0.03-0.5% copper, 0.01-0.2% beryllium, 0.002-0.05% titanium, and the total content of silicon and iron as impurities. is 0.3% or less. In the above, the reason why the purity of aluminum used as a raw material is set to 99.7% or more is because if the purity is less than 99.7%, the effect of increasing the capacitance of the foil cannot be obtained. Copper has the property of increasing the capacitance of aluminum alloy foil when it is contained in aluminum. In other words, as is well known, the capacitance of foil is proportional to the surface area of the foil, and in order to increase the surface area of the foil, it is necessary to create recesses uniformly and densely on the surface of the foil by etching. . Iron is more noble than aluminum in terms of electrical potential, and has a higher potential than aluminum.
Because of its wide range of solid solution, when it is contained in aluminum, recesses are formed uniformly and densely on the surface of the foil during etching, compared to aluminum foil that does not contain it. However, if the copper content is less than 0.03%, it has no effect on increasing the capacitance of the foil, and if it exceeds 0.5%, etching becomes excessive and the number of depressions on the foil surface increases, while corrosion loss increases, resulting in Specifically, the capacitance decreases. Therefore, the copper content should be set to 0.03~
It should be selected within the range of 0.5%, but especially from 0.1 to
0.3% is preferred. Beryllium also has the property of increasing the capacitance of aluminum alloy foil when it is contained in aluminum.
In other words, since beryllium has a small solid solubility limit,
When it is included in aluminum, it is finely precipitated into the aluminum, so when this aluminum alloy foil is etched, more uniform and denser recesses are produced on the foil surface than with aluminum foil that does not contain beryllium. However, if the beryllium content is less than 0.001%, the effect of increasing the capacitance of the foil cannot be obtained, and if it exceeds 0.2%, the corrosion loss will increase. Therefore, the content of beryllium should be selected within the range of 0.001 to 0.2%, with 0.005 to 0.05% being particularly preferred. If the total content of silicon and iron as impurities exceeds 0.3%, even if the raw aluminum with a purity of 99.7% or more contains copper in the range of 0.03 to 0.5% and beryllium in the range of 0.001 to 0.2%, the foil The effect of increasing capacitance cannot be obtained. Therefore, the total content of silicon and iron as impurities should be below 0.3%. In the above, if the aluminum alloy foil contains 0.03% or more of copper in order to increase the capacitance, cracks may occur in the slab during the casting process of the alloy foil. The occurrence of this cracking poses a major problem in the production of foil. However, beryllium also has the property of preventing slab cracking, and can prevent this cracking to some extent. However, beryllium has the effect of preventing the cracking described above only when the beryllium content exceeds 0.02%.
Therefore, in order to completely prevent cracks from occurring in the slab during casting, the purity of the aluminum used as a raw material is 99.7% or more, and the purity of the copper is 0.03 to 0.5%.
%, beryllium by 0.001 to 0.2%, and the total content of silicon and iron as impurities is 0.3% or less. In the above, the titanium content was limited to less than 0.002% because it is not effective in preventing cracks from occurring in the slab when casting the slab during the foiling process of this aluminum alloy foil.
This is because if it exceeds 0.05%, the capacitance of the foil decreases. As mentioned above, the aluminum alloy foil for electrolytic capacitor cathodes of the present invention has a purity of 99.7% or more of aluminum used as a raw material, and contains copper to
Contains 0.03-0.5%, beryllium 0.001-0.2%,
The total content of silicon and iron as impurities is
Since it is 0.3%, the capacitance of this aluminum alloy foil is much greater than that of conventional foils, and the corrosion loss is small. Moreover, when the content of beryllium is 0.02 to 0.2%, cracks that occur in the slab during casting of the aluminum alloy foil can be prevented to some extent during the process of producing the aluminum alloy foil. In particular, in the second invention,
By containing titanium in the range of 0.002 to 0.05% in the aluminum alloy foil for an electrolytic capacitor cathode of the first invention, cracks that occur in the slab when the slab is cast during the foil manufacturing process of this alloy foil can be prevented. can be completely separated, making production easier and favorable in terms of production. Next, examples of the present invention will be shown together with comparative examples. The observation results of the presence or absence of cracks in the slabs during the foil-making process of the eight types of alloy foils shown in Table 1, as well as the observation results of the presence or absence of cracks in the slabs during the casting process of the eight types of alloy foils shown in Table 1. % hydrochloric acid and 0.5% oxalic acid aqueous solution, and etching was performed for 1 minute and 30 seconds through a photocurrent with a current density of 30 A/dm 3 . The results of capacitance measurements are shown in Table 2. 〓〓〓〓
【表】【table】
【表】
表2から明らかなように、この発明の電解コン
デンサ陰極用アルミニウム合金箔は、対照例に比
べてはるかに静電容量が増大している。とくに第
2の発明の電解コンデンサ陰極用アルミニウム合
金箔は、その製箔工程中スラブを鋳造するさい
に、スラブに割れが生ずるものを完全に防止しう
る。
〓〓〓〓〓
[Table] As is clear from Table 2, the aluminum alloy foil for an electrolytic capacitor cathode of the present invention has a much greater capacitance than the control example. In particular, the aluminum alloy foil for an electrolytic capacitor cathode of the second invention can completely prevent cracks from occurring in the slab when the slab is cast during the foil manufacturing process. 〓〓〓〓〓
Claims (1)
%以上であつて、銅を0.03〜0.5%、ベリリウム
を0.001〜0.2%含有し、不純物としてのケイ素お
よび鉄の合計含有量が0.3%以下である電解コン
デンサ陰極用アルミニウム合金箔。 2 原料としての使用アルミニウムの純度が99.7
%以上であつて、銅を0.03〜0.5%、ベリリウム
を0.001〜0.2%、チタンを0.002〜0.05%含有し、
不純物としてのケイ素および鉄の合計含有量が
0.3%以下である電解コンデンサ陰極用アルミニ
ウム合金箔。[Claims] 1. The purity of aluminum used as a raw material is 99.7.
% or more, contains 0.03 to 0.5% of copper, 0.001 to 0.2% of beryllium, and has a total content of silicon and iron as impurities of 0.3% or less. 2 The purity of aluminum used as raw material is 99.7
% or more, containing 0.03 to 0.5% copper, 0.001 to 0.2% beryllium, and 0.002 to 0.05% titanium,
The total content of silicon and iron as impurities is
Aluminum alloy foil for electrolytic capacitor cathodes with a content of 0.3% or less.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3660979A JPS55128559A (en) | 1979-03-27 | 1979-03-27 | Aluminum alloy foil for electrolytic capacitor cathode |
CH223880A CH645135A5 (en) | 1979-03-27 | 1980-03-21 | ALUMINUM ALLOY FILM FOR USE AS CATHODE FILM IN ELECTROLYTE CAPACITORS AND METHOD FOR THE PRODUCTION THEREOF. |
NL8001666A NL8001666A (en) | 1979-03-27 | 1980-03-21 | FOELIE MADE FROM ALUMINUM ALLOY. |
GB8009890A GB2048940B (en) | 1979-03-27 | 1980-03-24 | Aluminium alloy foil |
IT48269/80A IT1147045B (en) | 1979-03-27 | 1980-03-26 | ALUMINUM ALLOY PLATES FOR ELECTROLYTIC CONDENSER CATHODES |
FR8006729A FR2452773A1 (en) | 1979-03-27 | 1980-03-26 | ALUMINUM ALLOY SHEETS FOR THE MANUFACTURE OF ELECTROLYTIC CAPACITOR CATHODES |
DE3011819A DE3011819C2 (en) | 1979-03-27 | 1980-03-27 | Cathode foil for electrolytic capacitors |
US06/372,928 US4401489A (en) | 1979-03-27 | 1982-04-29 | Aluminum alloy foils for cathodes of electrolytic capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3660979A JPS55128559A (en) | 1979-03-27 | 1979-03-27 | Aluminum alloy foil for electrolytic capacitor cathode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55128559A JPS55128559A (en) | 1980-10-04 |
JPS6135263B2 true JPS6135263B2 (en) | 1986-08-12 |
Family
ID=12474531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3660979A Granted JPS55128559A (en) | 1979-03-27 | 1979-03-27 | Aluminum alloy foil for electrolytic capacitor cathode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55128559A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57126939A (en) * | 1981-01-28 | 1982-08-06 | Showa Alum Corp | Aluminum alloy foil for cathode of electrolytic capacitor |
-
1979
- 1979-03-27 JP JP3660979A patent/JPS55128559A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS55128559A (en) | 1980-10-04 |
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