JPS6131622B2 - - Google Patents
Info
- Publication number
- JPS6131622B2 JPS6131622B2 JP2503080A JP2503080A JPS6131622B2 JP S6131622 B2 JPS6131622 B2 JP S6131622B2 JP 2503080 A JP2503080 A JP 2503080A JP 2503080 A JP2503080 A JP 2503080A JP S6131622 B2 JPS6131622 B2 JP S6131622B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporator
- liquid
- liquid reservoir
- cooling medium
- heat transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000002826 coolant Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 10
- 239000007791 liquid phase Substances 0.000 claims description 8
- 239000012071 phase Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2503080A JPS56122151A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2503080A JPS56122151A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56122151A JPS56122151A (en) | 1981-09-25 |
JPS6131622B2 true JPS6131622B2 (US20020125480A1-20020912-P00900.png) | 1986-07-21 |
Family
ID=12154506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2503080A Granted JPS56122151A (en) | 1980-02-28 | 1980-02-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56122151A (US20020125480A1-20020912-P00900.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62168216U (US20020125480A1-20020912-P00900.png) * | 1986-04-16 | 1987-10-26 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1326237C (zh) * | 2003-09-04 | 2007-07-11 | 珍通科技股份有限公司 | 圆管型散热器结构 |
-
1980
- 1980-02-28 JP JP2503080A patent/JPS56122151A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62168216U (US20020125480A1-20020912-P00900.png) * | 1986-04-16 | 1987-10-26 |
Also Published As
Publication number | Publication date |
---|---|
JPS56122151A (en) | 1981-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4502286A (en) | Constant pressure type boiling cooling system | |
US4036291A (en) | Cooling device for electric device | |
US4330033A (en) | Constant pressure type ebullient cooling equipment | |
US4020399A (en) | Vapor cooling device for dissipating heat of semiconductor elements | |
US4085395A (en) | High voltage transformer package | |
US3852805A (en) | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit | |
US4862321A (en) | Cooling system for heating body | |
US4260014A (en) | Ebullient cooled power devices | |
JPS6131622B2 (US20020125480A1-20020912-P00900.png) | ||
KR850001098B1 (ko) | 비등냉각장치(沸騰冷却裂置) | |
JPS583383B2 (ja) | サイリスタスタツク | |
JPS6127915B2 (US20020125480A1-20020912-P00900.png) | ||
JPH07161888A (ja) | 沸騰冷却装置及びその製造方法 | |
US4593532A (en) | Evaporation-cooled gas insulated electrical apparatus | |
JPS6127914B2 (US20020125480A1-20020912-P00900.png) | ||
KR890002138B1 (ko) | 전기부품의 냉각장치 | |
JPS5941307B2 (ja) | 半導体素子用沸騰冷却装置 | |
JP3173764B2 (ja) | 沸騰冷却装置 | |
JPS6137793B2 (US20020125480A1-20020912-P00900.png) | ||
JPH03283454A (ja) | 半導体冷却装置 | |
JPH0147013B2 (US20020125480A1-20020912-P00900.png) | ||
JP2585479B2 (ja) | 沸騰冷却装置 | |
JPH07106478A (ja) | 沸騰冷却装置及びその製造方法 | |
US3086070A (en) | Mounting for electrical elements | |
SU1534558A1 (ru) | Силовой полупроводниковый блок с испарительным охлаждением |