JPS61296742A - Resin sealed package - Google Patents
Resin sealed packageInfo
- Publication number
- JPS61296742A JPS61296742A JP60137847A JP13784785A JPS61296742A JP S61296742 A JPS61296742 A JP S61296742A JP 60137847 A JP60137847 A JP 60137847A JP 13784785 A JP13784785 A JP 13784785A JP S61296742 A JPS61296742 A JP S61296742A
- Authority
- JP
- Japan
- Prior art keywords
- resin case
- leg
- resin
- fixed
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電装品などにおけるチップ部品、セラミック
厚膜回路部品等をＡｔ線又はＡｕ線など配線してなる電
子装置を保護するための樹脂シールパッケージに関する
ものである。Detailed Description of the Invention (Industrial Application Field) The present invention is directed to a resin for protecting an electronic device in which chip parts, ceramic thick film circuit parts, etc. in electrical equipment, etc. are wired with At wires or Au wires. This relates to sealed packages.
（従来の技術）
従来、電子装置のパッケージには各種のものがあり市販
されている。(Prior Art) Conventionally, there are various types of electronic device packages available on the market.
第４図及び第５図は従来のこの種のパフケージを示す断
面図である。4 and 5 are cross-sectional views showing a conventional puff cage of this type.
まず、従来のメタルハーメチックパッケージについて第
４図を用いて説明する。First, a conventional metal hermetic package will be explained using FIG. 4.
第４図はそのメタルハーメチックパッケージの断面図で
ある。FIG. 4 is a sectional view of the metal hermetic package.
図中、１はメタル基板、２はメタル基板１上に載置され
るセラミック基板であり、これには厚膜混成集積回路が
組み込まれる。３はそのセラミック基板２上に搭載され
るチン部品、例えば、コンデンサ、抵抗、半導体チップ
素子などである。４はＡｌポスト、５は端子、例えば、
３１φ、ＯＮｉ製であり、６は端子５をメタル基板１と
絶縁すると共にメタル基板１に固定するコバールガラス
、７は直径２５０μｍφΦ高純度Ａ２線で、超音波接続
法によりポスト４と端子５とを電気的に結線する。端子
５は複数本設け、例えば、入力端子１本、信号端子２本
、出力端子１本の４本構成とすることができる。８はメ
タルケースであり、そのシール部分８ａはメタル基板１
に電気的エネルギーで高圧溶着される。９はメタル基板
ｌに設けられる固定穴であり、例えば、この固定穴９を
用いて大型装置へネジでもって固定すると共にアースす
る。In the figure, 1 is a metal substrate, and 2 is a ceramic substrate placed on the metal substrate 1, into which a thick film hybrid integrated circuit is incorporated. Reference numeral 3 indicates components mounted on the ceramic substrate 2, such as capacitors, resistors, semiconductor chip elements, etc. 4 is an Al post, 5 is a terminal, for example,
31φ, made of ONi, 6 is Kovar glass that insulates the terminal 5 from the metal substrate 1 and fixes it to the metal substrate 1, 7 is a high purity A2 wire with a diameter of 250 μm, and the post 4 and the terminal 5 are connected by ultrasonic connection method. Connect electrically. A plurality of terminals 5 may be provided, for example, a four-terminal configuration including one input terminal, two signal terminals, and one output terminal. 8 is a metal case, and its seal portion 8a is attached to the metal substrate 1.
are welded at high pressure using electrical energy. Reference numeral 9 denotes a fixing hole provided in the metal substrate 1. For example, the fixing hole 9 is used to fix the device to a large device with a screw and also to ground the device.
次に、従来の樹脂シールパッケージについて第５図を用
いて説明する。第５図はその樹脂シールパッケージの断
面図である。図中、１０はメタル基板１に固定される樹
脂ケース、１１は樹脂ケース上に被着される樹脂カバー
、１２は樹脂ケース１０をメタル基板１に固着するネジ
である。その他のものは第１図に示されたものと同様の
ものであり、ここでは説明を省略する。この図に示され
るように、樹脂ケース１０はネジ１２によってメタル基
板１に螺着され固定される。ネジの本数は２本以上、形
状、大きさに応じて適宜選定することができる。樹脂ケ
ース１１と樹脂カバー１２とは接着剤等で封止固着され
る。また、通常パッケージ内の湿気に対する保護のため
内部にシリコンゲルなどを充填する。Next, a conventional resin seal package will be explained using FIG. 5. FIG. 5 is a sectional view of the resin sealed package. In the figure, 10 is a resin case that is fixed to the metal substrate 1, 11 is a resin cover that is placed on the resin case, and 12 is a screw that fixes the resin case 10 to the metal substrate 1. The other components are the same as those shown in FIG. 1, and their explanation will be omitted here. As shown in this figure, the resin case 10 is screwed and fixed to the metal substrate 1 with screws 12. The number of screws is two or more, and can be appropriately selected depending on the shape and size. The resin case 11 and the resin cover 12 are sealed and fixed with adhesive or the like. Additionally, the inside of the package is usually filled with silicone gel or the like to protect it from moisture.
以上のような構造であるため、主要電子回路部品である
セラミックＨＩＣを外力や塵埃などから気密封止する必
要がある０例えば、自動車などの厳しい外部条件に対し
ても高信頼性を保持する必要があることからパッケージ
の役目は益々重要になってきている。Due to the above structure, it is necessary to hermetically seal the ceramic HIC, which is the main electronic circuit component, from external forces and dust.For example, it is necessary to maintain high reliability even under severe external conditions such as in automobiles. Because of this, the role of packaging is becoming increasingly important.
（発明が解決しようとする問題点）
しかしながら、第４図に示されるメタルハーメチックシ
ールパフケージの場合はコストが高い、特にハーメチッ
クシールを行うには溶接機を必要とし作業性及びコスト
の面で不利である。第５図に示される樹脂シールパッケ
ージの場合は（１）ネジが必要であり、かつ、ネジ留め
のための工数を要する。 （２）ネジ固定部分だけ余計
なスペースを要しコンパクトな設計に不向きである。
（３）ネジ溝部を介して外部から水分が侵入するために
気密設計上不利である。(Problems to be Solved by the Invention) However, the metal hermetic seal puff cage shown in Fig. 4 is expensive, and in particular requires a welding machine to perform hermetic sealing, which is disadvantageous in terms of workability and cost. It is. In the case of the resin seal package shown in FIG. 5, (1) screws are required, and additional man-hours are required for screwing. (2) The screw fixing portion requires extra space, making it unsuitable for compact design.
(3) Moisture enters from the outside through the thread groove, which is disadvantageous in terms of airtight design.
などの問題があった。There were other problems.
（問題点を解決するための手段）
本発明は、上記問題点を解決するために、基板に樹脂ケ
ースを固定する樹脂シールパッケージにおいて、前記樹
脂ケースから前記基板に接する方向に固定脚が突設され
、この固定脚の先端部は前記基板に形成される穴に先太
状に固定されるようにしたものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a resin seal package for fixing a resin case to a board, in which fixing legs are provided that protrude from the resin case in a direction that contacts the board. The tip of the fixing leg is fixed to a hole formed in the substrate in a tapered shape.
（作用）
本発明によれば、樹脂ケースの基板に接する方向には固
定脚が突設され、該固定脚の先端部を基板に設けられる
穴に先太状になるように固定するようにしたので、気密
性が良く、コストが低減され、しかも量産性に優れた樹
脂シールパッケージを得ることができる。(Function) According to the present invention, a fixed leg is provided protruding from the resin case in a direction in contact with the board, and the tip of the fixed leg is fixed in a hole provided in the board so as to have a thick tip. Therefore, it is possible to obtain a resin-sealed package with good airtightness, reduced cost, and excellent mass productivity.
（実施例）
以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は本発明に係る樹脂シールパッケージの断面図で
ある。FIG. 1 is a sectional view of a resin sealed package according to the present invention.
図中、１３は樹脂ケースであり、この樹脂としては、Ｐ
ＢＴ （ポリブチルテレフタレート）、エボシキ、その
他使用条件に合わせて線膨張係数を考慮して自由に選定
することができる。１３ａはその樹脂ケースの固定脚で
あり、樹脂ケース１３をメタル基板１へ強固に固着でき
るような構造となっている。その他の点については既に
説明されているのでここでの説明は省略する。In the figure, 13 is a resin case, and this resin is P
BT (polybutyl terephthalate), eboshiki, and others can be freely selected in consideration of the coefficient of linear expansion according to the usage conditions. Reference numeral 13a denotes a fixed leg of the resin case, which has a structure that allows the resin case 13 to be firmly fixed to the metal substrate 1. Since other points have already been explained, their explanation here will be omitted.
第２図は当該樹脂シールパッケージの樹脂ケースの固定
構造の説明図であり、第３図は第２図（ａ）の固着方法
の説明図である。FIG. 2 is an explanatory diagram of the fixing structure of the resin case of the resin seal package, and FIG. 3 is an explanatory diagram of the fixing method of FIG. 2(a).
まず、第２図（ａ）に示される樹脂ケースの固定方法に
ついて説明すると、第３図（ａ）に示されるように、樹
脂ケース１３の基板に接する方向、つまり、樹脂ケース
の下部には棒状の固定脚１３′を形成しておき、第３図
（ｂ）に示されるように、メタル基板１には固定脚の抜
は止めテーバｌａが形成される穴を設け、この穴に樹脂
ケース１３の固定脚１３′を差し込む、最後に、第３図
（ｃ）に示されるように、樹脂ケース１３を治具で固定
しておき、差し込まれた固定脚１３′の先端部を熱圧着
し、抜は止めテーパ１ａに密着するように固定脚１３′
の先端部を変形させて充填し、先太状の固定脚１３ａを
形成する。First, to explain the method of fixing the resin case shown in FIG. 2(a), as shown in FIG. 3(a), there is a rod-shaped As shown in FIG. 3(b), a hole is provided in the metal substrate 1 in which a taber la is formed to prevent the fixing leg from being removed, and the resin case 13 is inserted into this hole. Finally, as shown in FIG. 3(c), the resin case 13 is fixed with a jig, and the tip of the inserted fixing leg 13' is bonded by thermocompression. Fixing leg 13' so that it comes into close contact with taper 1a to prevent removal.
The distal end portion is deformed and filled to form a thick-tipped fixed leg 13a.
同様に、第２図（ｂ）〜第２図（ｄ）に示されるように
、固定脚１３′の先端部は各種の形状の固定脚１３ｂ〜
１３ｄに構成することができる。Similarly, as shown in FIGS. 2(b) to 2(d), the tip of the fixed leg 13' has various shapes of the fixed legs 13b to 13'.
13d.
上記した樹脂ケースの固定方法は２工程製造法であるが
、１工程製造法によることもできる。即ち、モールド金
型に端子５とメタル基板１をセントしておき、１回の射
出成形によって樹脂ケース１３及び先太形状の固定脚１
３ａ乃至１３ｄを形成し、製造を完了させるようにする
ことができる。この製造方法によると、ケースモールド
と該ケースのメタル基板への固定を１回の工程で済ます
ことができる。Although the resin case fixing method described above is a two-step manufacturing method, a one-step manufacturing method may also be used. That is, the terminal 5 and the metal board 1 are placed in a mold, and the resin case 13 and the fixed leg 1 having a thick tip are formed by one injection molding.
3a to 13d can be formed to complete the manufacturing. According to this manufacturing method, the case mold and the fixing of the case to the metal substrate can be completed in one process.
このような構成をとることにより、大幅な自動化を図る
ことができ大量生産向きである。By adopting such a configuration, a large degree of automation can be achieved and it is suitable for mass production.
なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づき種々の変形が可能であり、これら
を本発明の範囲から排除するものではない。Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果）
以上、詳細に説明したように本発明によれば、基板に樹
脂ケースを固定する樹脂シールパッケージにおいて、前
記樹脂ケースから前記基板に接する方向に固定脚が突設
され、該固定脚の先端部が前記基板に形成される穴に先
太状に固定されるようにしたので、
（１）従来のようにネジは必要でなくなり、部品コスト
、工数を減少させることができる。(Effects of the Invention) As described in detail above, according to the present invention, in a resin seal package for fixing a resin case to a board, a fixing leg is provided protruding from the resin case in a direction in contact with the board, and Since the tips of the legs are fixed to the holes formed in the board in a tapered manner, (1) screws are no longer required as in the conventional case, and parts costs and man-hours can be reduced.
（２）ネジ溝などの吸水路をなくすことができ、品質の
安定化を図ることができる。(2) Suction channels such as screw grooves can be eliminated, and quality can be stabilized.
（３）固定脚の本数が多くても一回の処理によって加工
することができる。(3) Even if there are many fixed legs, they can be processed in one process.
このように、従来のものに比べて極めて構造が簡単にな
るばかりでなく気密性、経済性、量産性のそれぞれの面
で優れ、特にチップオンボード化し小形化する場合に有
利であり、本発明によってもたらされる効果は顕著であ
る。As described above, the structure is not only extremely simple compared to the conventional one, but also superior in terms of airtightness, economy, and mass production, and is particularly advantageous when miniaturizing by chip-on-board. The effect brought about by this is remarkable.
第１図は本発明に係る樹脂シールパッケージの断面図、
第２図は樹脂シールパッケージの樹脂ケースの固着構造
の説明図、第３図は同樹脂ケースの固着方法の説明図、
第４図は従来のメタルハーメチックシールパッケージの
断面図、第５図は従来の樹脂シールパッケージの断面図
である。
１・・・メタル基板、２・・・セラミック基板、３・・
・チップ部品、４・・・ＡＩ！ポスト、５・・・端子、
７・・・ＡＪ線、９・・・固定穴、１１・・・樹脂カバ
ー、１３・・・樹脂ケース、１３ ’−・・固定脚、１
３ａ、 １３ｂ、 １３ｃ、 １３ｄ・−・先太状の固
定脚。FIG. 1 is a sectional view of a resin sealed package according to the present invention;
Fig. 2 is an explanatory diagram of the fixing structure of the resin case of the resin seal package, Fig. 3 is an explanatory diagram of the fixing method of the resin case,
FIG. 4 is a cross-sectional view of a conventional metal hermetic seal package, and FIG. 5 is a cross-sectional view of a conventional resin seal package. 1... Metal substrate, 2... Ceramic substrate, 3...
・Chip parts, 4...AI! Post, 5...terminal,
7...AJ line, 9...fixing hole, 11...resin cover, 13...resin case, 13'-...fixing leg, 1
3a, 13b, 13c, 13d --- Thick tipped fixed legs.
Claims (1)
いて、前記樹脂ケースから前記基板に接する方向に固定
脚が突設され、該固定脚の先端部は前記基板に形成され
る穴に先太状に固定されるようにしたことを特徴とする
樹脂シールパッケージ。In a resin seal package for fixing a resin case to a substrate, a fixing leg is provided protruding from the resin case in a direction in contact with the substrate, and a tip end of the fixing leg is fixed in a hole formed in the substrate in a tapered shape. A resin-sealed package characterized by being designed to
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60137847A JPS61296742A (en) | 1985-06-26 | 1985-06-26 | Resin sealed package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60137847A JPS61296742A (en) | 1985-06-26 | 1985-06-26 | Resin sealed package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61296742A true JPS61296742A (en) | 1986-12-27 |
Family
ID=15208197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60137847A Pending JPS61296742A (en) | 1985-06-26 | 1985-06-26 | Resin sealed package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61296742A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124097A (en) * | 2006-11-09 | 2008-05-29 | Shinko Electric Ind Co Ltd | Package for semiconductor device and method for manufacturing the same |
| JP2011029523A (en) * | 2009-07-29 | 2011-02-10 | Kyocera Corp | Package for electronic component storage, and electronic device |
| CN103378011A (en) * | 2012-04-12 | 2013-10-30 | 新科实业有限公司 | Optoelectronic package and method for making same |
-
1985
- 1985-06-26 JP JP60137847A patent/JPS61296742A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124097A (en) * | 2006-11-09 | 2008-05-29 | Shinko Electric Ind Co Ltd | Package for semiconductor device and method for manufacturing the same |
| JP2011029523A (en) * | 2009-07-29 | 2011-02-10 | Kyocera Corp | Package for electronic component storage, and electronic device |
| CN103378011A (en) * | 2012-04-12 | 2013-10-30 | 新科实业有限公司 | Optoelectronic package and method for making same |
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