JPS6129542B2 - - Google Patents

Info

Publication number
JPS6129542B2
JPS6129542B2 JP55029730A JP2973080A JPS6129542B2 JP S6129542 B2 JPS6129542 B2 JP S6129542B2 JP 55029730 A JP55029730 A JP 55029730A JP 2973080 A JP2973080 A JP 2973080A JP S6129542 B2 JPS6129542 B2 JP S6129542B2
Authority
JP
Japan
Prior art keywords
diode
beam lead
mounting member
electrode
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55029730A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55125656A (en
Inventor
Buradofuoodo Suno Fuiritsupu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of JPS55125656A publication Critical patent/JPS55125656A/ja
Publication of JPS6129542B2 publication Critical patent/JPS6129542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/005—Diode mounting means

Landscapes

  • Waveguide Connection Structure (AREA)
JP2973080A 1979-03-09 1980-03-07 Diode structure Granted JPS55125656A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/018,961 US4246556A (en) 1979-03-09 1979-03-09 Low parasitic shunt diode package

Publications (2)

Publication Number Publication Date
JPS55125656A JPS55125656A (en) 1980-09-27
JPS6129542B2 true JPS6129542B2 (cg-RX-API-DMAC7.html) 1986-07-07

Family

ID=21790648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2973080A Granted JPS55125656A (en) 1979-03-09 1980-03-07 Diode structure

Country Status (2)

Country Link
US (1) US4246556A (cg-RX-API-DMAC7.html)
JP (1) JPS55125656A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142360A (ja) 1984-12-14 1986-06-30 Honda Motor Co Ltd 電子制御式燃料噴射装置における電子制御ユニツトの入、出力信号チエツカ
CN105680120B (zh) * 2016-01-27 2018-04-13 西安电子工程研究所 一种impatt二极管夹持紧固装置
WO2019090298A1 (en) 2017-11-06 2019-05-09 Avx Corporation Emi feedthrough filter terminal assembly containing a laminated insulative seal

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668551A (en) * 1969-11-04 1972-06-06 Mitsubishi Electric Corp Solid state microwave oscillator with ceramic capacitance temperature compensating element
JPS4835043U (cg-RX-API-DMAC7.html) * 1971-09-02 1973-04-26
US3896543A (en) * 1972-05-15 1975-07-29 Secr Defence Brit Semiconductor device encapsulation packages and arrangements and methods of forming the same
US3916350A (en) * 1974-03-27 1975-10-28 Bell Telephone Labor Inc Packaged impatt or other microwave device with means for avoiding terminal impedance degradation

Also Published As

Publication number Publication date
US4246556A (en) 1981-01-20
JPS55125656A (en) 1980-09-27

Similar Documents

Publication Publication Date Title
US5075759A (en) Surface mounting semiconductor device and method
CA2336936A1 (en) A capsule for semiconductor components
US6249046B1 (en) Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device
US4361720A (en) Low thermal resistance insulating support and base or box for power component incorporating such a support
US5063434A (en) Plastic molded type power semiconductor device
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
US5889319A (en) RF power package with a dual ground
KR100262711B1 (ko) 고주파 증폭기
JP2003007910A (ja) 半導体装置
US4992851A (en) Characteristic impedance-correct chip carrier for microwave semiconductor components
US4950427A (en) Transistor device
JPS59143406A (ja) 混成マイクロ波サブシステム
JPS6129542B2 (cg-RX-API-DMAC7.html)
US3058041A (en) Electrical cooling devices
US4566027A (en) Pre-matched module for an ultra-high frequency diode with high heat dissipation
JPH0114721B2 (cg-RX-API-DMAC7.html)
US3486082A (en) Semiconductor devices
US6016085A (en) Flat cable load
JP4127589B2 (ja) 高周波半導体装置用パッケージおよび高周波半導体装置
JP2000323907A (ja) マイクロ波ｉｃ接続線路
JPS6240438Y2 (cg-RX-API-DMAC7.html)
JP3586867B2 (ja) 半導体装置、その製造方法及びその実装方法並びにこれを実装した回路基板
JP2002367961A (ja) 熱伝導性ブッシングを有する高周波電力プローブヘッド
JP3013809B2 (ja) 半導体装置およびその製造方法
EP0131004A1 (en) Microwave packages