JPS6129383B2 - - Google Patents
Info
- Publication number
- JPS6129383B2 JPS6129383B2 JP53031554A JP3155478A JPS6129383B2 JP S6129383 B2 JPS6129383 B2 JP S6129383B2 JP 53031554 A JP53031554 A JP 53031554A JP 3155478 A JP3155478 A JP 3155478A JP S6129383 B2 JPS6129383 B2 JP S6129383B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin
- item
- plating according
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims description 47
- 238000007747 plating Methods 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 239000011342 resin composition Substances 0.000 claims description 25
- 238000011282 treatment Methods 0.000 claims description 16
- 239000006229 carbon black Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 5
- 238000006386 neutralization reaction Methods 0.000 claims description 5
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- 229930182556 Polyacetal Natural products 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920003244 diene elastomer Polymers 0.000 claims description 4
- 239000000113 methacrylic resin Substances 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- STSRVFAXSLNLLI-UHFFFAOYSA-N penta-2,4-dienenitrile Chemical compound C=CC=CC#N STSRVFAXSLNLLI-UHFFFAOYSA-N 0.000 claims description 4
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims description 4
- 239000004431 polycarbonate resin Substances 0.000 claims description 4
- 229920013716 polyethylene resin Polymers 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920005990 polystyrene resin Polymers 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 claims 1
- 241000872198 Serjania polyphylla Species 0.000 claims 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、エツチング又はエツチング―中和処
理を施した後、直接電気メツキを施すことができ
るメツキ用熱可塑性樹脂組成物に関するものであ
る。
プラスチツクは金属材料に比べて軽量、耐薬品
性および耐蝕性に優れる、さらに、能率よく成形
加工ができるなどの優れた性能をもつており、従
来金属が使用されているところに逐次代替されつ
つある。
しかし、これらプラスチツクは不導体であり、
直接電気メツキを行うことができず、下記に示す
如く、複雑で不経済な前処理工程を必要とする。
The present invention relates to a thermoplastic resin composition for plating that can be directly electroplated after being subjected to etching or etching-neutralization treatment. Plastics are lighter than metal materials, have superior chemical and corrosion resistance, and have superior properties such as being able to be molded more efficiently, and are gradually being replaced in places where metals have traditionally been used. . However, these plastics are nonconductors,
Direct electroplating is not possible and requires complex and uneconomical pretreatment steps, as described below.
【表】
以上のように多く、複雑で、しかも、薬品管理
の困難な各処理工程を必要とするプラスチツクメ
ツキは金属のメツキに比較すれば、各処理工程よ
りの廃液等による公害、工程の複雑さによる製品
の品質のバラツキおよび経費上昇等の問題が多
い。
本発明者らは、従来のメツキ方法と比べより簡
単で経済面で有利な方法にてメツキを行うことが
できるメツキ用熱可塑性樹脂組成物について鋭意
研究した結果、本発明に達したものである。
本発明は、従来のメツキ用熱可塑性樹脂組成物
に対しては必要不可欠であつた、キヤタリスト
（センシタイジング）、アクセレーター（アクチベ
ーテイング）および無電解メツキの各処理工程を
不要とし、エツチング又はエツチング―中和処理
後、直接電気メツキを施すことができるメツキ用
熱可塑性樹脂組成物に関するものである。
すなわち本発明は、一種又は二種以上の熱可塑
性樹脂(A)100重量部と、吸油量200ml（DBP）／
100ｇ以上であり、かつ表面積が窒素吸着法で500
m2／ｇ以上であるカーボンブラツク（ただし、水
蒸気酸化処理または炭酸ガス酸化処理を施したカ
ーボンブラツクならびに炭化水素を水蒸気および
酸素と接触させ部分酸化し、さらに酸化処理を施
したカーボンブラツクを除く。）(B)３〜100重量部
よりなり、さらに、体積固有抵抗値が103Ω・cm
以下であり、少なくともキヤタリスト（センシタ
イジング）、アクセレーター（アクチベーテイン
グ）および無電解メツキの各処理を施すことな
く、直接電気メツキを施すことができることを特
徴とするメツキ用熱可塑性樹脂組成物である。
さらに詳しく本発明につにて説明すると、本発
明で用いられる熱可塑性樹脂は、シアン化ビニ
ル、芳香族ビニルおよび共役ジエン系ゴムからな
る共重合体（ABS樹脂）、ポリプロピレン樹脂、
塩化ビニル樹脂、ポリスチレン樹脂、ポリカーボ
ネート樹脂、メタクリル樹脂、ポリスルホン樹
脂、ポリエステル樹脂、ポリアセタール樹脂、ポ
リアミド樹脂、AS（芳香族ビニル―シアン化ビ
ニル）樹脂、ポリフエニレンオキサイド樹脂およ
びEVA（エチレン―酢酸ビニル）樹脂、ポリエ
チレン樹脂等であり、一種又は二種以上で用いる
ことができる。
二種以上の場合には、ポリフエニレンオキサイ
ド樹脂とポリスチレン樹脂との混合、ポリプロピ
レン樹脂とポリエチレン樹脂との混合、さらに
は、シアン化ビニル、芳香族ビニルおよび共役ジ
エン系ゴムからなる共重合体と、塩化ビニル樹
脂、ポリカーボネート樹脂、メタクリル樹脂、ポ
リスルホン樹脂、ポリアセタール樹脂、芳香族ビ
ニル―シアン化ビニル樹脂およびポリフエニレン
オキサイド樹脂からなる群より選ばれた一種又は
二種以上の樹脂との混合等が挙げられる。
又、滑材、酸化防止剤、可塑剤、充填剤等の通
常の助剤を添加してもよい。
本発明で用いられるカーボンブラツク(B)は、吸
油量が200ml／100ｇ以上であり、かつ表面積が
500m2／ｇ以上であることが必要である。この範
囲外のカーボンブラツクでは、いずれの熱可塑性
樹脂と用いても、キヤタリスト〜無電解メツキの
処理を施さずして直接電気メツキ処理すると電着
被膜が出来ずメツキ製品は得られない。
熱可塑性樹脂(A)100重量部に対するカーボンブ
ラツク(B)の量は３〜100重量部であり、３重量部
以下では、吸油量200ml／100ｇ以上であり、か
つ、表面積500m2／ｇ以上のカーボンブラツクで
あつても電着被膜が出来ない。又、100重量部以
上では成形品の物性が著しく劣り、実用に供しえ
ないものである。さらに好ましくは、５〜70重量
部であり、最も好ましくは８〜25重量部である。
なお、吸油量とは、JIS Ｋ−6221−1795に準じ
て測定された値を意味し、アブソープトメーター
により測定されたDBP（ジブチルフタレート）量
をml／100ｇの単位で示される。
表面積とは、ASTM Ｄ 3037−73に準じて測
定された値であり、m2/ｇの単位で示される。カ
ーボンブラツク(B)の吸油量が200ml／100ｇ未満又
は表面積が500m2/ｇ未満であれば満足な電着被膜
を有する製品が得られない。
本発明では組成物の体積固有抵抗値が103Ω・
cm以下でなくてはならない。103Ω・cmを超える
と満足な電着被膜を有する製品が得られない。さ
らに好ましくは102Ω・cm以下である。
なお、体積固有抵抗値とはBritish Standard
2044（Method2）に準じて測定された値を意味す
る。
本発明によれば、エツチング又はエツチング―
中和処理後直接電気メツキを施すことができるた
め、従来のメツキ製品の製造方法では必要不可欠
であつたキヤタリスト〜無電解メツキ処理を略す
ることができる。
よつて、各処理で必要とされている処理液を全
く必要とせず、試薬の経費が大幅に節減できるば
かりでなく、廃液処理に用する費用も全くかから
ない。従来の処理工程と比べ簡単であるため処理
液の管理が容易となり、生産量の増大が計られ
る。
以下に実施例を挙げて説明するが、本発明はこ
れらによつて何ら制限されるものではない。
実施例 １
熱可塑性樹脂およびカーボンブラツクを表１−
〜に示す割合で、バンバリーミキサーにて
200℃、８分間混練し、各種組成物を得た。
その後、組成物より70mm×140mm×２mmの平板
を組成物１種当り10枚成形し、５枚を無水クロム
酸30ｇ／、濃硫酸500ml／のエツチング液に
よるエツチング処理（75℃×10分）、残る５枚を
エツチング処理後さらに奥野製薬社製Ｄ−25中和
剤による中和処理し、その直後、硫酸銅200ｇ／
、硫酸50ｇ／の電気銅メツキ浴で1A／dm2
の電流密度によるストライクメツキを行い、次い
で3.5A／dm2に電流密度を上げ本メツキを行つ
た。[Table] Compared to metal plating, plastic plating, which requires many, complex, and difficult-to-manage processing steps, is more likely to cause pollution due to waste liquid from each processing step, and is more complex. There are many problems such as variations in product quality and increased costs. The present inventors have arrived at the present invention as a result of intensive research into a thermoplastic resin composition for plating that allows plating to be performed in a simpler and more economically advantageous method than conventional plating methods. . The present invention eliminates the need for catalyst (sensitizing), accelerator (activating), and electroless plating processing steps that were indispensable for conventional thermoplastic resin compositions for plating, and eliminates the need for etching. Alternatively, the present invention relates to a thermoplastic resin composition for plating that can be directly electroplated after etching-neutralization treatment. That is, the present invention comprises 100 parts by weight of one or more thermoplastic resins (A) and 200 ml of oil absorption (DBP)/
100g or more, and the surface area is 500g by nitrogen adsorption method.
m 2 /g or more (excluding carbon black that has been subjected to steam oxidation treatment or carbon dioxide gas oxidation treatment, and carbon black that has been partially oxidized by contacting hydrocarbons with steam and oxygen, and then further oxidized. ) (B) 3 to 100 parts by weight, and has a volume resistivity of 10 3 Ω・cm
A thermoplastic resin composition for plating, which is as follows and can be directly electroplated without undergoing at least catalyst (sensitizing), accelerator (activating), and electroless plating treatments. It is. To explain the present invention in more detail, the thermoplastic resin used in the present invention is a copolymer (ABS resin) consisting of vinyl cyanide, aromatic vinyl, and conjugated diene rubber, polypropylene resin,
Vinyl chloride resin, polystyrene resin, polycarbonate resin, methacrylic resin, polysulfone resin, polyester resin, polyacetal resin, polyamide resin, AS (aromatic vinyl-vinyl cyanide) resin, polyphenylene oxide resin, and EVA (ethylene-vinyl acetate) They are resins, polyethylene resins, etc., and can be used alone or in combination of two or more. In the case of two or more types, a mixture of polyphenylene oxide resin and polystyrene resin, a mixture of polypropylene resin and polyethylene resin, and a copolymer consisting of vinyl cyanide, aromatic vinyl, and conjugated diene rubber can be used. , a mixture with one or more resins selected from the group consisting of vinyl chloride resin, polycarbonate resin, methacrylic resin, polysulfone resin, polyacetal resin, aromatic vinyl-vinyl cyanide resin, and polyphenylene oxide resin, etc. Can be mentioned. Further, usual auxiliary agents such as lubricants, antioxidants, plasticizers, fillers, etc. may be added. The carbon black (B) used in the present invention has an oil absorption of 200ml/100g or more and a surface area of
It is necessary that it is 500m 2 /g or more. If carbon black outside this range is used with any thermoplastic resin, direct electroplating without catalyst to electroless plating will not produce an electrodeposited film and a plated product will not be obtained. The amount of carbon black (B) relative to 100 parts by weight of the thermoplastic resin (A) is 3 to 100 parts by weight, and if it is less than 3 parts by weight, it has an oil absorption of 200 ml/100 g or more and a surface area of 500 m 2 /g or more. Even with carbon black, an electrodeposited film cannot be formed. Moreover, if the amount exceeds 100 parts by weight, the physical properties of the molded product will be extremely poor, making it impossible to put it into practical use. More preferably, it is 5 to 70 parts by weight, most preferably 8 to 25 parts by weight. Note that the oil absorption amount means a value measured according to JIS K-6221-1795, and is the amount of DBP (dibutyl phthalate) measured by an absorptometer in units of ml/100g. The surface area is a value measured according to ASTM D 3037-73, and is expressed in units of m 2 /g. If the oil absorption amount of carbon black (B) is less than 200 ml/100 g or the surface area is less than 500 m 2 /g, a product with a satisfactory electrodeposited film cannot be obtained. In the present invention, the volume resistivity of the composition is 10 3 Ω・
Must be less than cm. If it exceeds 10 3 Ω·cm, a product with a satisfactory electrodeposited film cannot be obtained. More preferably, it is 10 2 Ω·cm or less. The volume resistivity value is based on the British Standard
2044 (Method 2). According to the invention, etching or etching
Since electroplating can be performed directly after the neutralization treatment, it is possible to omit the catalyst and electroless plating processes that were indispensable in the conventional manufacturing method of plated products. Therefore, the treatment liquid required for each treatment is not required at all, and not only the cost of reagents can be greatly reduced, but also the cost of waste liquid treatment is completely eliminated. Since it is simpler than conventional treatment processes, it is easier to manage the treatment liquid and increase production. Examples will be described below, but the present invention is not limited thereto. Example 1 Thermoplastic resin and carbon black are shown in Table 1-
in a Banbury mixer in the proportions shown in
Various compositions were obtained by kneading at 200°C for 8 minutes. Thereafter, 10 flat plates of 70 mm x 140 mm x 2 mm were formed from each composition, and 5 plates were etched with an etching solution containing 30 g of chromic anhydride and 500 ml of concentrated sulfuric acid (75°C x 10 minutes). After etching the remaining five sheets, they were further neutralized with D-25 neutralizer manufactured by Okuno Pharmaceutical Co., Ltd., and immediately after that, copper sulfate 200g/
, 1A/dm 2 in electrolytic copper plating bath with 50g/sulfuric acid
Strike plating was performed at a current density of 3.5 A/dm 2 , and then main plating was performed at a current density of 3.5 A/dm 2 .
【表】【table】
【表】
実施例 ２
表−２および表−３に示す様に各種の熱可塑性
樹脂組成物とカーボンブラツクを実施例１と同様
に混練し、平板を成形した。
それら平板は、実施例１と同様にエツチング処
理およびエツチング―中和処理後直接ストライク
メツキおよび本メツキが施された。[Table] Example 2 As shown in Tables 2 and 3, various thermoplastic resin compositions and carbon black were kneaded in the same manner as in Example 1, and flat plates were molded. These flat plates were subjected to direct strike plating and main plating after etching treatment and etching-neutralization treatment in the same manner as in Example 1.
【表】【table】
【表】【table】
Claims (1)
部と、吸油量200ml（DBP）／100ｇ以上であり、
かつ表面積が窒素吸着法で500m2／ｇ以上である
カーボンブラツク（ただし、水蒸気酸化処理また
は炭酸ガス酸化処理を施したカーボンブラツクな
らびに炭化水素を水蒸気および酸素と接触させ部
分酸化し、さらに酸化処理を施したカーボンブラ
ツクを除く。）(B)３〜100重量部よりなり、さら
に、体積固有抵抗値が103Ω・cm以下であり、エ
ツチング又はエツチング―中和処理後、直接電気
メツキを施すことができることを特徴とするメツ
キ用熱可塑性樹脂組成物。 ２ 熱可塑性樹脂がシアン化ビニル、芳香族ビニ
ルおよび共役ジエン系ゴムからなる共重合体であ
る前記第１項記載のメツキ用熱可塑性樹脂組成
物。 ３ 熱可塑性樹脂がポリプロピレン樹脂である前
記第１項記載のメツキ用熱可塑性樹脂組成物。 ４ 熱可塑性樹脂が塩化ビニル樹脂である前記第
１項記載のメツキ用熱可塑性樹脂組成物。 ５ 熱可塑性樹脂がポリスチレン樹脂である前記
第１項記載のメツキ用熱可塑性樹脂組成物。 ６ 熱可塑性樹脂がポリカーボネート樹脂である
前記第１項記載のメツキ用熱可塑性樹脂組成物。 ７ 熱可塑性樹脂がメタクリル樹脂である前記第
１項記載のメツキ用熱可塑性樹脂組成物。 ８ 熱可塑性樹脂がポリスルホン樹脂である前記
第１項記載のメツキ用熱可塑性樹脂組成物。 ９ 熱可塑性樹脂がポリアセタール樹脂である前
記第１項記載のメツキ用熱可塑性樹脂組成物。 １０ 熱可塑性樹脂がポリアミド樹脂である前記
第１項記載のメツキ用熱可塑性樹脂組成物。 １１ 熱可塑性樹脂が芳香族ビニル―シアン化ビ
ニル樹脂である前記第１項記載のメツキ用熱可塑
性樹脂組成物。 １２ 熱可塑性樹脂がポリフエニレンオキサイド
樹脂である前記第１項記載のメツキ用熱可塑性樹
脂組成物。 １３ 熱可塑性樹脂がエチレン―酢酸ビニル樹脂
である前記第１項記載のメツキ用熱可塑性樹脂組
成物。 １４ 熱可塑性樹脂がポリエチレン樹脂である前
記第１項記載のメツキ用熱可塑性樹脂組成物。 １５ 熱可塑性樹脂がポリフエニレンオキサイド
樹脂とポリスチレン樹脂とを混合した樹脂である
前記第１項記載のメツキ用熱可塑性樹脂組成物。 １６ 熱可塑性樹脂がポリプロピレン樹脂とポリ
エチレン樹脂とを混合した樹脂である前記第１項
記載のメツキ用熱可塑性樹脂組成物。 １７ 熱可塑性樹脂がシアン化ビニル、芳香族ビ
ニルおよび共役ジエン系ゴムからなる共重合体
と、塩化ビニル樹脂、ポリカーボネート樹脂、メ
タクリル樹脂、ポリスルホン樹脂、ポリアセター
ル樹脂、芳香族ビニル―シアン化ビニル樹脂およ
びポリフエニレンオキサイド樹脂からなる群より
選ばれた一種又は二種以上の樹脂とを混合した樹
脂である前記第１項記載のメツキ用熱可塑性樹脂
組成物。 １８ カーボンブラツク(B)が５〜70重量部である
前記第２〜１７項記載のメツキ用熱可塑性樹脂組
成物。 １９ 体積固有抵抗値が102Ω・cm以下である前
記第１８項記載のメツキ用熱可塑性樹脂組成物。[Claims] 1. 100 parts by weight of one or more thermoplastic resins (A) and an oil absorption of 200 ml (DBP)/100 g or more,
and carbon black with a surface area of 500 m 2 /g or more by nitrogen adsorption method (however, carbon black that has been subjected to steam oxidation treatment or carbon dioxide gas oxidation treatment, and hydrocarbons that are partially oxidized by contacting with steam and oxygen, and then further oxidized) (Excluding the applied carbon black.) (B) Consists of 3 to 100 parts by weight, and has a volume resistivity of 10 3 Ω・cm or less, and must be electroplated directly after etching or etching-neutralization treatment. 1. A thermoplastic resin composition for plating, which is characterized by being capable of: 2. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a copolymer consisting of vinyl cyanide, aromatic vinyl, and conjugated diene rubber. 3. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polypropylene resin. 4. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a vinyl chloride resin. 5. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polystyrene resin. 6. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polycarbonate resin. 7. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a methacrylic resin. 8. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polysulfone resin. 9. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polyacetal resin. 10. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polyamide resin. 11. The thermoplastic resin composition for plating as described in item 1 above, wherein the thermoplastic resin is an aromatic vinyl-vinyl cyanide resin. 12. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polyphenylene oxide resin. 13. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is an ethylene-vinyl acetate resin. 14. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a polyethylene resin. 15. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a mixture of polyphenylene oxide resin and polystyrene resin. 16. The thermoplastic resin composition for plating according to item 1 above, wherein the thermoplastic resin is a mixture of polypropylene resin and polyethylene resin. 17 Thermoplastic resin is a copolymer consisting of vinyl cyanide, vinyl aromatic and conjugated diene rubber, vinyl chloride resin, polycarbonate resin, methacrylic resin, polysulfone resin, polyacetal resin, aromatic vinyl-vinyl cyanide resin and poly The thermoplastic resin composition for plating according to the above item 1, which is a resin mixed with one or more resins selected from the group consisting of phenylene oxide resins. 18. The thermoplastic resin composition for plating according to items 2 to 17 above, wherein the carbon black (B) is 5 to 70 parts by weight. 19. The thermoplastic resin composition for plating according to item 18 above, which has a volume resistivity of 10 2 Ω·cm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155478A JPS54123157A (en) | 1978-03-17 | 1978-03-17 | Platable thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155478A JPS54123157A (en) | 1978-03-17 | 1978-03-17 | Platable thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54123157A JPS54123157A (en) | 1979-09-25 |
| JPS6129383B2 true JPS6129383B2 (en) | 1986-07-07 |
Family
ID=12334396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3155478A Granted JPS54123157A (en) | 1978-03-17 | 1978-03-17 | Platable thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54123157A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0626123B2 (en) * | 1984-03-07 | 1994-04-06 | 株式会社明電舍 | Conductive resin composition for secondary battery electrode |
| CN111117064B (en) * | 2019-12-23 | 2021-11-12 | 金发科技股份有限公司 | Polypropylene composite material and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112952A (en) * | 1978-02-22 | 1979-09-04 | Mitsubishi Chem Ind Ltd | Synthetic resin and carbon black composition |
| JPS54113640A (en) * | 1978-02-24 | 1979-09-05 | Mitsubishi Chem Ind Ltd | Preparation of electrically-conductive synthetic resin composition |
-
1978
- 1978-03-17 JP JP3155478A patent/JPS54123157A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112952A (en) * | 1978-02-22 | 1979-09-04 | Mitsubishi Chem Ind Ltd | Synthetic resin and carbon black composition |
| JPS54113640A (en) * | 1978-02-24 | 1979-09-05 | Mitsubishi Chem Ind Ltd | Preparation of electrically-conductive synthetic resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54123157A (en) | 1979-09-25 |
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