JPS61292392A - セラミツク配線基板の製造方法 - Google Patents
セラミツク配線基板の製造方法Info
- Publication number
- JPS61292392A JPS61292392A JP60134546A JP13454685A JPS61292392A JP S61292392 A JPS61292392 A JP S61292392A JP 60134546 A JP60134546 A JP 60134546A JP 13454685 A JP13454685 A JP 13454685A JP S61292392 A JPS61292392 A JP S61292392A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- ceramic wiring
- green sheet
- temperature
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000000034 method Methods 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 239000002241 glass-ceramic Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 19
- 238000010304 firing Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 229910044991 metal oxide Inorganic materials 0.000 description 10
- 150000004706 metal oxides Chemical class 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 239000010953 base metal Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000011946 reduction process Methods 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 Cu →Cub) Chemical class 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134546A JPS61292392A (ja) | 1985-06-20 | 1985-06-20 | セラミツク配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134546A JPS61292392A (ja) | 1985-06-20 | 1985-06-20 | セラミツク配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61292392A true JPS61292392A (ja) | 1986-12-23 |
| JPH0588557B2 JPH0588557B2 (enrdf_load_stackoverflow) | 1993-12-22 |
Family
ID=15130843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60134546A Granted JPS61292392A (ja) | 1985-06-20 | 1985-06-20 | セラミツク配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292392A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01238191A (ja) * | 1988-01-22 | 1989-09-22 | Pechiney Rech Group Interet Economique | 銅若しくは銅ベース合金の導体とその菫青石セラミック基板との同時焼結方法 |
| JP2016204247A (ja) * | 2015-04-16 | 2016-12-08 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | セラミックパッケージのための絶縁体組成物及びその製造方法 |
| JP2017218368A (ja) * | 2016-06-07 | 2017-12-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 絶縁体組成物及びこれを用いた電子部品の製造方法 |
-
1985
- 1985-06-20 JP JP60134546A patent/JPS61292392A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01238191A (ja) * | 1988-01-22 | 1989-09-22 | Pechiney Rech Group Interet Economique | 銅若しくは銅ベース合金の導体とその菫青石セラミック基板との同時焼結方法 |
| JP2016204247A (ja) * | 2015-04-16 | 2016-12-08 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | セラミックパッケージのための絶縁体組成物及びその製造方法 |
| JP2017218368A (ja) * | 2016-06-07 | 2017-12-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 絶縁体組成物及びこれを用いた電子部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0588557B2 (enrdf_load_stackoverflow) | 1993-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |