JPS61292349A - Package for photosemiconductor - Google Patents
Package for photosemiconductorInfo
- Publication number
- JPS61292349A JPS61292349A JP13476185A JP13476185A JPS61292349A JP S61292349 A JPS61292349 A JP S61292349A JP 13476185 A JP13476185 A JP 13476185A JP 13476185 A JP13476185 A JP 13476185A JP S61292349 A JPS61292349 A JP S61292349A
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- leads
- base
- bonding
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は多数のリード線が金属製基体に設けられた穴に
ガラス封着されてなる光半導体用パッケージの構造に関
するもので、％にプーアルライン型半導体レーザモジ−
−ル用のパッケージに関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to the structure of an optical semiconductor package in which a large number of lead wires are glass-sealed into holes provided in a metal base. Line type semiconductor laser module
- Concerning packages for tools.
従来、この種のパッケージは、外囲器となる箱型の金属
基体に、金属リード線がガラス封着して取り付けられ、
半導体レーザ素子、モニタ光検出用受光素子するいはペ
ルチェ冷却素子への通電電流上制御する為のサーミスタ
素子の電極が、金属リード線とワイヤボンディング等に
よシ、結線される構造のものがある。Conventionally, this type of package has metal lead wires sealed in glass and attached to a box-shaped metal base that serves as an envelope.
There is a structure in which the electrode of the thermistor element for controlling the current flowing to the semiconductor laser element, the light receiving element for monitoring light detection, or the Peltier cooling element is connected to a metal lead wire by wire bonding, etc. .
リード線のガラス封着部からワイヤボンディングに供す
るリード頂面までの長さく以下、インナーリード長と呼
ぶ）は各種のワイヤボンディング方法で、可能となる通
常２ｍ以下で製造されている。インナーリード長が３〜
４ｍ以上になると、超音波ボンディングをした場合、イ
ンナーリード部での超音波エネルギの吸収が生じ、全く
ワイヤが接続されないか、あるいは強度の弱い接続しか
行なうことができない。また熱圧着ポンディング等信の
方法によって接続し九としても、可変周波数振動試験を
行なうと、インナーリード部が共振し、ワイヤのボンデ
ィングネック部で断線するという欠点がある。したがっ
て、たとえば、半導体レーザ素子の冷却のためにペルチ
ェ冷却素子を設ける等の設計上の都合で、インナーリー
ド長を長くする必要がある場合は、信頼度上問題のおる
弱い接続強度しか得られなかった。The length from the glass-sealed part of the lead wire to the top surface of the lead used for wire bonding (hereinafter referred to as inner lead length) is usually 2 m or less, which is possible using various wire bonding methods. Inner lead length is 3~
When the length is 4 m or more, ultrasonic energy is absorbed in the inner lead part when ultrasonic bonding is performed, and the wires are not connected at all or only a weak connection can be made. Further, even if the wire is connected by a method such as thermocompression bonding or the like, when a variable frequency vibration test is performed, the inner lead part resonates and the wire breaks at the bonding neck part, which is a drawback. Therefore, if it is necessary to lengthen the inner lead length for design reasons such as installing a Peltier cooling element to cool the semiconductor laser element, only a weak connection strength can be obtained that poses reliability problems. Ta.
本発明の目的は、インナーリード長が長くても。The purpose of the present invention is to solve the problem even if the inner lead length is long.
各種のボンディング方式で容易にワイヤボンディングす
ることができ、かつ振動が加えられてもボンディングワ
イヤが断線することのない光半導体用パッケージを提供
することにある。It is an object of the present invention to provide an optical semiconductor package which can be easily wire-bonded using various bonding methods and whose bonding wires do not break even when vibrations are applied.
本発明のパッケージは、インナーリードのワイヤボンデ
ィング部近傍と金属パッケージ基体の側壁を、電気絶縁
体によシ機械的に固着し九構造を有している。The package of the present invention has a structure in which the vicinity of the wire bonding portion of the inner lead and the side wall of the metal package base are mechanically fixed to an electrical insulator.
次に本発明をその実施例を示す図面に基づいて詳細に説
明する。Next, the present invention will be described in detail based on drawings showing embodiments thereof.
第１図は本発明の一実施例を示す。第１図（ａｌは一実
施例の縦断面図で、第１図Φ）は一実施例の平面図であ
る。箱形の金属基体２の底面部には、ガラス４により金
属リード線１が気密性を保持して封着されるとともにリ
ード線相互が電気的に絶縁されている。電気絶縁体３は
例えばアルミナセラミックより成り、リード線１が貫通
できる直径をもった穴があけられており、穴の周囲、及
び金属基体２の側壁と固着される部分にはＷ、Ｍｏ−Ｍ
ｎ等のメタライズ層が施されている。メタライズ層上に
はＮｉメッキ処理が施される。金属リード線１は上記電
気絶縁体３の穴に挿入され、メタライズ層とＡ ｇ −
Ｃｕロー付によ多接合され、電気絶縁体３は金属基体２
の側壁に設けられ九突出部２（ａ）でＡｇ Ｃｕｏ−
付される。したがって金属リード線１と金属基体２は電
気絶縁体により、機械的に固着された構造が形成される
。FIG. 1 shows an embodiment of the invention. FIG. 1 (al is a longitudinal sectional view of one embodiment, and FIG. 1 Φ) is a plan view of one embodiment. A metal lead wire 1 is hermetically sealed to the bottom surface of the box-shaped metal base 2 with a glass 4, and the lead wires are electrically insulated from each other. The electrical insulator 3 is made of, for example, alumina ceramic, and has a hole with a diameter that allows the lead wire 1 to pass through, and the area around the hole and the part that is fixed to the side wall of the metal base 2 is made of W, Mo-M.
A metallized layer such as n is applied. Ni plating treatment is performed on the metallized layer. The metal lead wire 1 is inserted into the hole of the electrical insulator 3, and is connected to the metallized layer and A g −
The electrical insulator 3 is connected to the metal base 2 by Cu brazing.
Ag Cuo-
will be attached. Therefore, the metal lead wire 1 and the metal base 2 are mechanically fixed to each other by the electrical insulator.
以上説明したように本発明はリード線のワイヤボンディ
ング部近傍で金属外囲器と機械的に固着された構造を有
する。このように構成されたパッケージであればリード
線の頂面と各機能素子とをワイヤボンディングにより結
線する場合、構造的に剛となっており、例えば超音波ボ
ンディングを行なうとき、超音波エネルギーがボンディ
ング接合界面に集中した状態でワイヤボンディングでき
。As described above, the present invention has a structure in which the lead wire is mechanically fixed to the metal envelope near the wire bonding portion. A package configured in this way is structurally rigid when the top surface of the lead wire and each functional element are connected by wire bonding. For example, when performing ultrasonic bonding, ultrasonic energy is Wire bonding can be performed while concentrating on the bonding interface.
強固な接合強度を得ることができる。ま九可変周波数振
動試験の結果は第１表に示すように著しく改善できた。Strong bonding strength can be obtained. The results of the variable frequency vibration test were significantly improved as shown in Table 1.
（分母は試験数、分子は不良数を示す）本発明は、リー
ド線がデュアルインライン型。(The denominator indicates the number of tests and the numerator indicates the number of defects.) The present invention has dual in-line lead wires.
シングルインライン型あるいは、同心状のいずれに配置
されていても、絶縁体を適切な形状にすることにより対
応が可能である。Either a single in-line type or a concentric arrangement can be accommodated by making the insulator an appropriate shape.
第１図（ａｌは本発明の一実施例を示す縦断面図。
第１図（ｂ）は本発明の一実施例を示す平面図である。
１・・・・・・金属リード線、２・・・・・・金属基体
、３・・・・・・電気絶縁体、４・・・・・・ガラス、
５・・・・・・半導体レーザ素子、６・・・・・・ボン
ディングワイヤ。
代理人 弁理士 内 原 晋
１−−−−＃搗ソード刹ト
３−−一一電気鰻（１登
Ｊ−−−一判狛ｆ’Ｌ−プ凛５
（ｋ））
竿１回
ｚ−＝−冷搗集伴
ψ−−−−−ガ′ラスFIG. 1 (al is a vertical cross-sectional view showing one embodiment of the present invention. FIG. 1(b) is a plan view showing one embodiment of the present invention. 1...Metal lead wire, 2 ...Metal base, 3...Electric insulator, 4...Glass,
5... Semiconductor laser element, 6... Bonding wire. Agent Patent Attorney Susumu Uchihara 1---#Pun Sword Setsu 3---11 Electric Unagi (1st J---Ichiban Koma f'L-purin 5 (k)) Rod 1 times- ＝−Reishu Shuban ψ−−−−−Garasu
Claims (1)
けられてなる構造のパッケージにおいて、リード線はワ
イヤボンディング部近傍で絶縁体により、金属基体と機
械的に固着されていることを特徴とする光半導体装置。An optical package having a structure in which a large number of lead wires are attached to a metal base via glass, and the lead wires are mechanically fixed to the metal base by an insulator near the wire bonding part. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13476185A JPS61292349A (en) | 1985-06-20 | 1985-06-20 | Package for photosemiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13476185A JPS61292349A (en) | 1985-06-20 | 1985-06-20 | Package for photosemiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61292349A true JPS61292349A (en) | 1986-12-23 |
Family
ID=15135942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13476185A Pending JPS61292349A (en) | 1985-06-20 | 1985-06-20 | Package for photosemiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292349A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014195061A (en) * | 2013-02-27 | 2014-10-09 | Kyocera Corp | Package for mounting electronic component and electronic device using the same |
-
1985
- 1985-06-20 JP JP13476185A patent/JPS61292349A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014195061A (en) * | 2013-02-27 | 2014-10-09 | Kyocera Corp | Package for mounting electronic component and electronic device using the same |
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