JPS61292347A - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPS61292347A
JPS61292347A JP60134972A JP13497285A JPS61292347A JP S61292347 A JPS61292347 A JP S61292347A JP 60134972 A JP60134972 A JP 60134972A JP 13497285 A JP13497285 A JP 13497285A JP S61292347 A JPS61292347 A JP S61292347A
Authority
JP
Japan
Prior art keywords
vacuum
cooling
semiconductor element
semiconductor device
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60134972A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363826B2 (enExample
Inventor
Koichiro Kotani
小谷　紘一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60134972A priority Critical patent/JPS61292347A/ja
Publication of JPS61292347A publication Critical patent/JPS61292347A/ja
Publication of JPH0363826B2 publication Critical patent/JPH0363826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60134972A 1985-06-19 1985-06-19 半導体装置の冷却構造 Granted JPS61292347A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60134972A JPS61292347A (ja) 1985-06-19 1985-06-19 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134972A JPS61292347A (ja) 1985-06-19 1985-06-19 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPS61292347A true JPS61292347A (ja) 1986-12-23
JPH0363826B2 JPH0363826B2 (enExample) 1991-10-02

Family

ID=15140908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60134972A Granted JPS61292347A (ja) 1985-06-19 1985-06-19 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPS61292347A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254380A (en) * 1975-10-27 1977-05-02 Amp Inc Improved liquid cooling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254380A (en) * 1975-10-27 1977-05-02 Amp Inc Improved liquid cooling device

Also Published As

Publication number Publication date
JPH0363826B2 (enExample) 1991-10-02

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