JPH0363826B2 - - Google Patents
Info
- Publication number
- JPH0363826B2 JPH0363826B2 JP60134972A JP13497285A JPH0363826B2 JP H0363826 B2 JPH0363826 B2 JP H0363826B2 JP 60134972 A JP60134972 A JP 60134972A JP 13497285 A JP13497285 A JP 13497285A JP H0363826 B2 JPH0363826 B2 JP H0363826B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- outer case
- cooling tank
- semiconductor
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134972A JPS61292347A (ja) | 1985-06-19 | 1985-06-19 | 半導体装置の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134972A JPS61292347A (ja) | 1985-06-19 | 1985-06-19 | 半導体装置の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61292347A JPS61292347A (ja) | 1986-12-23 |
| JPH0363826B2 true JPH0363826B2 (enExample) | 1991-10-02 |
Family
ID=15140908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60134972A Granted JPS61292347A (ja) | 1985-06-19 | 1985-06-19 | 半導体装置の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292347A (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254380A (en) * | 1975-10-27 | 1977-05-02 | Amp Inc | Improved liquid cooling device |
-
1985
- 1985-06-19 JP JP60134972A patent/JPS61292347A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61292347A (ja) | 1986-12-23 |
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