JPH0332223B2 - - Google Patents

Info

Publication number
JPH0332223B2
JPH0332223B2 JP60117368A JP11736885A JPH0332223B2 JP H0332223 B2 JPH0332223 B2 JP H0332223B2 JP 60117368 A JP60117368 A JP 60117368A JP 11736885 A JP11736885 A JP 11736885A JP H0332223 B2 JPH0332223 B2 JP H0332223B2
Authority
JP
Japan
Prior art keywords
water
cooling
semiconductor
semiconductor module
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60117368A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61276242A (ja
Inventor
Ryoichi Kajiwara
Takao Funamoto
Mitsuo Kato
Tomohiko Shida
Kyo Matsuzaka
Hiroshi Wachi
Kazuya Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60117368A priority Critical patent/JPS61276242A/ja
Publication of JPS61276242A publication Critical patent/JPS61276242A/ja
Publication of JPH0332223B2 publication Critical patent/JPH0332223B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/776—Arrangements for jet impingement, e.g. for spraying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60117368A 1985-05-30 1985-05-30 半導体モジユ−ル Granted JPS61276242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60117368A JPS61276242A (ja) 1985-05-30 1985-05-30 半導体モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60117368A JPS61276242A (ja) 1985-05-30 1985-05-30 半導体モジユ−ル

Publications (2)

Publication Number Publication Date
JPS61276242A JPS61276242A (ja) 1986-12-06
JPH0332223B2 true JPH0332223B2 (enExample) 1991-05-10

Family

ID=14709929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60117368A Granted JPS61276242A (ja) 1985-05-30 1985-05-30 半導体モジユ−ル

Country Status (1)

Country Link
JP (1) JPS61276242A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3853197T2 (de) * 1987-12-07 1995-06-29 Nippon Electric Co Kühlungssystem für integrierte Schaltungspackung.
EP0341950B1 (en) * 1988-05-09 1994-09-14 Nec Corporation Flat cooling structure of integrated circuit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
JP2927975B2 (ja) * 1991-01-24 1999-07-28 日本電気株式会社 集積回路パッケージの温度検出構造および温度センサキャリア
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造

Also Published As

Publication number Publication date
JPS61276242A (ja) 1986-12-06

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