JPS61276242A - 半導体モジユ−ル - Google Patents

半導体モジユ−ル

Info

Publication number
JPS61276242A
JPS61276242A JP60117368A JP11736885A JPS61276242A JP S61276242 A JPS61276242 A JP S61276242A JP 60117368 A JP60117368 A JP 60117368A JP 11736885 A JP11736885 A JP 11736885A JP S61276242 A JPS61276242 A JP S61276242A
Authority
JP
Japan
Prior art keywords
water
humidity sensor
semiconductor
metal oxide
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60117368A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332223B2 (enExample
Inventor
Ryoichi Kajiwara
良一 梶原
Takao Funamoto
舟本　孝雄
Mitsuo Kato
光雄 加藤
Tomohiko Shida
志田　朝彦
Kyo Matsuzaka
松坂　矯
Hiroshi Wachi
和知　弘
Kazuya Takahashi
和弥 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60117368A priority Critical patent/JPS61276242A/ja
Publication of JPS61276242A publication Critical patent/JPS61276242A/ja
Publication of JPH0332223B2 publication Critical patent/JPH0332223B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/776—Arrangements for jet impingement, e.g. for spraying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60117368A 1985-05-30 1985-05-30 半導体モジユ−ル Granted JPS61276242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60117368A JPS61276242A (ja) 1985-05-30 1985-05-30 半導体モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60117368A JPS61276242A (ja) 1985-05-30 1985-05-30 半導体モジユ−ル

Publications (2)

Publication Number Publication Date
JPS61276242A true JPS61276242A (ja) 1986-12-06
JPH0332223B2 JPH0332223B2 (enExample) 1991-05-10

Family

ID=14709929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60117368A Granted JPS61276242A (ja) 1985-05-30 1985-05-30 半導体モジユ−ル

Country Status (1)

Country Link
JP (1) JPS61276242A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945980A (en) * 1988-09-09 1990-08-07 Nec Corporation Cooling unit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
US5023695A (en) * 1988-05-09 1991-06-11 Nec Corporation Flat cooling structure of integrated circuit
US5036384A (en) * 1987-12-07 1991-07-30 Nec Corporation Cooling system for IC package
JPH04240753A (ja) * 1991-01-24 1992-08-28 Nec Corp 集積回路パッケージの温度検出構造および温度センサキャリア
US5329419A (en) * 1991-10-21 1994-07-12 Nec Corporation Integrated circuit package having a cooling mechanism
US5360993A (en) * 1991-10-21 1994-11-01 Nec Corporation Cooling unit capable of speedily cooling an integrated circuit chip

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036384A (en) * 1987-12-07 1991-07-30 Nec Corporation Cooling system for IC package
US5023695A (en) * 1988-05-09 1991-06-11 Nec Corporation Flat cooling structure of integrated circuit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
US4945980A (en) * 1988-09-09 1990-08-07 Nec Corporation Cooling unit
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
JPH04240753A (ja) * 1991-01-24 1992-08-28 Nec Corp 集積回路パッケージの温度検出構造および温度センサキャリア
US5329419A (en) * 1991-10-21 1994-07-12 Nec Corporation Integrated circuit package having a cooling mechanism
US5360993A (en) * 1991-10-21 1994-11-01 Nec Corporation Cooling unit capable of speedily cooling an integrated circuit chip

Also Published As

Publication number Publication date
JPH0332223B2 (enExample) 1991-05-10

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