JPH0145982B2 - - Google Patents

Info

Publication number
JPH0145982B2
JPH0145982B2 JP58223973A JP22397383A JPH0145982B2 JP H0145982 B2 JPH0145982 B2 JP H0145982B2 JP 58223973 A JP58223973 A JP 58223973A JP 22397383 A JP22397383 A JP 22397383A JP H0145982 B2 JPH0145982 B2 JP H0145982B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
temperature sensor
temperature
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58223973A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60116154A (ja
Inventor
Tsukasa Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58223973A priority Critical patent/JPS60116154A/ja
Publication of JPS60116154A publication Critical patent/JPS60116154A/ja
Publication of JPH0145982B2 publication Critical patent/JPH0145982B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58223973A 1983-11-28 1983-11-28 集積回路パツケ−ジ構造 Granted JPS60116154A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58223973A JPS60116154A (ja) 1983-11-28 1983-11-28 集積回路パツケ−ジ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58223973A JPS60116154A (ja) 1983-11-28 1983-11-28 集積回路パツケ−ジ構造

Publications (2)

Publication Number Publication Date
JPS60116154A JPS60116154A (ja) 1985-06-22
JPH0145982B2 true JPH0145982B2 (enExample) 1989-10-05

Family

ID=16806576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58223973A Granted JPS60116154A (ja) 1983-11-28 1983-11-28 集積回路パツケ−ジ構造

Country Status (1)

Country Link
JP (1) JPS60116154A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267652U (enExample) * 1988-11-08 1990-05-22
US7416332B2 (en) * 2006-03-29 2008-08-26 Harris Corporation Flexible circuit temperature sensor assembly for flanged mounted electronic devices
EP3961995A1 (en) 2013-12-11 2022-03-02 Ademco Inc. Building automation control systems
DE102014224995A1 (de) * 2014-12-05 2016-06-09 Siemens Aktiengesellschaft Kühlkörper zur Kühlung eines elektrischen Geräts
US10488062B2 (en) 2016-07-22 2019-11-26 Ademco Inc. Geofence plus schedule for a building controller
US10895883B2 (en) 2016-08-26 2021-01-19 Ademco Inc. HVAC controller with a temperature sensor mounted on a flex circuit

Also Published As

Publication number Publication date
JPS60116154A (ja) 1985-06-22

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