JPS6129145B2 - - Google Patents
Info
- Publication number
- JPS6129145B2 JPS6129145B2 JP11445779A JP11445779A JPS6129145B2 JP S6129145 B2 JPS6129145 B2 JP S6129145B2 JP 11445779 A JP11445779 A JP 11445779A JP 11445779 A JP11445779 A JP 11445779A JP S6129145 B2 JPS6129145 B2 JP S6129145B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- cradle
- mold package
- feed
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 51
- 230000007246 mechanism Effects 0.000 claims description 40
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 238000012840 feeding operation Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11445779A JPS5638829A (en) | 1979-09-06 | 1979-09-06 | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11445779A JPS5638829A (en) | 1979-09-06 | 1979-09-06 | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5638829A JPS5638829A (en) | 1981-04-14 |
JPS6129145B2 true JPS6129145B2 (ko) | 1986-07-04 |
Family
ID=14638202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11445779A Granted JPS5638829A (en) | 1979-09-06 | 1979-09-06 | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5638829A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0440573B2 (ko) * | 1988-05-13 | 1992-07-03 | Fuji Gomme Kk |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01182692A (ja) * | 1988-01-12 | 1989-07-20 | Maruei Kogyo Kk | 管継手 |
JPH029396U (ko) * | 1988-06-30 | 1990-01-22 |
-
1979
- 1979-09-06 JP JP11445779A patent/JPS5638829A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0440573B2 (ko) * | 1988-05-13 | 1992-07-03 | Fuji Gomme Kk |
Also Published As
Publication number | Publication date |
---|---|
JPS5638829A (en) | 1981-04-14 |
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