JPS61287228A - Drawing method in electron beam exposure device - Google Patents

Drawing method in electron beam exposure device

Info

Publication number
JPS61287228A
JPS61287228A JP13029885A JP13029885A JPS61287228A JP S61287228 A JPS61287228 A JP S61287228A JP 13029885 A JP13029885 A JP 13029885A JP 13029885 A JP13029885 A JP 13029885A JP S61287228 A JPS61287228 A JP S61287228A
Authority
JP
Japan
Prior art keywords
pattern
information
memory
drawn
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13029885A
Other languages
Japanese (ja)
Inventor
Kazuharu Magota
孫田 和治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP13029885A priority Critical patent/JPS61287228A/en
Publication of JPS61287228A publication Critical patent/JPS61287228A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electron Beam Exposure (AREA)

Abstract

PURPOSE:To shorten a working time by storing part of all of drawing information of the same pattern presented on a plurality of regions, continuously repetitively drawing on the corresponding regions, and eliminating the communication of the wasteful information. CONSTITUTION:Drawing information 3a of dividing patterns corresponding to 1/3 of a small pattern 3 is read out in a memory. Divided pattern 3a is drawn from from a region 220 with the information, the pattern 3a is sequentially drawn on the adjacent region 221 in an X direction with the same information, and the pattern 3a is thereafter drawn in 15 patterns according to the route of an arrow. Then, the read storage is updated to information of the divided pattern 3b of other portion of the pattern 3, similarly drawn by the information, the stored content is further updated to the divided pattern 3c of the pattern 3, and similarly drawn. According to the method, the communication of the information between the storing medium and the memory may be three times to remarkably shorten as compared with 90 times of the conventional method, thereby effectively drawing more complicated pattern.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置製造のためのマスクの製作に用いる
電子線露光装置に関し、特にその描画方法の改良に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electron beam exposure apparatus used for manufacturing masks for manufacturing semiconductor devices, and particularly to improvements in its drawing method.

〔従来技術〕[Prior art]

半導体装置はますます高集積度化される傾向にある。こ
れを可能とするりソグラフィシステムを構成するものと
して縮小投影可能な電子線露光装置があり、その台頭に
伴い従来の等倍マスクに替えて5倍、 10倍マスクが
徐々に増加しつつある。
Semiconductor devices are becoming increasingly highly integrated. There is an electron beam exposure device that can perform reduction projection as a component of the lithography system that makes this possible, and with its rise, 5x and 10x masks are gradually increasing in place of the conventional 1x mask. .

これら5倍又は10倍マスクは等倍マスクに比して1チ
ップ当りのパターンデータ量が極めて多く、このデータ
を電子線露光装置に合致する形式にデータ変換するため
に長時間を要し、更に変換されたデータに基いて描画露
光するに際しても全パターンのデータを蓄積しである磁
気ディスクと、描画の単位となる分のパターンのデータ
を格納する描画データメモリとの間で頻繁にデータ送受
を行う必要があり、スループットが悪いという問題があ
る。
These 5x or 10x masks have an extremely large amount of pattern data per chip compared to 1x masks, and it takes a long time to convert this data into a format compatible with the electron beam exposure equipment. Even when drawing exposure is performed based on the converted data, data is frequently sent and received between the magnetic disk that stores all pattern data and the drawing data memory that stores pattern data that is the unit of drawing. There is a problem of poor throughput.

第5図は従来の拡大(5倍、10倍等)マスクの露光方
式の説明図である。40は1チツプの半導体装置相当の
エリアを表し、メモリ容量の都合上6つのエリア4]、
、42,43,44,45.46に分けて描画される。
FIG. 5 is an explanatory diagram of an exposure method of a conventional enlargement (5x, 10x, etc.) mask. 40 represents an area equivalent to one chip of semiconductor device, and due to memory capacity, there are six areas 4],
, 42, 43, 44, 45.46.

このチップ全体の描画データをM積しである磁気ディス
クから描画データメモリに対してX方向にLx、 Y方
向にt、y分のV4域、例えば41aの描画に必要なデ
ータが転送され、ここに格納される。
The data necessary for drawing the V4 area, for example 41a, for Lx in the X direction and t and y in the Y direction, is transferred from the magnetic disk with M stacks of drawing data for the entire chip to the drawing data memory. is stored in

このデータ量は描画データメモリの容量に応じて定まる
。電子線露光装置はこの描画データメモリの内容を読出
し、電子線をY方向に走査すると共に描画対象をX方向
に移動させて副走査を行う。
This amount of data is determined according to the capacity of the drawing data memory. The electron beam exposure apparatus reads the contents of this drawing data memory, scans the electron beam in the Y direction, and moves the drawing target in the X direction to perform sub-scanning.

領域41aの描画を終えると描画データメモリの内容を
更新してfl域41bの描画を行う。以下同様にして領
域41c、・・・41fの描画を行う。そして他のエリ
ア42,43.・・・についても同様に描画する。
When the drawing of the area 41a is finished, the contents of the drawing data memory are updated and the drawing of the fl area 41b is performed. Thereafter, the regions 41c, . . . , 41f are drawn in the same manner. and other areas 42, 43. . . . are drawn in the same way.

以上の手順から明らかな如く1つの領域の描画を終える
都度描画データメモリの内容を更新する必要があり、こ
れに多くの時間を要するのである。
As is clear from the above procedure, it is necessary to update the contents of the drawing data memory each time drawing of one area is completed, and this takes a lot of time.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

さてスルーブツトの向上を1的として特開昭58−12
7324号が開発されている。この発明は、描画パター
ンを複数の区画に分割し、各区画の描画データごとにデ
ータ変換し、描画時に合成することとして、所望の形式
への描画データ変換の時間を短縮したものである。しか
しながら露光に要する時間は旧来の方式と何ら変りがな
く、長時間を必要とする。
Now, with the aim of improving the throughput, we
No. 7324 has been developed. This invention shortens the time it takes to convert the drawing data into a desired format by dividing the drawing pattern into a plurality of sections, converting the drawing data for each section, and composing them at the time of drawing. However, the time required for exposure is no different from the conventional method, and requires a long time.

〔問題点を解決するための手段〕[Means for solving problems]

本発明はマスクパターンが複数の領域で同一パターンを
有している点に着眼し、この部分の描画データについて
は一旦描画パターンメモリに格納した後、同一パターン
の複数領域について描画を継続して反復的に行わせるこ
ととしてデータ送受時間の無駄を排してスループットの
向上を図った描画方法を提供することを目的とする。
The present invention focuses on the fact that a mask pattern has the same pattern in multiple areas, and after storing the drawing data of this part in the drawing pattern memory, drawing is continued and repeated for multiple areas with the same pattern. The present invention aims to provide a drawing method that eliminates wasted data transmission and reception time and improves throughput.

本発明に係る描画方法は適宜記憶媒体に蓄積されている
描画データを分割して順次メモリに読込み、メモリに読
込んだ内容を描画対象に対し、電子的に描画する電子線
露光装置において、描画すべき像のうち複数領域に現れ
る同一パターンについては、該パターンに相当する描画
データ部分の一部又は全部を前記メモリに読込み、これ
を前記領域の夫々に継続して反復的に描画することを特
徴とする。
The drawing method according to the present invention divides drawing data stored in a storage medium as appropriate and sequentially reads them into a memory, and electronically draws the contents read into the memory onto an object to be drawn. For the same pattern that appears in multiple areas of the image to be imaged, part or all of the drawing data portion corresponding to the pattern is read into the memory, and this is continuously and repeatedly drawn in each of the areas. Features.

〔実施例〕〔Example〕

以下本発明をその実施例を示す図面に基き具体的に説明
する。
The present invention will be specifically described below based on drawings showing embodiments thereof.

第1図は本発明に係る電子線露光装置の構成を示すブロ
ック図であり、ハードウェア自体は従来のものと同様で
ある。1は電子銃であり、これから発せられた電子線は
陽極2の中央の孔を通り、複数のレンズ3.3.3ブラ
ンキング電極4.偏向電極5を通り、XYステージ7上
の描画対象6に達するようにしである。
FIG. 1 is a block diagram showing the configuration of an electron beam exposure apparatus according to the present invention, and the hardware itself is the same as the conventional one. 1 is an electron gun, and the electron beam emitted from it passes through a hole in the center of an anode 2, and passes through a plurality of lenses 3.3.3 blanking electrodes 4. It passes through the deflection electrode 5 and reaches the drawing target 6 on the XY stage 7 .

8はこの装置の制御を司どるCPt1(中央処理袋W)
であり、磁気ディスク等の記憶媒体10に蓄積しである
1チップ分の像の描画データを入力装置9からの°指示
等に従って所定量ずつ読出し、これを描画データコント
ローラ11を経て描画像データメモIJ12へ転送し、
ここに格納させる。そしてこのメモリ12に格納された
描画データは順次読出されて偏向コントローラ13に偏
向信号と同期させて0/^変換器14に与えられ、ここ
でアナログ信号に変換されてブランキング電極4に与え
られる。偏向コントローラI3はまた偏向信号を出力し
、偏向電極5に与える。ステージ制御回路15はXYス
テージ7を所要方向に移動させるための制御信号を発す
る。
8 is CPt1 (central processing bag W) that controls the control of this device
The image drawing data for one chip stored in the storage medium 10 such as a magnetic disk is read out in predetermined amounts in accordance with instructions from the input device 9, and is sent to the drawing data controller 11 as a drawn image data memo. Transfer to IJ12,
Store it here. The drawing data stored in the memory 12 is sequentially read out and sent to the deflection controller 13 in synchronization with the deflection signal, and then given to the 0/^ converter 14, where it is converted into an analog signal and given to the blanking electrode 4. . The deflection controller I3 also outputs a deflection signal and applies it to the deflection electrode 5. The stage control circuit 15 issues a control signal to move the XY stage 7 in a desired direction.

描画露光は、偏向電極5によって電子線をY方向に主走
査し、X−Yステージ7にてX方向に副走査し、ブラン
キング電極4によって露光対象への電子線の投射/非投
射の制御を行うことにて行われる。
In drawing exposure, the electron beam is main scanned in the Y direction by the deflection electrode 5, sub-scanned in the X direction by the X-Y stage 7, and the blanking electrode 4 controls projection/non-projection of the electron beam onto the exposure target. It is done by doing.

第2図は半導体メモリ装置のパターンを略示しており、
センスアンプ21の両側にメモリアレイ22゜22を配
し、またこれらの側部にアドレス回路23を配置しであ
る。そしてこのようなレイアウトの半導体メモリ装置は
例えば第3図に示すように■〜Oの24とおりの小パタ
ーンにて構成されている。
FIG. 2 schematically shows the pattern of a semiconductor memory device,
Memory arrays 22.22 are arranged on both sides of the sense amplifier 21, and address circuits 23 are arranged on these sides. A semiconductor memory device having such a layout is configured with 24 small patterns (1) to (0), as shown in FIG. 3, for example.

これら24とおりの小パターンの描画データは記憶媒体
10に蓄積されている。
The drawing data of these 24 small patterns are stored in the storage medium 10.

第4図は■の小パターン3行5列にて構成される一方の
メモリアレイ22の部分を拡大して示しである。いま描
画データメモリ12に格納できる描画データがX方向に
Lx分、Y方向にLV分とし、Lxが小パターン■のX
方向寸法と同寸法、t、yが小パタ−ン■のY方向寸法
の桶であるとする。このような場合本発明では以下の手
順にて描画を行う。
FIG. 4 is an enlarged view of one of the memory arrays 22, which is comprised of a small pattern of 3 rows and 5 columns. The drawing data that can now be stored in the drawing data memory 12 is Lx in the X direction and LV in the Y direction, where Lx is the X of the small pattern ■.
Assume that the bucket has the same dimension as the direction dimension, and t and y have the Y direction dimension of the small pattern (2). In such a case, the present invention performs drawing using the following procedure.

即ちまず小パターン■の補相当分の分割パターンOの描
画データを描画データメモリ12に読込む。
That is, first, the drawing data of the divided pattern O corresponding to the complement of the small pattern (2) is read into the drawing data memory 12.

そしてこの読込データを用いて、小パターン■を描画す
べき一隅の領域における分割パターンOを描くべき領域
220から描画を行い、この領域220の描画の後は矢
符で示すように同データを用いてX方向に隣接する小パ
ターン3の領域中の分割パターンOの領域221に対す
る描画を行う。以下矢符で示す経路に従い、15の小パ
ターン■の領域中の分割パターンOの領域に対する描画
を行う。そして実施例の場合は他方のメモリアレイ22
に対し同様に描画を行う。
Then, using this read data, drawing starts from the area 220 where the divided pattern O is to be drawn in the corner area where the small pattern ■ is to be drawn, and after drawing this area 220, the same data is used as shown by the arrow. Then, drawing is performed on the area 221 of the divided pattern O in the area of the small pattern 3 adjacent in the X direction. Following the route indicated by the arrow below, drawing is performed on the area of the divided pattern O in the area of the 15 small patterns ■. In the case of the embodiment, the other memory array 22
Draw in the same way for .

次に描画データメモリ弗の内容を小パターン■の他の部
分の分割パターン@の描画データに更新し、同様にして
このデータにより15×2回の描画を行う、そして描画
データメモリ12の内容を小パターン■の残りの部分の
分割パターンOに更新し、同様に描画を行う。
Next, the contents of the drawing data memory 2 are updated to the drawing data of the divided pattern @ of the other part of the small pattern The remaining portion of the small pattern (2) is updated to the division pattern O, and drawing is performed in the same manner.

〔効果〕〔effect〕

以上の如き本発明方法による場合は上述の露光の間にお
いて記憶媒体10とメモリ12との間で3回のデータ送
受を行うだけで足りる。
In the case of the method of the present invention as described above, it is sufficient to transmit and receive data three times between the storage medium 10 and the memory 12 during the above-mentioned exposure.

従来の方法では3 X15X 2−90回のデータ送受
を行っていたのと比較するとその時間が大幅に短縮され
ることが明らかである。そして複雑なパターンであるほ
ど描画データの送受に時間を要するので本発明は複雑な
パターンであれはあるほど効果的であり、より一層のス
ループットの向上が図れる。
It is clear that the time required is significantly reduced when compared to the conventional method, in which data is sent and received 3 x 15 x 2-90 times. Since the more complex the pattern is, the longer it takes to send and receive drawing data, the present invention is more effective as the pattern becomes more complex, and the throughput can be further improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明方法に係る電子線露光装置のブロック図
、第2図は半導体メモリ装置のパターン図、第3図はそ
のパターンの種類を示すパターン図、第4図は本発明方
法の説明図、第5図は従来方法の説明図である。 6・・・描画対象 7・・・XYステージ 10・・・
記憶媒体12・・・描画データメモリ
FIG. 1 is a block diagram of an electron beam exposure apparatus according to the method of the present invention, FIG. 2 is a pattern diagram of a semiconductor memory device, FIG. 3 is a pattern diagram showing the types of patterns, and FIG. 4 is an explanation of the method of the present invention. FIG. 5 is an explanatory diagram of the conventional method. 6...Drawing target 7...XY stage 10...
Storage medium 12...drawing data memory

Claims (1)

【特許請求の範囲】[Claims] 1.適宜記憶媒体に蓄積されている描画データを分割し
て順次メモリに読込み、メモリに読込んだ内容を描画対
象に対し、電子的に描画する電子線露光装置において、 描画すべき像のうち複数領域に現れる同一 パターンについては、該パターンに相当する描画データ
部分の一部又は全部を前記メモリに読込み、これを前記
領域の夫々に継続して反復的に描画することを特徴とす
る描画方法。
1. In an electron beam exposure device that divides the drawing data stored in a storage medium as appropriate and sequentially reads it into the memory, and electronically draws the contents read into the memory onto the drawing target, multiple areas of the image to be drawn are For the same pattern that appears in the area, a part or all of the drawing data corresponding to the pattern is read into the memory, and this is continuously and repeatedly drawn in each of the areas.
JP13029885A 1985-06-14 1985-06-14 Drawing method in electron beam exposure device Pending JPS61287228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13029885A JPS61287228A (en) 1985-06-14 1985-06-14 Drawing method in electron beam exposure device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13029885A JPS61287228A (en) 1985-06-14 1985-06-14 Drawing method in electron beam exposure device

Publications (1)

Publication Number Publication Date
JPS61287228A true JPS61287228A (en) 1986-12-17

Family

ID=15030968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13029885A Pending JPS61287228A (en) 1985-06-14 1985-06-14 Drawing method in electron beam exposure device

Country Status (1)

Country Link
JP (1) JPS61287228A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059794A (en) * 2001-08-08 2003-02-28 Sony Corp Method and apparatus for partitioning pattern for writing, method for writing, method for making mask, semiconductor device and method for manufacturing the same, program for partitioning pattern for writing and computer readable recording medium recorded with the program

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059794A (en) * 2001-08-08 2003-02-28 Sony Corp Method and apparatus for partitioning pattern for writing, method for writing, method for making mask, semiconductor device and method for manufacturing the same, program for partitioning pattern for writing and computer readable recording medium recorded with the program

Similar Documents

Publication Publication Date Title
US6064807A (en) Charged-particle beam exposure system and method
EP0064639B1 (en) Electron-beam lithographic apparatus
US4433384A (en) Pattern data handling system for an electron beam exposure system
EP0002957A2 (en) Electron beam exposure apparatus
US4759076A (en) Image rotating system by an arbitrary angle
US5005138A (en) Electron beam direct printing apparatus
US6218060B1 (en) Electron beam exposure method and electron beam exposure apparatus
US6072185A (en) Charged-particle-beam exposure device and method capable of high-speed data reading
US4489241A (en) Exposure method with electron beam exposure apparatus
Yasuda et al. Fast electron beam lithography system with 1024 beams individually controlled by blanking aperture array
JPS61287228A (en) Drawing method in electron beam exposure device
JPS6298724A (en) Electron beam patterning device
US4523098A (en) Electron beam exposure apparatus
JPS6227538B2 (en)
JPH0936267A (en) Method and device for working and measuring ic package
JP3481017B2 (en) Charged particle beam exposure apparatus and exposure data processing method of the charged particle beam exposure apparatus
JPH0669104A (en) Electron beam lithography system
JPS6230491B2 (en)
JPH11102853A (en) Electron beam lithography device
JP2633905B2 (en) Electron beam exposure system
JPS6390827A (en) Method and equipment of charged particle beam lithography
KR19990063437A (en) Direct drawing data generation method and direct drawing method and apparatus for direct drawing of charged particle beam
KR20200104799A (en) Charged particle beam writing method and charged particle beam writing apparatus
JPS6239535B2 (en)
JPH02183515A (en) Electron beam exposure device