JPS61285741A - Manufacture of resin sealed type semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the damage on the surface of a chip when a semiconductor element chip is sealed with resin, by providing a double-layer structure, in which a molding resin layer, wherein filler is not included or the amount of inclusion of the filler is very small, and a molding resin layer including the filler are provided. CONSTITUTION:The surface part, which is directly contacted with a chip 1, is once sealed with a molding resin layer 6 made of a resin material, which does not include filler or includes a small possible amount of the filler. Then the surface part of the molding resin layer 6 is sealed with a molding resin layer 7 made of a resin material, which includes the filler 3 in a high density, again. Thus, the damage on the surface part of the semiconductor element chip can be prevented.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a resin-sealed semiconductor device, and particularly relates to a method for manufacturing a resin-sealed semiconductor device with improved resin encapsulation. .

[Conventional technology]

In conventional resin-sealed semiconductor devices of this type, so-called plastic packages, as shown in Figure 2,
When the semiconductor element chip 1 is resin-sealed with the molding resin layer 2, in order to increase the hardness of the molding resin layer 2 and to balance its coefficient of thermal expansion with that of the silicon chip as much as possible, the encapsulating resin material is filler (
Silicon powder) 3 is mixed in at a high density for use. As you can see, the reference numeral 4 is the frame of the semiconductor element chip l.

[Problem that the invention seeks to solve]

However, in such a conventional plastic package structure, it is known that stress is applied to the surface of the semiconductor element chip 1 due to cooling and solidification of the molten resin during resin sealing and thermal cycling in the usage environment. In addition, with the recent trend of miniaturization of highly integrated nine-circuit patterns for semiconductor element chips 1, the pressure caused by the filler 3 mixed in the mold resin layer 2, even if it is slight, As shown in FIG. 3, which is an enlarged view of section A in FIG. This can lead to defects, leading to lower chip manufacturing yields and lower reliability.To avoid this, efforts have been made to improve the resin material and strengthen the protective film on the chip surface. However, there are still no effective methods.

Therefore, it is an object of the present invention to provide a method for manufacturing a resin-sealed semiconductor device that completely overcomes these problems associated with conventional resin-sealing.

[Means for solving problems]

In order to achieve the above object, the method for manufacturing a resin-sealed semiconductor device according to the present invention includes firstly containing no filler or
Alternatively, the surface portion that directly contacts the semiconductor element chip is once sealed with resin using a first mold resin layer using a resin material with as little filler content as possible, and then a resin material containing filler is applied. The surface portion of the first mold resin layer is again sealed with resin using the second mold resin layer used.

[For production]

That is, in the method of the present invention, with respect to resin sealing for semiconductor element chips, filler is not included;
Alternatively, a two-layer structure including a first mold resin layer made of a resin material with as little filler content as possible and a second mold resin layer made of a resin material containing filler is used.
Therefore, it is possible to avoid the risk of damage to the surface portion that comes into direct contact with the semiconductor element chip due to the pressing of the filler or the like.

〔Example〕

Hereinafter, one embodiment of the method for manufacturing a resin-sealed semiconductor device according to the present invention will be described in detail with reference to FIG.

The embodiment shown in FIG. 1 is a sectional view showing a resin-sealed structure of an apparatus corresponding to the conventional example shown in FIG.

In this embodiment method, in order to eliminate the influence of the filler 3 on the semiconductor element chip 1 described above, first, the surface portion that directly contacts the semiconductor element chip 1 contains no filler or contains as much filler as possible. Once the first mold resin layer 8 is made of a resin material with a low content,
After sealing with resin, this first mold resin y
The surface portion of M1B is again sealed with a second mold resin layer 7 made of a resin material containing filler 3 at a high density.

Therefore, in the case of this embodiment method, the semiconductor element chip 1
Since the first mold resin layer e that seals the surface portion of the mold does not contain filler or is made of a resin material with as little filler as possible, it is difficult to seal the surface during resin sealing and thermal cycle loading. Therefore, damage to the circuit structure on the chip surface due to the pressing of the filler 3 can be avoided, and the surface portion of the first mold resin layer 8 can be covered with a second mold resin made of a resin material containing the filler 3 at a high density. layer 7
Since the resin is sealed again, the overall hardness and coefficient of thermal expansion of the sealing resin layer can be maintained at the same level as in the past.

〔Effect of the invention〕

As detailed above, according to the method of the present invention, regarding resin sealing of a semiconductor element chip, the first mold resin layer is made of a resin material that does not contain filler or has as little filler content as possible; Since it has a two-layer structure with a second mold resin layer made of a resin material containing filler, it is possible to effectively avoid damage to the chip surface caused by pressing the filler, etc., without impairing the properties of the plastic package. Moreover, there is no fear that manufacturing yield or reliability will be lowered thereby, and it has the advantage of being relatively simple and easy to implement in terms of structure and method.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the general structure of a resin-sealed semiconductor device to which an embodiment of the method of the present invention is applied, and FIG. 2 is a sectional view showing the general structure of the same device according to a conventional example. 3
This figure is a partially enlarged sectional view showing the detailed structure of section A in FIG. 2. l... Semiconductor element chip, 3... Filler, 5
...First mold resin layer, B...Second mold resin layer. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 Procedural amendment (voluntary) To the Commissioner of the Japan Patent Office
Gohei, Incident Display Patent Application 1986-12743
No. 0 2, Name of the invention Method for manufacturing a resin-encapsulated semiconductor device 3, Person making the amendment 6, Detailed description of the invention in the specification to be amended

Claims (1)

[Claims] In the manufacture of a semiconductor device in which a semiconductor element chip is sealed with resin, firstly, the parts that directly contact the semiconductor element chip are made of a resin material that does not contain filler or has as little filler content as possible. The first mold resin layer is used to seal the resin, and then this first mold resin layer is used.
A method for manufacturing a resin-sealed semiconductor device, characterized in that the molded resin layer portion is again sealed with a second molded resin layer made of a resin material containing a filler.