JPS61283571A - Manufacture of heat ray radiating head - Google Patents

Abstract

PURPOSE:To obtain an inexpensive heat ray radiating head excellent in thermal separation between heating resistors, by a method wherein the first anti- oxidation film substantially insoluble in hot phosphoric acid and a heating resistor are laminated on a substrate easily soluble in hot phosphoric acid, and a groove is provided on the lower side of the first anti-oxidation film. CONSTITUTION:The first anti-oxidation film 2 substantially insoluble in hot phosphoric acid and the heating resistor 3 are provided on the substrate 1 easily soluble in hot phosphoric acid, and feeder wires for the resistor are provided by an etching process. Further, the part of the substrate on the lower side of the film 2 is etched away by hot phosphoric acid to provide the groove 6 extending in a direction orhogonal to the film 2, and the second anti-oxidation film 7 is provided on the resistor 3. Accordingly, since the substrate is provided with the groove, an air layer is provided in the vicinity of a central part of the anti-oxidation film covering the heating resistor, and since the air layer is poor in thermal conductivity, the heat capacity of the resistor is markedly improved, the resistor can be rapidly brought to a high temperature with small power consumption, and the thermal separation between the heating resistors is excellent.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of manufacturing a heat ray emitting head for writing information on a photoreceptor by emitting heat rays such as infrared rays, near infrared rays, or visible light. be.

[Conventional technology]

A conventional heat ray emitting head of this type has a structure in which a plurality of heating resistors for heat ray radiation are formed on a substrate such as glass, and the periphery of each heating resistor is covered with an anti-oxidation film. By covering the heating resistors with an anti-oxidation film, each heating resistor can be made taller and can be used as a head for writing information on a long wavelength photoreceptor that has high sensitivity in the infrared region.

[Problem that the invention seeks to solve]

However, the conventional heat radiation head has a problem in that in order to write information by exposing the long wavelength photoreceptor, the power consumption of the heating resistor must be significantly increased.

The present invention was made to solve these problems, and it is possible to write information on a long wavelength photoreceptor by making the heat generating resistor generate heat at high speed and high temperature with small power consumption, and to write information on a long wavelength photoreceptor. The object of the present invention is to realize a method of manufacturing a heat ray emitting head that has excellent thermal isolation between heating resistors and is inexpensive.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention provides a structure in which a tenth antioxidant film material that hardly dissolves in hot phosphoric acid and a heating resistor material are superimposed by sputtering on a substrate that easily dissolves in hot phosphoric acid. , No. 10 anti-oxidation film and heating resistor of the same shape by etching both materials? After that, a power supply line for supplying power to the heating resistor is formed by an etching process, and further, the lower part of the tenth oxidation prevention film of the substrate is dissolved by etching using the hot phosphoric acid. After forming a groove extending in a direction perpendicular to the tenth oxidation prevention film, or forming the groove and the power supply line in the reverse order, complete formation of the VC second anti-oxidation film on the heating resistor. It is something to do.

[Effect]

Since the heat ray emitting head obtained by the method described above has grooves formed in the substrate, there is an air layer around the center of the anti-oxidation film covering the heating resistor, and this air layer has extremely high thermal conductivity. As a result, the heat capacity of the heating resistor increases dramatically, and most of the heat generated by the heating resistor is transmitted toward both ends of the heating resistor.

Therefore, the entire heating resistor can be heated to high speed and high temperature with small power consumption, and the thermal isolation between each heating resistor is also excellent, and it is also possible to use a low-cost substrate with a low melting point. Therefore, it becomes possible to realize an inexpensive heat ray radiation head.

〔Example〕

Examples will be described below with reference to the drawings.

FIG. 1 is a manufacturing process diagram showing an embodiment of the method for manufacturing a heat ray radiation head according to the present invention, in which the heating resistor is manufactured at 12 dots/Wr! The case of a heat ray radiation head arranged in Vci rows on a substrate with a density of n will be described.

First, as shown in FIG. 1(,), 5i02. film? 10th antioxidant film material 2' and
.

Then, as shown in FIG. 1, a 52,000 mm thick layer of Ta2N is provided as a heating resistor material 3' by sputtering.

Then, Ni 'i 50 is deposited on this heating resistor main material 3'.
00λ vacuum evaporation, and a predetermined shape, for example, an S-shaped pattern, is formed with a resist on the heating resistor material 3' using a normal photolithography process, and then the Ni i H2soll,
Wet etching with HNO3 based etching solution.

Next, using the etched Ni pattern as a mask, etching the Ta2N, that is, the heating resistor material 3', and its lower side with an input power of 100 W using a parallel plate plasma etching apparatus using CF4 + O2 (5%) gas. 1st
The anti-oxidation film material 2' is etched until the surface of the glass substrate 10 is exposed, and as shown in FIG.
A tenth oxidation-preventing film 2 made of a zero oxidation-preventing film material 2' and a heat-generating resistor 3 made of a heat-generating resistor material 3' are patterned.

Next, as shown in FIG. 1(d), the feed line material 4'
As Ta and Aut''n500λ, 3000
A vacuum evaporation is performed, and then Au is coated to a thickness of 2 μm.

Then, a resist pattern is formed on the surface of this power supply line material 4' by a normal photolithography process, and etched with a "2-based Au etching solution and an HF (5%) aqueous solution.
As shown in the figure (,), a power supply line 4 connected to both ends of the VC heating resistor 3 is formed.

Next, in a normal photolithography process, as shown in FIG. 1(f) IC, the surface of the glass substrate 10 and the surface of the power supply line 4 are covered with a positive organic resist 5, except for the portion of the glass substrate 10 to be removed. Here, the portion of the glass substrate 10 to be removed is as follows:
This is a portion perpendicular to the tenth anti-oxidation film 2.

The glass substrate 1 thus prepared, together with the tenth antioxidant film 22, heat generating resistor 3, etc., is immersed in hot phosphoric acid at 200° C. for 10 minutes.

The relationship between etching depth and time using hot phosphoric acid at this time is shown in FIG.

As seen in this figure, the amount of etching of the tenth anti-oxidant film 2 by the glass substrate 1 and 5j02 is 45 μm for the glass substrate 1, 0.7 μm for the tenth anti-oxidant film 2, and 0.7 μm for the heating resistor 3 and the organic The power supply line 4 covered with the resist 5 does not dissolve. Incidentally, the positive type organic resist 5 leaves a circular island pattern on the surface, but is not dissolved.

Therefore, the glass substrate 1 under the tenth anti-oxidation film 2 is locally and largely dissolved, and as shown in FIG.
A groove 6 extending in a direction perpendicular to the anti-oxidation film 2 is formed.
Ru.

Next, the organic resist 5 is removed, and then FIG.
), a second 2 μm thick anti-oxidation film 7' made of vcSi02 on the surface of the VC heating resistor 3 is formed by sputtering so as to be connected to the tenth anti-oxidation film 2 to cover the entire wood of the heating resistor 3. Furthermore, a driving IC chip (not shown) for driving the heating resistor 3 is bonded onto the glass substrate 1 to form a heat ray radiation head.

FIG. 3 is a partial plan view of a heat ray emitting head obtained by the above-described manufacturing method. Because of this, there is an air layer with very poor thermal conductivity around the center of the tenth oxidation prevention film 2 and second oxidation prevention film T covering the heating resistor 3t, and therefore the cross-sectional area is very large. When the small heating resistor 3 generates heat, most of the heat is transmitted in the direction of the arrow shown in FIG. 3, and the heat capacity of the heating resistor 3 becomes dramatically smaller.

Therefore, each heat generating resistor 3 can be brought to a high temperature at high speed with a small amount of power supplied, and can be sufficiently used as a heat ray emitting head for writing information on a long wavelength photoreceptor.

In the above-mentioned embodiment, the groove 6 was formed after the feeder line 4 was formed, and then the anti-oxidation film T of the cylinder 2 was formed, but the groove 6 was formed before the feeder line 4 was formed. The power supply line 4 and the second anti-oxidation film T may be formed.

Furthermore, a head with a similar structure can be manufactured by using a silicon nitride substrate, which is easily dissolved by hot phosphoric acid like the glass substrate 1, in place of the glass substrate 10.

〔Effect of the invention〕

As explained above, in the present invention, the tenth oxidation preventing film and the heating resistor, which are hardly soluble in hot phosphoric acid, are formed into a predetermined shape by sputtering and etching processes on a substrate that is easily soluble in hot phosphoric acid. After that, a power supply line for supplying power to the heating resistor is formed on the substrate by an etching process, and a portion of the substrate below the tenth oxidation prevention film is etched by the etching process using hot phosphoric acid. After removing and forming a groove, a second oxidation prevention film is formed on the heating resistor, or after a tenth oxidation prevention film and an inner metal of the heating resistor are formed, the groove is formed, and then the power supply line is removed. Since a heat ray emitting head is manufactured by forming a second oxidation prevention film and then forming a second oxidation prevention film, the following effects can be obtained.

That is, in the heat ray emitting head obtained by the present manufacturing method, the heating resistor 12Ee is covered with an air layer with poor thermal conductivity around the central portions of the tenth antioxidant film and the second antioxidant film. The heat capacity of the heat generating element is dramatically reduced, the heat generating resistor can be made to generate VC heat at a high speed and at a high temperature with low power consumption, and the amount of heat ray radiation can be efficiently increased.

Furthermore, when a heating resistor generates heat, most of the heat is transferred toward both ends of the heating resistor, and almost none is transferred toward the adjacent heating resistors, so the heat between each heating resistor is Separability is also improved.

Furthermore, since the highest temperature on the board is near both ends of the heating resistor, the board material does not interfere with the manufacturing process.
The material may also be capable of withstanding the temperature near both ends of the heating resistor.

Therefore, even when used at high temperatures (approximately 1000 degrees Celsius) that generate large amounts of heat rays, it is possible to use commercially available, inexpensive substrates with low melting points, and the manufacturing process requires a Ni evaporation and photolithography process compared to conventional methods.

By simply adding an etching process using hot phosphoric acid and forming a resist pattern for the etching process, an inexpensive heat radiation head can be realized.

[Brief explanation of the drawing]

FIG. 1 is a manufacturing process diagram showing one embodiment of the method for manufacturing a heat ray radiation head according to the present invention, FIG. 2 is a diagram showing the relationship between etching depth and time using hot phosphoric acid in the embodiment of FIG. 1, and FIG. The figure is a partial cross-sectional view of a heat ray radiating head obtained by the embodiment of FIG. 1. 1. Glass substrate 2': 10th antioxidant film material 2: 1st
0 Anti-oxidation film 3'2 Heat generating resistor Main material 3: Heat generating resistor 4
′: Power supply line material 4: Power supply line 5: Organic resist 6: Groove 7: Second antioxidant film patent Applicant: Oki Electric Industry Co., Ltd. Agent Patent attorney: Takashi Kanakura 2. Manufacturing process showing an embodiment of the present invention Figure @11m1 Classification showing the relationship between etching depth and time with hot phosphoric acid @2 Partial plan view of the mouth head 3 [il Procedural amendment (voluntary) September 27, 1985

Claims (1)

[Claims] 1. On a substrate that easily dissolves in hot phosphoric acid, a first oxidation prevention film that hardly dissolves in hot phosphoric acid and a heating resistor are formed in layers, and the heating resistor After forming power supply lines connected to both ends of the body on the substrate, the substrate is etched with hot phosphoric acid to form a groove under the tenth oxidation prevention film, or the power supply line and the groove are formed. 1. A method for manufacturing a heat ray emitting head, characterized in that the steps are performed in the reverse order, and then a second oxidation prevention film is formed on the heating resistor.