JPS61283570A - Heat ray radiating head - Google Patents

Abstract

PURPOSE:To provide a heat ray radiating head excellent in thermal separation between heating resistors and low in cost, by a construction wherein heating resistors entirely covered by a an anti-oxidation film are provided on a substrate together with feeder lines for the resistors, and the substrate is provided with a groove on the lower side of the heating resistors. CONSTITUTION:The substrate 3 is provided with the groove 5 which is disposed on the lower side of the heating resistor 1 covered by the anti-oxidation film 4 and extends orthogonally to the resistor 1, whereby an air layer is provided in the vicinity of the film 4 at a central part of each heating resistor 1. Since the air layer is poor in thermal conductivity, the heat capacity of the resistor 1 is markedly improved, and almost all of the heat generated by the resistor is transmitted toward both ends of the resistor. Accordingly, the heating resistor can be rapidly brought to a high temperature with small power consumption, the thermal separation property between the heating resistors is excellent, and since an inexpensive substrate having a low melting point can be used, an inexpensive heat ray radiating head can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat ray emitting head that writes information on a photoreceptor by emitting heat rays such as infrared rays, near infrared rays, or visible rays.

[Conventional technology]

Conventional heat ray emitting heads of this kind have a structure in which a plurality of heating resistors for heat ray radiation are formed on a substrate such as glass, and the periphery of each heating resistor is covered with an anti-oxidation film.
By covering the heating resistors with an anti-oxidation film in this manner, each heating resistor can be made high-height and can be used as a head for writing information on a long wavelength photoreceptor having high sensitivity in the infrared region.

[Problem that the invention seeks to solve]

However, the conventional heat radiation head has a problem in that in order to write information by exposing the long wavelength photoreceptor, the power consumption of the heating resistor must be significantly increased.

The present invention was made to solve these problems, and it is possible to write information on a long wavelength photoreceptor by causing a heating resistor to generate high-speed and high-temperature VC heat with small power consumption, and to write information on a long wavelength photoreceptor. The object of this invention is to realize an inexpensive heat ray emitting head that has excellent thermal isolation between resistors.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention forms a heating resistor entirely covered with an oxidation prevention film on a substrate together with a power supply line that supplies power to the heating resistor, and A groove is provided so as to be located on the lower side.

[Effect]

By the above-mentioned method, an air layer is created around the central part of the anti-oxidation film covering the heat generating resistor.Since this air layer has poor thermal conductivity, the heat capacity within the heat generating resistor is dramatically increased, and the heat generation is reduced. Most of the heat generated by the resistor is transmitted toward both ends of the heat-generating resistor.

Therefore, the heating resistor can be operated at high speed and high speed with low power consumption.
In addition, the thermal isolation between each heating resistor is excellent, and a low-cost substrate with a low melting point can be used, making it possible to realize an inexpensive heat-radiating head. .

〔Example〕

Embodiments will be described below with reference to the drawings.

Fig. 1 is a sectional view of a main part showing an embodiment of a heat ray radiation head according to the present invention, and Fig. 2 is a plan view of the embodiment of Fig. 1. heating resistor,
2 is a power supply line connected to both ends of the heating resistor 1;
This power supply line 2 has a larger cross-sectional area than the heating resistor 1.

3 is a substrate, and a plurality of heating resistors 1 are patterned in parallel on this substrate 3 together with a power supply line 2. Each heating resistor 1 is made of a very thin oxide insulator with a thickness of, for example, 2 μm. The periphery of each is covered with a membrane 4.

5 is a groove, and this groove 5 is covered with the anti-oxidation film 4 as described above.
It is formed on the substrate so as to be located below the heat generating resistor 1 and extend perpendicularly to the heat generating resistor 1, and this prevents the oxidation prevention film from forming at the center of each heat generating resistor 1. The structure is such that there is an air layer around 4.

To begin with, the heat generating resistor 1 in the heat ray radiation head has a thickness of several thousand angstroms, and its cross-sectional area is extremely small. Further, from the viewpoint of strength, the anti-oxidation film 4 only needs to have a thickness of 2 μm, and the thermal conductivity of the anti-oxidation film 4 is poorer than that of an electrically conductive material, so that heat is not easily transmitted. Moreover, the thermal conductivity of the air layer is extremely poor at J/cm, s.

Therefore, in the heat ray emitting head of this embodiment with the above-described configuration, when the heating resistor 1 generates heat due to the electric power supplied from the power supply line 2, the heat is hardly transmitted to the air layer side.
The heat is not transmitted to both ends of each heating resistor 1,
Moreover, the heat capacity of the heat generating resistor 1 is dramatically reduced.

Therefore, it is possible to heat each heating resistor 1'jk to a high temperature with a small supply power, and it can be used as a heat ray emitting head for writing information on a long wavelength photoreceptor.

To explain a specific example, the heating resistor 1 is T, 2N.
, A 5i02 thin film was used as the anti-oxidation film 4 covering the Q thermal resistor 1, and a glass substrate made of quartz was used as the substrate 3.
A heat ray radiation head in which grooves 5 were formed in this glass substrate and a heat ray radiation head in which grooves 5 were not formed were created, and the temperature characteristics of the clear line radiation heads were compared.

According to experiments, the heat ray emitting head of the present invention having the grooves 5 consumes about 4 times less power than the heat ray emitting head without the grooves 5 to raise the heating resistor 1 to the same temperature.

Further, in the case of pulse driving, under the conditions of an application time of 0.3 m5 ec and a repetition period of 2 m5 ec, the heat ray emitting head of the present invention having grooves 5 is On the other hand, the heat ray emitting head without the groove 5 showed a history in which the temperature of the heating resistor 1 gradually increased from the first applied pulse to the 10th applied pulse. .

In the present invention, the highest temperature on the substrate 3 is near both ends of the heat generating resistor 1, and therefore the substrate material does not interfere with the manufacturing process and can withstand the temperature near both ends of the heat generating resistor 1. [Effects of the Invention] As explained above, the present invention provides an Af
By forming a CD thermal resistor on a glass substrate and providing a groove in the glass substrate so as to be located below the heating resistor, the periphery of the central portion of the anti-oxidation film covering the heating resistor is Because it is configured to form an air layer,
The heat capacity of the heat generating resistor is dramatically reduced, and the heat generating resistor can be heated to a high temperature at high speed with low power consumption, and the amount of heat ray radiation can be efficiently increased.

Furthermore, when a heating resistor generates heat, most of the heat moves toward both ends of the heating resistor and is hardly transmitted toward the adjacent heating resistors, so the heat between each heating resistor is The separability is also excellent, and the effect of becoming a 2"L vehicle can also be obtained.

Furthermore, since the highest temperature on the board is near both ends of the heating resistor, the board material does not interfere with the manufacturing process.
In addition, it only needs to be able to withstand the temperature near both ends of the heating resistor, and therefore it is possible to use a low-melting-point, low-cost substrate even when used at high temperatures (approximately 100°C) where a large amount of heat rays are generated. The effect of realizing an inexpensive heat ray radiation head is also obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part showing an embodiment of a heat ray radiation head according to the present invention, and FIG. 2 is a plan view thereof. 1: Heat generating resistor 2: Power supply line 3: Substrate 4 Anti-oxidation film 5: Groove Patent Applicant: Oki Electric Industry Co., Ltd. Agent Patent attorney: Takashi Kanakura 24 Insulating film Cross section showing one embodiment of the present invention l @ 1- Plan view of Figure 1 21 Procedural amendment (Mutsu) September 27, 1985

Claims (1)

[Claims] 1. A heating resistor for heat radiation covered with an antioxidant film,
A heat ray radiation head characterized in that the heat ray radiation head is formed on a substrate together with a power supply line for feeding power to the heat generating resistor, and a groove is provided in the substrate so as to be located below the heat generating resistor.