JPH0615242B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0615242B2 JPH0615242B2 JP61019625A JP1962586A JPH0615242B2 JP H0615242 B2 JPH0615242 B2 JP H0615242B2 JP 61019625 A JP61019625 A JP 61019625A JP 1962586 A JP1962586 A JP 1962586A JP H0615242 B2 JPH0615242 B2 JP H0615242B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- conductor lead
- substrate
- conductor leads
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はサーマルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a thermal head.
［従来の技術］ 従来のサーマルヘッドにおいては、基板上に設けた発熱
抵抗体のそれぞれから導出される導体リードが単層構造
であり、これによって駆動回路と接続していた。[Prior Art] In the conventional thermal head, the conductor leads derived from each of the heating resistors provided on the substrate have a single-layer structure, and are connected to the drive circuit.
［発明が解決しようとする問題点］ 上記のものでは、ドット密度を高める目的で発熱抵抗体
の数を多くした場合、導体リードおよびこのリード間を
狭くするか基板自体を大きくする必要がある。導体リー
ドおよびこのリード間隔を狭くした場合、フレキシブル
プリント基板との接続が難しくなり、量産性および信頼
性が低下する。一方、基板自体を大きくした場合、基板
コストが高くなるとともに小形化が難しい。[Problems to be Solved by the Invention] In the above, when the number of heating resistors is increased for the purpose of increasing the dot density, it is necessary to narrow the conductor leads and the spaces between the leads or to enlarge the substrate itself. When the conductor lead and the lead interval are narrowed, it becomes difficult to connect the conductor lead and the flexible printed circuit board, and mass productivity and reliability are deteriorated. On the other hand, when the size of the substrate itself is increased, the cost of the substrate increases and it is difficult to reduce the size.
本発明は、ヘッドを大きくすることなく導体リードの密
度を高くでき、しかも導体リードの間隔を大きくとれる
サーマルヘッドを提供するものである。The present invention provides a thermal head in which the density of conductor leads can be increased without increasing the size of the head, and the distance between conductor leads can be increased.
［問題点を解決するための手段］ 本発明は、個々の発熱抵抗体から引き出す導体リードを
積層構造にし、所定数おきの導体リードを同層に形成す
ることにより、上記目的を達成するものである。[Means for Solving the Problems] The present invention achieves the above object by forming a conductor lead drawn from each heating resistor in a laminated structure and forming a predetermined number of conductor leads in the same layer. is there.
［実施例］ 第１図において、基板Ｂ上には発熱抵抗体ｔ１〜ｔ６を
設けてあり、それぞれの一端は共通電極である導体層Ａ
に接続してある。この基板Ｂ上には発熱抵抗体に一つお
きに接続した第１の導体リードＣ１〜Ｃ３を形成してあ
る。そしてこの導体リードＣ１〜Ｃ３上に第３図のよう
に絶縁層Ｄを形成した後、第２図の第２の導体リードＣ
４〜Ｃ６を形成し、それぞれ第１図の発熱抵抗体ｔ２，
ｔ４，ｔ６に接続する。導体リードＣ４，Ｃ５，Ｃ６の
他端側は導体リードＣ１，Ｃ２，Ｃ３より短くしてお
き、フレキシブルプリント基板との接続のため導体リー
ドＣ１，Ｃ２，Ｃ３の端部を露出させておく。また上記
構成の上に、導体リードＣ４，Ｃ５，Ｃ６の端部を露出
させて、第４図のように保護膜Ｅが形成する。したがっ
て各導体リードの端部が第５図に示すように階段上に露
出し、フレキシブルプリント基板とのコネクタ部が構成
される。この場合、第６図のようにフレキシブルプリン
ト基板Ｆも同様に、コネクタ部を階段上に形成してお
き、ヘッドのコネクタ部と異方導電性接着剤あるいは半
田付けによって接続するものである。なお上記の例で
は、２層構造の例について説明したが、３層以上に積層
してもよい。例えば３層の場合、導体リードを２つおき
に同層となるように積層するものである。[Embodiment] In FIG. 1, heat generating resistors t 1 to t 6 are provided on a substrate B, and one end of each of them is a conductor layer A which is a common electrode.
Connected to. On this substrate B, first conductor leads C 1 to C 3 connected to every other heating resistor are formed. After forming the insulating layer D on the conductor leads C 1 to C 3 as shown in FIG. 3, the second conductor lead C shown in FIG. 2 is formed.
4 to C 6 are formed, and the heating resistors t 2 and t 2 of FIG.
Connect to t 4 and t 6 . The other end of the conductor leads C 4, C 5, C 6 is leave shorter than conductor leads C 1, C 2, C 3, conductor lead C 1 for connection with the flexible printed circuit board, the C 2, C 3 Leave the ends exposed. Further, the protective film E is formed on the above structure by exposing the ends of the conductor leads C 4 , C 5 , and C 6 as shown in FIG. Therefore, the end of each conductor lead is exposed on the stairs as shown in FIG. 5, and the connector portion with the flexible printed circuit board is formed. In this case, similarly to the flexible printed circuit board F as shown in FIG. 6, the connector portion is also formed on the stairs and is connected to the connector portion of the head by an anisotropic conductive adhesive or soldering. In addition, although the example of the two-layer structure has been described in the above example, three or more layers may be stacked. For example, in the case of three layers, every two conductor leads are laminated so as to be the same layer.
［発明の効果］ 本発明によれば、各発熱抵抗体から個々に導出する導体
リードを所定数おきに同層となるように積層構造にした
ので、ヘッドを大きくすることなく、導体リードの間隔
を大きくすることができ、信頼性の高いコネクティング
を行うことができる。しかも導体リードを形成するため
のエッチングが容易に行え、高度な技術を必要としな
い。換言すると、ヘッドサイズを変えずにドット数をふ
やすことができる。EFFECTS OF THE INVENTION According to the present invention, since the conductor leads individually led out from the respective heating resistors have a laminated structure so as to form the same layer at a predetermined number, the interval between the conductor leads can be increased without enlarging the head. Can be increased, and highly reliable connecting can be performed. In addition, the etching for forming the conductor leads can be easily performed, and no high technology is required. In other words, the number of dots can be increased without changing the head size.
第１図は基板に第１の導体リードを形成した状態を示し
た平面図、第２図は第２の導体リードの一例を示した平
面図、第３図は第１図III−III線断面図、第４図は保護
膜を形成した状態を示した平面図、第５図は第４図の正
面図、第６図はフレキシブルプリント基板の一例を示し
た正面図である。 Ｂ……基板 Ｃ１〜Ｃ３……第１の導体リード Ｃ４〜Ｃ６……第２の導体リード ｔ１〜ｔ６……発熱抵抗体FIG. 1 is a plan view showing a state in which a first conductor lead is formed on a substrate, FIG. 2 is a plan view showing an example of a second conductor lead, and FIG. 3 is a sectional view taken along line III-III in FIG. FIG. 4 is a plan view showing a state in which a protective film is formed, FIG. 5 is a front view of FIG. 4, and FIG. 6 is a front view showing an example of a flexible printed board. B ...... substrate C 1 ~C 3 ...... first conductor lead C 4 ~C 6 ...... second conductor leads t 1 ~t 6 ...... heating resistor
Claims (1)
の上記発熱抵抗体の他端側にそれぞれ接続された第１の
導体リードと、 この第１の導体リードを被覆する絶縁層と、 この絶縁層上に形成され、上記第１の導体リードが接続
されていない発熱抵抗体の他端側にそれぞれ接続された
第２の導体リードと を具備したことを特徴とするサーマルヘッド。1. A common electrode formed on a substrate, a plurality of heating resistors whose one ends are connected to the common electrode, and a common electrode formed on the substrate in the same layer as the common electrode. A first conductor lead connected to the other end of the resistor, an insulating layer covering the first conductor lead, and a first conductor lead formed on the insulating layer and not connected to the first conductor lead And a second conductor lead connected to the other end side of the heating resistor, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61019625A JPH0615242B2 (en) | 1986-01-31 | 1986-01-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61019625A JPH0615242B2 (en) | 1986-01-31 | 1986-01-31 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62178360A JPS62178360A (en) | 1987-08-05 |
| JPH0615242B2 true JPH0615242B2 (en) | 1994-03-02 |
Family
ID=12004376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61019625A Expired - Fee Related JPH0615242B2 (en) | 1986-01-31 | 1986-01-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0615242B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4744372B2 (en) * | 2006-06-26 | 2011-08-10 | 中国電力株式会社 | Inspection device for floating detector |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149472A (en) * | 1984-01-17 | 1985-08-06 | Rohm Co Ltd | Thermal printing head |
| JPS60117152U (en) * | 1984-01-17 | 1985-08-08 | ロ−ム株式会社 | thermal printing head |
-
1986
- 1986-01-31 JP JP61019625A patent/JPH0615242B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62178360A (en) | 1987-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |