JPS60217173A - Thermal printing head - Google Patents
Thermal printing headInfo
- Publication number
- JPS60217173A JPS60217173A JP7374184A JP7374184A JPS60217173A JP S60217173 A JPS60217173 A JP S60217173A JP 7374184 A JP7374184 A JP 7374184A JP 7374184 A JP7374184 A JP 7374184A JP S60217173 A JPS60217173 A JP S60217173A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- heating resistor
- backflow prevention
- driver element
- current backflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野１
本発明は、感熱記録式の記録装置（プリンタ、ファクシ
ミリ等）に使用されるサーマルプリントヘッドに関する
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a thermal print head used in a thermal recording type recording device (printer, facsimile, etc.).
［従来技術］
第１図に示すように、絶縁性基板１上の略中央部に蓄熱
層２を形成し、この蓄熱層２上に発熱抵抗体３を設置す
ると共に、発熱抵抗体３の一側の絶縁性基板１上にドラ
イバー素子４を搭載し、他側に電流逆流防止素子５を搭
載したサーマルプリントヘッド６は従来上り知られてい
る。[Prior Art] As shown in FIG. 1, a heat storage layer 2 is formed approximately at the center of an insulating substrate 1, a heating resistor 3 is placed on the heat storage layer 2, and a portion of the heating resistor 3 is A thermal print head 6 in which a driver element 4 is mounted on one side of the insulating substrate 1 and a current backflow prevention element 5 is mounted on the other side is well known.
上記発熱抵抗体３からは、その長手方向と直交する方向
に引出電極７ａ、７ｂ・・・と引出電極８ａｔ８ｂ・・
・とが互いに半ピツチだけずらせて逆方向に引出されて
おり、−側の引出電極７ａ、７ｂ・・・の外方端はドラ
イバー素子４に、他側の引出電極８ａ、８ｂ・・・の外
方端は電流逆流防止素子５に、夫々ワイヤーボンディン
グ、チップキャリア、フィルムキャリヤ等の手段により
接続されている。そして、ドライバー素子４と電流逆流
防止素子５は、夫々、端子９・・・、１０・・・と、ワ
イヤーボンディング、チップキャリア、フィルムキャリ
ア等の手段で接続され、これら端子９・・・、１０・・
・はＦＰＣ（ｆ！ｅｘｉｂｌｅ ｐｒｉｎｔｅｄ ｃｉ
ｒｃｕｉｔ ｌ＋ｏａｒｄ・・・ｌＪ示せず。）等の接
続部材を介してサーマルプリントへラド６を駆動制御す
る外部装置に接続される。From the heating resistor 3, lead electrodes 7a, 7b, . . . and lead electrodes 8at8b, .
・The outer ends of the extraction electrodes 7a, 7b... on the negative side are connected to the driver element 4, and the outer ends of the extraction electrodes 8a, 8b... on the other side are The outer ends are respectively connected to the current backflow prevention element 5 by means such as wire bonding, chip carrier, film carrier, etc. The driver element 4 and the current backflow prevention element 5 are respectively connected to terminals 9..., 10... by wire bonding, a chip carrier, a film carrier, etc., and these terminals 9..., 10...・・・
・FPC (f!exible printed ci
rcuit l+oard...lJ not shown. ) is connected to an external device that drives and controls the RAD 6 to the thermal print.
上記のサーマルプリントヘッド６において、いま外部装
置の指令により、引出電極８ａ、？ａ間で電流逆流防止
索子５からドライバー素子４ｉ１１１１へ印字電流が通
電されると、発熱抵抗体３の発熱部分３ａ（便宜上ハツ
チングで示す。）で、その印字電流がジュール熱に変換
され、発熱部分３ａが発熱する。それにより発熱部分３
ａ近傍の感熱記録紙（図示せず。）に微小な印字ドツト
が熱印される。In the thermal print head 6 described above, the extraction electrode 8a, ? When a printing current is applied from the current backflow prevention cable 5 to the driver element 4i1111 between the points 1 and 3a, the printing current is converted into Joule heat at the heating portion 3a of the heating resistor 3 (shown by hatching for convenience), and heat is generated. Part 3a generates heat. As a result, the heating part 3
A minute print dot is thermally printed on a thermal recording paper (not shown) near a.
又、引出電極８ｂ、７ａ開に印字電流が通電されると、
発熱抵抗体３の発熱部分３ｂが発熱する。Moreover, when the printing current is applied to the extraction electrodes 8b and 7a,
The heat generating portion 3b of the heat generating resistor 3 generates heat.
そして、感熱記録紙を発熱抵抗体３の長手方向と直角な
方向に移送しながら所定の位置に順次印字ドツトを熱印
することによ１）、感熱記録紙上に所望の文字、図形等
を記録することができる。Desired characters, figures, etc. are recorded on the thermal recording paper by 1) thermally printing dots in predetermined positions one after another while transporting the thermal recording paper in a direction perpendicular to the longitudinal direction of the heating resistor 3. can do.
ところが、上記従来の構成では、サーマルプリントヘッ
ド６のドライバー素子４と電流逆流防止素子５とが、発
熱抵抗体３を挟む絶縁性基板１の両端部に配置されてい
るので、発熱抵抗体３を絶縁性基板１の端部に配置する
ことは不可能で外部装置との接続用の端子９・・・、１
０・・・が絶縁性基板１の両端部に分かれることになる
。それによりサーマルプリントヘッド６と外部装置との
接続が煩雑になると共に、ＦＰＣ等の接続部材（図示せ
ず。）の構造が複雑になる問題がある。However, in the conventional configuration described above, the driver element 4 and the current backflow prevention element 5 of the thermal print head 6 are arranged at both ends of the insulating substrate 1 that sandwich the heat generating resistor 3, so that the heat generating resistor 3 is Terminals 9..., 1 for connection with external devices cannot be placed at the edge of the insulating substrate 1.
0... are divided into both ends of the insulating substrate 1. This poses a problem in that the connection between the thermal print head 6 and the external device becomes complicated, and the structure of a connecting member (not shown) such as an FPC becomes complicated.
その対策として、電流逆流防止素子５を用いず引出電極
８ａ、８ｂ・・・に代えて、略櫛形の共通電極１１（第
２図参照）を使用して一側の接続用端子を省略し、ドラ
イバー素子１２側の接続用端子１５のみを外部装置（図
示せず。）と接続するようにして、接続用端子１５を発
熱抵抗体１４の一側に集め、発熱抵抗体１４を絶縁性基
板１６の端部に配置したものが提案されている。As a countermeasure, the current backflow prevention element 5 is not used, and a substantially comb-shaped common electrode 11 (see FIG. 2) is used instead of the extraction electrodes 8a, 8b, . . . , and the connection terminal on one side is omitted. Only the connection terminals 15 on the driver element 12 side are connected to an external device (not shown), and the connection terminals 15 are gathered on one side of the heating resistor 14, and the heating resistor 14 is connected to the insulating substrate 16. It has been proposed to place it at the end of the
ところが、その場合は、共通電極１１から一本の引出電
極１３を介してドライバー素子１２側に印字電流を通電
すると、その引出電極１３の両側の共通電極１１の引出
端１１ａ、ｌｌａに電流が流れて２個の発熱部分１４ａ
＋１４ａが同時に発熱されることになる。それにより、
個々の印字ドツトの幅が倍増して（ドツト数が半減し）
印字品質が低下し、感熱記録紙に記録される文字等が不
鮮明になる問題がある。However, in that case, when a printing current is applied from the common electrode 11 to the driver element 12 side via one extraction electrode 13, the current flows to the extraction ends 11a and lla of the common electrode 11 on both sides of the extraction electrode 13. two heat generating parts 14a
+14a will generate heat at the same time. Thereby,
The width of each printed dot is doubled (the number of dots is halved)
There is a problem that the print quality deteriorates and the characters etc. recorded on the thermal recording paper become unclear.
［発明の目的１
本発明は、ドライバー素子と電流逆流防止素子とを絶縁
性基板上の一側に塔載することにより、発熱抵抗体を絶
縁性基板の端部に配置し、又、ドライバー素子と電流逆
流防止素子のそれぞれに接続された外部装置との接続用
端子を近接配置しうるよう１こすることを目的としてい
る。[Objective of the Invention 1] The present invention provides a driver element and a current backflow prevention element that are mounted on one side of an insulating substrate, thereby arranging a heating resistor at the end of the insulating substrate. The purpose of this invention is to arrange terminals for connection with external devices connected to each of the current backflow prevention element and the current backflow prevention element in close proximity to each other.
［発明の構成１
このため、本発明では、蓄熱層を電気絶縁層として使用
し、発熱抵抗体からの一方の引出電極を蓄熱層の裏面側
に廻り込ませて引出電極を２層に構成することにより、
発熱抵抗体を絶縁性基板の端部に配置し、ドライバー素
子及び電流逆流防止素子を上記発熱抵抗体に対し同一側
の絶縁性基板上に搭載すると共に、ドライバー素子及び
電流逆流防止素子のそれぞれに接続された外部装置との
接続用端子を画素子の対向面に近接配設したことを特徴
としている。[Configuration 1 of the Invention For this reason, in the present invention, the heat storage layer is used as an electrical insulating layer, and one lead-out electrode from the heating resistor is wrapped around the back side of the heat-storage layer to constitute the lead-out electrode in two layers. By this,
The heating resistor is placed at the end of the insulating substrate, the driver element and the current backflow prevention element are mounted on the insulating substrate on the same side as the heating resistor, and the driver element and the current backflow prevention element are each mounted. It is characterized in that a terminal for connection to a connected external device is disposed close to the opposing surface of the pixel element.
［発明の効果１
本発明によると、外部装置と接続されるドライバー素子
と電流逆流防止素子とを絶縁性基板上の一側に塔載する
ことがでｂるので、発熱抵抗体を、絶縁性基板の端部に
配置できるようになり、外部装置との接続用の端子を近
接配置することができる。それによって、サーマルプリ
ントヘッドと外部装置との接続が容易になると共に、接
続部材の構造も簡素化で塾る。[Effect of the invention 1] According to the present invention, the driver element connected to an external device and the current backflow prevention element can be mounted on one side of the insulating substrate. It can now be placed at the edge of the board, and terminals for connection to external devices can be placed nearby. This facilitates the connection between the thermal print head and an external device, and also simplifies the structure of the connection member.
又、本発明では、ドライバー素子側の引出電極と、電流
逆流防止素子側の引出電極とを１対１に対応させること
ができるので、発熱抵抗体の各発熱部分を夫々独立に発
熱させることができる。従って本発明では、サーマルプ
リントヘッドの印字品質が低下する不具合は生じない。Further, in the present invention, since the lead electrode on the driver element side and the lead electrode on the current backflow prevention element side can be made to correspond one-to-one, each heat-generating portion of the heat-generating resistor can be made to generate heat independently. can. Therefore, in the present invention, the problem of deterioration in print quality of the thermal print head does not occur.
［実施例１ 次に図面に基づいて本発明の一実施例を説明する。[Example 1 Next, one embodiment of the present invention will be described based on the drawings.
すなわち、正面図である第３図において、サーマルプリ
ントヘッドの絶縁性基板２１上には、蓄熱層２２が形成
され、蓄熱層２２上の一側の端縁部に片寄せて発熱抵抗
体２３が配置されている。That is, in FIG. 3 which is a front view, a heat storage layer 22 is formed on an insulating substrate 21 of the thermal print head, and a heat generating resistor 23 is disposed on one edge of the heat storage layer 22. It is located.
発熱抵抗体２３に関して絶縁性基板２１の広面側部分２
１ａに対応する蓄熱層２２上には、ドライバー素子２４
と電流逆流防止素子２５とが適当な間隔を保って設置さ
れている６
発熱抵抗体２３から蓄熱層２２の表面２２ａ上に引出し
電極２６・・・が等ピッチで横断方向に引き出され、従
来同様の手段でドライバー素子２４に接続されている。Wide side portion 2 of the insulating substrate 21 with respect to the heating resistor 23
A driver element 24 is provided on the heat storage layer 22 corresponding to 1a.
and a current backflow prevention element 25 are installed at appropriate intervals 6. Extracting electrodes 26 are drawn out from the heating resistor 23 onto the surface 22a of the heat storage layer 22 in the transverse direction at equal pitches, as in the conventional case. It is connected to the driver element 24 by means of.
一方、第４図にも示すように、発熱抵抗体２３からの他
側の引出電極２７・・・は上記引出電極２６・・・に対
し、半ピツチだけずらせて形成され、蓄熱層２２の表面
２２ａで基板２１の狭面２ｉｂ側に〜
引出され、蓄熱層２２の裏面２２ｂ側に配設された引出
電極の裏面部分２７ａと、Ｂ部で接続され、裏面部分２
７ａは裏面２２ｂを横断して蓄熱層２２からの突出部分
２７ｂと０部で接続され、突出部分２７ｂは電流逆流防
止素子２５と、従来同様の手段で接続される。この引出
電極２７・・・の裏面部分２７ａ・・・は絶縁性基板２
１に予め形成しておけばよい。又、蓄熱層２２の表面２
２ａ側の引出電極２６・・・と裏面２２ｂに廻り込む引
出電極２７・・・とは蓄熱層２２によって相互に絶縁さ
れる。On the other hand, as shown in FIG. 4, the extraction electrodes 27 on the other side from the heating resistor 23 are formed to be shifted by half a pitch with respect to the extraction electrodes 26 . 22a to the narrow surface 2ib side of the substrate 21, and is connected to the back surface portion 27a of the extraction electrode disposed on the back surface 22b side of the heat storage layer 22 at the B portion, and the back surface portion 2
7a crosses the back surface 22b and is connected to a protruding portion 27b from the heat storage layer 22 at the 0 part, and the protruding portion 27b is connected to the current backflow prevention element 25 by the same conventional means. The back surface portion 27a of the extraction electrode 27 is connected to the insulating substrate 2.
1 may be formed in advance. Moreover, the surface 2 of the heat storage layer 22
The extraction electrodes 26 on the 2a side and the extraction electrodes 27 extending around the back surface 22b are insulated from each other by the heat storage layer 22.
発熱抵抗体２３に対し同一側の蓄熱層２２上に搭載され
たドライバー素子２４と電流逆流防止素子２５の対向面
には、夫々と、従来同様の手段で接続された端子３１・
・・、３２・・・が付設され、これら端子３１・・・、
３２・・・はＦＰＣ等を介して外部装置（図示せず。）
に接続される。On the opposing surfaces of the driver element 24 and the current backflow prevention element 25, which are mounted on the heat storage layer 22 on the same side with respect to the heating resistor 23, there are terminals 31 and 31, respectively, connected by conventional means.
..., 32... are attached, and these terminals 31...,
32... is an external device (not shown) via FPC etc.
connected to.
そして本発明では、外部装置との接続用の端子３１・・
・、３２・・・が近接配置されるので、サーマルプリン
トヘッドと外部装置との接続が極めて容易に行なえ、Ｆ
ＰＣ等の接続部材の構造が簡素化でｂる。In the present invention, the terminal 31 for connection with an external device...
, 32... are arranged in close proximity to each other, making it extremely easy to connect the thermal print head to external devices.
The structure of connecting members such as PCs is simplified.
又、本発明では、ドライバー素子２４＠の任意の引出電
極２６と、当該引出電極２６に相隣る電流逆流防止素子
２５側の引出電極２７．２７のいずれか一方のみとの間
に通電することができるので、印字ドツトは、第１図の
従来例の場合と同様、引出電極２６又は２７の半ピツチ
を単位とすることができ、必要な印字品質を確保するこ
とができる。 なお、本発明を具体化するに当り、ドラ
イバー素子２４と電流逆流防止素子２５の配置を入替え
ることもできる。Further, in the present invention, current may be passed between any extraction electrode 26 of the driver element 24 @ and only one of the extraction electrodes 27 and 27 on the side of the current backflow prevention element 25 adjacent to the extraction electrode 26. Therefore, as in the case of the conventional example shown in FIG. 1, printing dots can be set in units of half pitches of the extraction electrodes 26 or 27, and the necessary printing quality can be ensured. In addition, in embodying the present invention, the arrangement of the driver element 24 and the current backflow prevention element 25 can be exchanged.
第１図、第２図は従来例の正面図、第３図は本発明によ
るサーマルプリントヘッドの正面図、第４図は第３図の
Ａ−Ａ断面図である。
２１・・・絶縁性基板、 ２２・・・蓄熱層、２３・・
・発熱抵抗体、 ２４・・・ドライバー素子、２５・・
・電流逆流防止素子、
２６．２７・・弓１出電極、 ３１，３２・・・端子。
特許出願人 シャープ株式会社1 and 2 are front views of a conventional example, FIG. 3 is a front view of a thermal print head according to the present invention, and FIG. 4 is a sectional view taken along line AA in FIG. 3. 21... Insulating substrate, 22... Heat storage layer, 23...
・Heating resistor, 24...driver element, 25...
・Current backflow prevention element, 26.27... Bow 1 output electrode, 31, 32... Terminal. Patent applicant Sharp Corporation
Claims (1)
層と、該蓄熱層上に設けられた発熱抵抗体と、上記絶縁
性基板上に搭載され、発熱抵抗体から互いに逆方向に引
出された引出電極を介して発熱抵抗体に接続されたドラ
イバー素子及び電流逆流防止素子と、外部装置との接続
用に上記°ドライバー素子と電流逆流防止素子に接続し
て設けられた端子とから少なくとも構成されるサーマル
プリントヘッドにおいて、 蓄熱層を絶縁層としても使用し、一方の引出電極を蓄熱
層の裏面側に廻り込ませて引出電極を２層に構成するこ
とにより、発熱抵抗体を絶縁性基板の端部に配置し、ド
ライバー素子及び電流逆流防止素子を上記発熱抵抗体に
対し同一側の絶縁性基板上に搭載すると共に、ドライバ
ー素子及び電流逆流防止素子のそれぞれと接１＆された
端子を画素子の対向面に配設したことを特徴とするサー
マルプリントヘッド。(1) An insulating substrate, a heat storage layer formed on the insulating substrate, a heating resistor provided on the heat storage layer, and a heating resistor mounted on the insulating substrate in opposite directions from the heating resistor. A driver element and a current backflow prevention element connected to the heating resistor through an extraction electrode drawn out to the terminal, and a terminal connected to the driver element and current backflow prevention element for connection with an external device. In a thermal print head configured at least of The driver element and the current backflow prevention element are placed on the end of the insulating substrate, and the driver element and the current backflow prevention element are mounted on the insulating substrate on the same side with respect to the heating resistor, and the driver element and the current backflow prevention element are connected to each other. A thermal print head characterized by having terminals arranged on a surface opposite to a pixel element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7374184A JPS60217173A (en) | 1984-04-11 | 1984-04-11 | Thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7374184A JPS60217173A (en) | 1984-04-11 | 1984-04-11 | Thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60217173A true JPS60217173A (en) | 1985-10-30 |
Family
ID=13526967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7374184A Pending JPS60217173A (en) | 1984-04-11 | 1984-04-11 | Thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60217173A (en) |
-
1984
- 1984-04-11 JP JP7374184A patent/JPS60217173A/en active Pending
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