JPS61168679U - - Google Patents

Info

Publication number
JPS61168679U
JPS61168679U JP5248385U JP5248385U JPS61168679U JP S61168679 U JPS61168679 U JP S61168679U JP 5248385 U JP5248385 U JP 5248385U JP 5248385 U JP5248385 U JP 5248385U JP S61168679 U JPS61168679 U JP S61168679U
Authority
JP
Japan
Prior art keywords
layer
glass insulator
crystalline
thick
insulator layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5248385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5248385U priority Critical patent/JPS61168679U/ja
Publication of JPS61168679U publication Critical patent/JPS61168679U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の実施例であるICドライバ搭載
形サーマルヘツドの断面図である。 〔符号の説明〕、1…多層配線部分、2…発熱
部分、3…アルミナ基板、4…高融点グレーズ層
、5…第1導体層、6…結晶質ガラス絶縁体層、
7…ポリイミド樹脂層、8…発熱抵抗体層、9…
第2導体層、10…駆動用IC(能動素子)、1
1…発熱点(発熱素子)。
The drawing is a sectional view of an IC driver-equipped thermal head which is an embodiment of the present invention. [Explanation of symbols] 1... Multilayer wiring part, 2... Heat generating part, 3... Alumina substrate, 4... High melting point glaze layer, 5... First conductor layer, 6... Crystalline glass insulator layer,
7... Polyimide resin layer, 8... Heat generating resistor layer, 9...
Second conductor layer, 10...Driver IC (active element), 1
1...Heating point (heating element).

Claims (1)

【実用新案登録請求の範囲】 結晶質ガラス絶縁体層6を最上層に形成した厚
膜回路上に薄膜回路を形成する厚膜,薄膜の混成
多層配基板であつて、 前記厚膜の結晶質ガラス絶縁体層6上に耐熱樹
脂層7が形成されていることを特徴とする多層配
線基板。
[Claims for Utility Model Registration] A hybrid multilayer circuit board of thick and thin films in which a thin film circuit is formed on a thick film circuit with a crystalline glass insulator layer 6 formed as the top layer, wherein the thick film is crystalline. A multilayer wiring board characterized in that a heat-resistant resin layer 7 is formed on a glass insulator layer 6.
JP5248385U 1985-04-09 1985-04-09 Pending JPS61168679U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5248385U JPS61168679U (en) 1985-04-09 1985-04-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5248385U JPS61168679U (en) 1985-04-09 1985-04-09

Publications (1)

Publication Number Publication Date
JPS61168679U true JPS61168679U (en) 1986-10-20

Family

ID=30572475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5248385U Pending JPS61168679U (en) 1985-04-09 1985-04-09

Country Status (1)

Country Link
JP (1) JPS61168679U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265660A (en) * 1987-04-24 1988-11-02 Pentel Kk Thermal head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341190A (en) * 1976-08-27 1978-04-14 Ibm Method of improving adhesion to polyimide layer of metallic layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341190A (en) * 1976-08-27 1978-04-14 Ibm Method of improving adhesion to polyimide layer of metallic layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265660A (en) * 1987-04-24 1988-11-02 Pentel Kk Thermal head

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