JPS61168679U - - Google Patents
Info
- Publication number
- JPS61168679U JPS61168679U JP5248385U JP5248385U JPS61168679U JP S61168679 U JPS61168679 U JP S61168679U JP 5248385 U JP5248385 U JP 5248385U JP 5248385 U JP5248385 U JP 5248385U JP S61168679 U JPS61168679 U JP S61168679U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- glass insulator
- crystalline
- thick
- insulator layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
図面は本考案の実施例であるICドライバ搭載
形サーマルヘツドの断面図である。
〔符号の説明〕、1…多層配線部分、2…発熱
部分、3…アルミナ基板、4…高融点グレーズ層
、5…第1導体層、6…結晶質ガラス絶縁体層、
7…ポリイミド樹脂層、8…発熱抵抗体層、9…
第2導体層、10…駆動用IC(能動素子)、1
1…発熱点(発熱素子)。
The drawing is a sectional view of an IC driver-equipped thermal head which is an embodiment of the present invention. [Explanation of symbols] 1... Multilayer wiring part, 2... Heat generating part, 3... Alumina substrate, 4... High melting point glaze layer, 5... First conductor layer, 6... Crystalline glass insulator layer,
7... Polyimide resin layer, 8... Heat generating resistor layer, 9...
Second conductor layer, 10...Driver IC (active element), 1
1...Heating point (heating element).
Claims (1)
膜回路上に薄膜回路を形成する厚膜,薄膜の混成
多層配基板であつて、 前記厚膜の結晶質ガラス絶縁体層6上に耐熱樹
脂層7が形成されていることを特徴とする多層配
線基板。[Claims for Utility Model Registration] A hybrid multilayer circuit board of thick and thin films in which a thin film circuit is formed on a thick film circuit with a crystalline glass insulator layer 6 formed as the top layer, wherein the thick film is crystalline. A multilayer wiring board characterized in that a heat-resistant resin layer 7 is formed on a glass insulator layer 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5248385U JPS61168679U (en) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5248385U JPS61168679U (en) | 1985-04-09 | 1985-04-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61168679U true JPS61168679U (en) | 1986-10-20 |
Family
ID=30572475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5248385U Pending JPS61168679U (en) | 1985-04-09 | 1985-04-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61168679U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265660A (en) * | 1987-04-24 | 1988-11-02 | Pentel Kk | Thermal head |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5341190A (en) * | 1976-08-27 | 1978-04-14 | Ibm | Method of improving adhesion to polyimide layer of metallic layer |
-
1985
- 1985-04-09 JP JP5248385U patent/JPS61168679U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5341190A (en) * | 1976-08-27 | 1978-04-14 | Ibm | Method of improving adhesion to polyimide layer of metallic layer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63265660A (en) * | 1987-04-24 | 1988-11-02 | Pentel Kk | Thermal head |
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