JPS61283454A - Solder plating method - Google Patents

Solder plating method

Info

Publication number
JPS61283454A
JPS61283454A JP12377685A JP12377685A JPS61283454A JP S61283454 A JPS61283454 A JP S61283454A JP 12377685 A JP12377685 A JP 12377685A JP 12377685 A JP12377685 A JP 12377685A JP S61283454 A JPS61283454 A JP S61283454A
Authority
JP
Japan
Prior art keywords
solder
lead frame
cylinder
frame
solder plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12377685A
Other languages
Japanese (ja)
Inventor
Tadaaki Sato
忠明 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP12377685A priority Critical patent/JPS61283454A/en
Publication of JPS61283454A publication Critical patent/JPS61283454A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the generation of blob- and icicle-shaped solder flashes to the lower part of a lead frame in the case of immersing the lead frame into a solder tank and subjecting the same to solder plating by pulling up the lead frame in an inclined posture from the solder tank. CONSTITUTION:Both ends of the lead frame 5 are clamped by clamps 4 and the lead frame is immersed into a solder bath 6 at the equal descending speed of cylinders 2a, 2b in the stage of subjecting the lead frame to solder plating. The ascending speed of the cylinder 2a is thereafter so controlled as to be made slightly higher than the ascending speed of the cylinder 2b so that said cylinder is slowly raised. The lead frame 5 successively ascends in the diagonal state toward the upper right side and the solder trying to remain in the lower part of the frame 5 flows toward the lower left along the bottom surface of the frame 5 and is recovered into the solder bath 6. The solder plating having a uniform thickness is thereby formed over the entire part of the lead frame at the point of the time when the pull up is completed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体製造工程において半製品であるリードフ
レームを浸漬方式により半田メッキを行なう方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of solder plating a semi-finished lead frame in a semiconductor manufacturing process by a dipping method.

〔従来の技術〕[Conventional technology]

従来、この種の半田メッキ方法としては第２図に示す如
くベース１に固定されたシリンダー２の先端に取付けら
れているフラング４により　ＩＪ−ドフレーム５を水平
に固定し、これを溶融している半田浴６の中へ浸漬し、
一定時間経過後、半田面と水平に引上げて半田メッキを
行なっていた。Conventionally, this type of solder plating method involves fixing an IJ-de frame 5 horizontally with a flang 4 attached to the tip of a cylinder 2 fixed to a base 1, as shown in Fig. 2, and then melting this. immersed in the solder bath 6,
After a certain period of time, it was pulled up parallel to the solder surface and solder plating was performed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の半田メッキ方法においては、半田面と水
平に引上げている為、リードフレーム表面を濡らしてい
る溶融半田がリードフレーム下部に集まってしまい、第
３図（、）のようにコブ状の半田パリを発生させたり、
溶融半田が流れ落ちる際には第３図（ｂ）のようなつら
ら状の半田パリを発生させるという欠点があった。In the conventional solder plating method described above, since the solder is pulled up horizontally to the solder surface, the molten solder that wets the surface of the lead frame collects at the bottom of the lead frame, resulting in a lump-like formation as shown in Figure 3 (,). Generate solder pads,
When the molten solder flows down, it has the disadvantage of generating icicle-like solder flakes as shown in FIG. 3(b).

本発明の目的は前記問題点を解消し、半田パリが発生し
ない半田メッキ方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a solder plating method that does not cause solder flash.

〔問題点を解決するための手段〕[Means for solving problems]

本発明はリードフレームを半田槽に浸漬させて半田メッ
キを行なう方法において、リードフレームを斜めに傾斜
させた姿勢で半田槽から引上げることを特徴とする半田
メッキ方法である。The present invention is a solder plating method in which a lead frame is immersed in a solder bath for solder plating, and is characterized in that the lead frame is pulled up from the solder bath in an obliquely inclined position.

〔実施例〕〔Example〕

次に、本発明の一実施例について図面を参照して説明す
る。Next, an embodiment of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例の構造を示す。FIG. 1 shows the structure of one embodiment of the present invention.

ペース１には２個のシリンダー２ａ、２ｂが各々下向き
に固定されている。各シリンダー２ａ、２ｂの先端には
クランｆ４が取付けられており、このクランｆ４はピン
３を中心にシリンダー先端で回転できる構造となってい
る。クランプ４はリードフレーム５０両端部を各々クラ
ンプするようになっている。Two cylinders 2a and 2b are fixed to the pace 1, each facing downward. A crank f4 is attached to the tip of each cylinder 2a, 2b, and the crank f4 has a structure in which it can rotate around a pin 3 at the tip of the cylinder. The clamps 4 are adapted to clamp both ends of the lead frame 50, respectively.

この実施例において半田メッキをするにはリードフレー
ム５の両端をクランｆ４でクランプした後、シリンダー
２ａ　、２ｂの降下速度を等しくして半田浴６の中へ浸
漬させる。In order to perform solder plating in this embodiment, both ends of the lead frame 5 are clamped with a crank f4, and then the cylinders 2a and 2b are immersed into the solder bath 6 with equal descending speeds.

その後、シリンダー２ａの上昇速度をシリンダー２ｂよ
り少し速くなるように図示しない絞り弁で制御してゆっ
くりと上昇させれば、リードフレーム５は右上がシの斜
めの状態となシながら上昇して行き、リードフレーム５
の下部に残ろうとしていた半田はリードフレーム５の下
面に添って左下方向へ流れて行き、半田浴６へ回収され
ることＫなる。これにより、引上げが完了した時点でリ
ードフレーム全体に均一な厚さの半田メッキが施される
。又、モーター等を使用してリードフレームを上下動さ
せてこれを半田槽に浸漬しメッキを行うことも可能であ
る。Thereafter, by controlling the rising speed of the cylinder 2a to be slightly faster than that of the cylinder 2b using a throttle valve (not shown) and slowly raising the cylinder 2a, the lead frame 5 will rise with the upper right side being slanted. , lead frame 5
The solder that was about to remain at the bottom of the lead frame 5 flows toward the lower left along the bottom surface of the lead frame 5 and is collected into the solder bath 6. As a result, solder plating with a uniform thickness is applied to the entire lead frame when pulling is completed. It is also possible to perform plating by moving the lead frame up and down using a motor or the like and immersing it in a solder bath.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明はリードフレーム下部にコブ
状や、つらら状の半田パリの発生を防止することができ
、半田メッキ後のリープフレーム寸法のばらつきを小さ
くでき、リードフレームケースに抵抗なく挿入してリー
ド曲り不良をなくすことができる。また半田メッキ後の
リードフレームを使用する自動装置の搬送レール内での
引掛りがなくなるので、稼動率を向上できる。さらに余
分な半田がリードフレームに付着しなくな・るので、半
田の使用量を減少できる効果を有するものである。As explained above, the present invention can prevent the formation of bump-shaped or icicle-shaped solder flakes at the bottom of the lead frame, reduce the variation in the leap frame dimensions after solder plating, and insert the lead frame into the lead frame case without resistance. lead bending defects can be eliminated. Furthermore, since the lead frame after solder plating is no longer caught in the conveyor rail of an automatic device, the operating rate can be improved. Furthermore, since excess solder does not adhere to the lead frame, the amount of solder used can be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明における引上げ途中を示す断面図、第２
図は従来の引上げ方法における半田浴からリードフレー
ムが持ち上がった直後を示すものであり、半田パリ発生
直前を示す断面図、第３図は半田パリを示すリードフレ
ームの側面図であり、（ａ）はコブ状、（ｂ）はつらら
状の半田パリを示す図である。 １…ペース、２　、２ａ　、　２ｂ…シリンダー、３・
・・ビン、４・・・クランプ、５・・・リードフレーム
、６・・・半田浴、７・・・半田槽。Figure 1 is a sectional view showing the middle of pulling in the present invention, Figure 2
The figure shows the lead frame immediately after being lifted out of the solder bath in the conventional pulling method, and is a cross-sectional view showing just before solder flakes occur. FIG. 3 is a side view of the lead frame showing solder flakes, and (a) FIG. 3B shows a bump-shaped solder pad, and FIG. 10B shows an icicle-shaped solder pad. 1...Pace, 2, 2a, 2b...Cylinder, 3.
...Bin, 4...Clamp, 5...Lead frame, 6...Solder bath, 7...Solder bath.

Claims (1)

【特許請求の範囲】[Claims] （１）リードフレームを半田槽に浸漬させて半田メッキ
を行なう方法において、リードフレームを斜めに傾斜さ
せた姿勢で半田槽から引上げることを特徴とする半田メ
ッキ方法。(1) A solder plating method in which a lead frame is immersed in a solder bath to perform solder plating, and the lead frame is pulled up from the solder bath in an obliquely inclined position.
JP12377685A 1985-06-07 1985-06-07 Solder plating method Pending JPS61283454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12377685A JPS61283454A (en) 1985-06-07 1985-06-07 Solder plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12377685A JPS61283454A (en) 1985-06-07 1985-06-07 Solder plating method

Publications (1)

Publication Number Publication Date
JPS61283454A true JPS61283454A (en) 1986-12-13

Family

ID=14868996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12377685A Pending JPS61283454A (en) 1985-06-07 1985-06-07 Solder plating method

Country Status (1)

Country Link
JP (1) JPS61283454A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481270A (en) * 1990-07-19 1992-03-13 Uchiyama Kikai Seisakusho:Kk Solder dipping device
JP2009141325A (en) * 2007-11-14 2009-06-25 Panasonic Corp Inductance component and method for manufacturing the same
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) * 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329143A (en) * 1976-08-31 1978-03-18 Oki Electric Ind Co Ltd Optical fiber connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329143A (en) * 1976-08-31 1978-03-18 Oki Electric Ind Co Ltd Optical fiber connector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481270A (en) * 1990-07-19 1992-03-13 Uchiyama Kikai Seisakusho:Kk Solder dipping device
JP2009141325A (en) * 2007-11-14 2009-06-25 Panasonic Corp Inductance component and method for manufacturing the same
US7631796B2 (en) 2007-12-04 2009-12-15 Sony Corporation Selective soldering system
US7648056B1 (en) * 2008-07-03 2010-01-19 Sony Corporation Selective soldering bath

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