JPS61281542A - Lead wire for diode - Google Patents
Lead wire for diodeInfo
- Publication number
- JPS61281542A JPS61281542A JP12315485A JP12315485A JPS61281542A JP S61281542 A JPS61281542 A JP S61281542A JP 12315485 A JP12315485 A JP 12315485A JP 12315485 A JP12315485 A JP 12315485A JP S61281542 A JPS61281542 A JP S61281542A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- wire
- lead wire
- diode
- core wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
く産業上の利用分野〉
この発明は人容最用の小型ダイオードに用いるリード線
であって、特に熱放散性を向−トさけた小型ダイオード
用1ノード線に関するものである。[Detailed Description of the Invention] Industrial Application Fields The present invention relates to a lead wire for use in small diodes intended for human use, and particularly relates to a one-node wire for small diodes that is designed to improve heat dissipation. It is.
〈従来の□技術とその問題点〉 、□現
在゛市販されている大官”吊用小型ダイオードは甲2図
に示すように、両端部に熱放散↑朱を3向上さiるため
に、例えばジルコニウム銅のリード線3を具備した電w
A4.4間に半導体素子5を装着し、電極、4.4の周
囲を封止ガラス5で封止することによって構成されてい
る。 □
ところが、このダイオードにおけるジル」ニウム銅のリ
ード線は磁気吸着しないため、製造時の搬送や保管の出
し入れの際にリード線が曲ったり、あるいはリード線が
絡み合って次工程でトラブルを生じたりすることが多い
。〈Conventional □Technology and its Problems〉 □Currently, the small hanging diode commercially available has two diodes, as shown in Figure A2, in order to improve heat dissipation↑↑↑↑↑3 at both ends. For example, a wire w equipped with a lead wire 3 made of zirconium copper.
It is constructed by mounting a semiconductor element 5 between A4.4 and sealing the periphery of the electrode 4.4 with a sealing glass 5. □ However, since the Zir'nium copper lead wires in this diode do not attract magnetically, the lead wires may bend during transportation during manufacturing or when being put in and taken out of storage, or the lead wires may become entangled, causing problems in the next process. There are many things.
このため、リード線としてはジルコニウム銅線に代って
第3図に断面図として示すような、軟鋼線芯線7の十・
に重量比で80%以上(導電率で80〜85%)の銅層
8を被覆した高銅比銅被覆鋼線が用いられるようにな、
つてきている。Therefore, instead of using a zirconium copper wire as a lead wire, a soft steel wire core wire 7 as shown in the cross-sectional view in FIG.
A high copper ratio copper-coated steel wire coated with a copper layer 8 of 80% or more by weight (80 to 85% conductivity) came to be used.
It's coming.
しかしながら、このような高銅比銅被覆鋼線では、そ、
の銅被覆率が重量比で85%1ス上ともなると、芯線と
して使用する軟鋼線の硬いという性質がほとんど失なわ
れ、その抗張力が銅線の抗張力にほぼ近づくこととなり
、このために外部からの力によってリード線が曲ったす
するという問題が生じている。However, with such a high copper ratio copper coated steel wire,
When the copper coverage ratio increases to 85% by weight, the hardness of the mild steel wire used as the core wire is almost lost, and its tensile strength approaches that of the copper wire. A problem has arisen in which the lead wires are bent due to the force of the wires.
また、このような銅被覆鋼線を用いて1Wの許容損失を
得るには、該鋼線は0.8mmφ以上の径が必要である
。Further, in order to obtain an allowable loss of 1 W using such a copper-coated steel wire, the steel wire needs to have a diameter of 0.8 mm or more.
そこで0.6〜O’、 7mmφ以下のり一ト線にして
、さらに小型ダイオードを得るためには、銅Φ量比を8
5〜95%(導電率85%以上)とする必dかある。Therefore, in order to obtain an even smaller diode by making the line 0.6~O', 7mmφ or less, the copper Φ amount ratio should be 8.
It is necessary to set the conductivity to 5 to 95% (conductivity of 85% or more).
ところが、このような銅重都比の銅被覆鋼線を用いると
、
(1)軟鋼芯線上の銅被覆重量比が85重量1%以上、
特に90重量%以上になると、芯線鋼の硬い性質が消え
、リード線が曲りヤ)すいため、外部からの力によって
曲ったり、次工程で絡んだりするトラブルの原因となる
。However, when such a copper-covered steel wire with a heavy weight ratio of copper is used, (1) the weight ratio of copper coating on the mild steel core wire is 85% by weight or more,
In particular, when the content exceeds 90% by weight, the hard nature of the core wire disappears and the lead wire becomes easily bent, causing troubles such as bending due to external force or entanglement in the next process.
(2)磁気吸着力が落ちて磁石を使って連続的に錫メツ
キエ稈に流せない。(2) Due to the reduced magnetic attraction, it is not possible to use a magnet to continuously flow water into the culm.
などの問題点が生ずるのである。Problems such as these arise.
〈問題点を解決するための手段〉
この発明は上記したこれまでのダイオード用リード線に
おける問題点を解消すべく鋭意検問を行7zッだ結果、
0.6〜0.7mmφでも8′l容損失が1W以上あり
、磁気吸着力を落とさずに高強度を維持することのでき
るダイオード用リード線を得るに至ったものである。<Means for Solving the Problems> This invention was developed as a result of intensive investigation to solve the problems with the above-mentioned lead wires for diodes.
Even with a diameter of 0.6 to 0.7 mm, the 8'l capacity loss is 1 W or more, and a lead wire for a diode that can maintain high strength without reducing magnetic attraction force has been obtained.
即ち、この発明IJ1]パルi〜30−.50重帛%、
バナジウムあるい(51,ニオブを5申m1%以下含右
し、残部鉄−からなる芯線の外表面に85〜95重量%
の銅または銅合金を被覆したことを特徴とするダイオー
ド用リード線を捉供づるものて゛ある。That is, this invention IJ1] Pal i~30-. 50 weight%,
The outer surface of the core wire contains 85 to 95% by weight of vanadium or (51, niobium), with the balance being iron.
There is also a diode lead wire that is coated with copper or copper alloy.
〈実施例〉
以下、この発明のグイオート用リード線の構成を第1図
に基づ′いて説明する。<Example> Hereinafter, the structure of the lead wire for a guide wire of the present invention will be explained based on FIG. 1.
まず第1図において、芯線1は]パル1へ30へ・50
重量%、バナジウムまたはニオブを5重量%以下を含有
し、残部鉄からなる強磁・[)1を有する芯線である。First, in Fig. 1, core wire 1 is] to pal 1 to 30 to 50
It is a core wire containing 5% by weight or less of vanadium or niobium, with the balance being iron.
このような鉄合金芯線1上に無酸素銅を被覆するか、銅
メッキすることにより重量比85〜95%、特に好まし
くは90〜95%の銅被覆層2を形成することにより9
0%以上の導電率で、0.6〜0.7mmφで使用して
も1W以上の許容損失が得られるリード線か得られるの
である。By coating such an iron alloy core wire 1 with oxygen-free copper or by plating it with copper, a copper coating layer 2 having a weight ratio of 85 to 95%, particularly preferably 90 to 95% is formed.
A lead wire with a conductivity of 0% or more and an allowable loss of 1 W or more can be obtained even when used with a diameter of 0.6 to 0.7 mm.
ここで芯線1としての鉄合金組成において、コバルトを
30〜50重量%とするのは、磁″Piか一番強いから
であり、この吊か50重量%をこえると組成的に脆い材
質と4iつて好ましくない。In the iron alloy composition of the core wire 1, cobalt is set at 30 to 50% by weight because the magnetic "Pi" is the strongest, and if this content exceeds 50% by weight, the material becomes compositionally brittle. I don't like it.
また、バナジウムにおるいはニオブの含有量を5重量%
以下(好ましくは0.5〜2重幅%)とするのは、加工
性(伸線)を増すためであり、5重1%以上ではその効
果は得られない。In addition, the content of vanadium or niobium is 5% by weight.
The reason why the width is less than 0.5% (preferably 0.5% to 2%) is to increase workability (wire drawing), and if the width is 5% or more, this effect cannot be obtained.
上記したようなこの発明のリード線と従来のリード線に
ついて導電率、磁化力や抗張力などを比較したところ、
第1表の如くなり、この発明のリード線か磁化力および
抗張力においてすぐれ、また0、6〜017mmφにて
使用して、消極として1.!imm巾、長さ2.0mm
のシュメツミル線を用いてダイオードとして組立てたと
ころ、従来の0.8mmφのリード線を用いて組立てた
ダイオードと同等の許容損失1W以上が得られることが
認められた。A comparison of the electrical conductivity, magnetizing force, tensile strength, etc. of the lead wire of the present invention and the conventional lead wire as described above revealed that
As shown in Table 1, the lead wire of the present invention is excellent in magnetizing force and tensile strength, and when used with a diameter of 0.6 to 017 mm, it has a negative polarity of 1. ! imm width, length 2.0mm
When a diode was assembled using the Schmetzmill wire, it was found that an allowable loss of 1 W or more was obtained, which is equivalent to a diode assembled using a conventional 0.8 mm diameter lead wire.
なお第1表において、磁化力は鉄を100とした場合の
値である。In Table 1, the magnetizing force is the value when iron is taken as 100.
第1表
〈発明の効果〉
上表から明らかなように、この発明のリード線により従
来よりさらに小型のダイオードか可能となり、高密度実
装化が実用しうるのである。Table 1 <Effects of the Invention> As is clear from the above table, the lead wire of the present invention enables a diode that is even smaller than the conventional one, making it possible to implement high-density packaging.
第1図はこの発明のり一ト線の断面図、第2図はl’)
l−1[1型ガラス月市ダイオードの正面図、第3図
は従来の軟鋼芯線の断面図である。
1・・・鉄合金芯線 2・・・銅または銅合金被覆
層出願人代理人 弁理士 和 1)昭−〇 −Figure 1 is a sectional view of the glue line of this invention, Figure 2 is l')
1-1 [A front view of a type 1 glass Tsukiichi diode, and FIG. 3 is a cross-sectional view of a conventional mild steel core wire. 1... Iron alloy core wire 2... Copper or copper alloy coating layer Applicant's agent Patent attorney Kazu 1) Showa -〇 -
Claims (1)
を5重量%以下含有し、残部鉄からなる芯線の外表面に
85〜95重量%の銅または銅合金を被覆したことを特
徴とするダイオード用リード線。A diode lead wire comprising 30 to 50% by weight of cobalt, 5% by weight or less of vanadium or niobium, and the outer surface of a core wire made of iron with the remainder coated with 85 to 95% by weight of copper or copper alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12315485A JPS61281542A (en) | 1985-06-06 | 1985-06-06 | Lead wire for diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12315485A JPS61281542A (en) | 1985-06-06 | 1985-06-06 | Lead wire for diode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61281542A true JPS61281542A (en) | 1986-12-11 |
Family
ID=14853514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12315485A Pending JPS61281542A (en) | 1985-06-06 | 1985-06-06 | Lead wire for diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61281542A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5024542A (en) * | 1988-08-30 | 1991-06-18 | Seiko Epson Corporation | Magnetic actuator |
US5252940A (en) * | 1989-08-22 | 1993-10-12 | Seiko Epson Corporation | Soft magnetic material |
-
1985
- 1985-06-06 JP JP12315485A patent/JPS61281542A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5024542A (en) * | 1988-08-30 | 1991-06-18 | Seiko Epson Corporation | Magnetic actuator |
US5252940A (en) * | 1989-08-22 | 1993-10-12 | Seiko Epson Corporation | Soft magnetic material |
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