JPS6127339U - Semiconductor substrate chuck mechanism - Google Patents

Semiconductor substrate chuck mechanism

Info

Publication number
JPS6127339U
JPS6127339U JP11190584U JP11190584U JPS6127339U JP S6127339 U JPS6127339 U JP S6127339U JP 11190584 U JP11190584 U JP 11190584U JP 11190584 U JP11190584 U JP 11190584U JP S6127339 U JPS6127339 U JP S6127339U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
chuck mechanism
substrate chuck
cradle
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11190584U
Other languages
Japanese (ja)
Inventor
耕一 岡田
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP11190584U priority Critical patent/JPS6127339U/en
Publication of JPS6127339U publication Critical patent/JPS6127339U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第1図は本考案に係るチャッダ機構の説明図で、同図N
ぼ側断面図、Bは平面図。 第2図は従来のチャック機構の説明図で、同図Aは側断
面図、Bは平面図である。 図において、1はウエハ、2は受け台、3は支持板、4
,7は保持棒、5,10はテーブル、8は保持具、であ
る。
[Brief explanation of the drawings] Figure 1 is an explanatory diagram of the chadda mechanism according to the present invention.
B is a top view. FIG. 2 is an explanatory view of a conventional chuck mechanism, in which A is a side sectional view and B is a plan view. In the figure, 1 is a wafer, 2 is a pedestal, 3 is a support plate, and 4
, 7 are holding rods, 5 and 10 are tables, and 8 is a holder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 受け台に乗り、処理室に搬送されてきた半導体基板を該
処理室のテーブルに装着する機構が、上下動が可能な保
持棒を下面中央に備えると共に、上方に傾斜した周辺部
をもつ丁字形の断面形状をもって形成されており、該傾
斜した周辺部で基板の縁を保持して装着することを特徴
とする半導体基板のチャック機構。
The mechanism for mounting a semiconductor substrate onto a table in the processing chamber mounted on a cradle is equipped with a vertically movable holding rod in the center of the lower surface, and is T-shaped with an upwardly sloping periphery. What is claimed is: 1. A chuck mechanism for a semiconductor substrate, characterized in that the chucking mechanism is formed with a cross-sectional shape of , and is mounted by holding the edge of the substrate at the inclined peripheral portion.
JP11190584U 1984-07-24 1984-07-24 Semiconductor substrate chuck mechanism Pending JPS6127339U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11190584U JPS6127339U (en) 1984-07-24 1984-07-24 Semiconductor substrate chuck mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11190584U JPS6127339U (en) 1984-07-24 1984-07-24 Semiconductor substrate chuck mechanism

Publications (1)

Publication Number Publication Date
JPS6127339U true JPS6127339U (en) 1986-02-18

Family

ID=30670976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11190584U Pending JPS6127339U (en) 1984-07-24 1984-07-24 Semiconductor substrate chuck mechanism

Country Status (1)

Country Link
JP (1) JPS6127339U (en)

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