JPS6127235U - Semiconductor device manufacturing equipment - Google Patents

Semiconductor device manufacturing equipment

Info

Publication number
JPS6127235U
JPS6127235U JP10804784U JP10804784U JPS6127235U JP S6127235 U JPS6127235 U JP S6127235U JP 10804784 U JP10804784 U JP 10804784U JP 10804784 U JP10804784 U JP 10804784U JP S6127235 U JPS6127235 U JP S6127235U
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
manufacturing equipment
cap
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10804784U
Other languages
Japanese (ja)
Inventor
吉昭 亀山
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10804784U priority Critical patent/JPS6127235U/en
Publication of JPS6127235U publication Critical patent/JPS6127235U/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のサセブタとキャップとの関係を示す断面
図であり、 1・・・・・・ウエハーガイド部、2・・・・・・付着
物、3・・・・・・キャップ、4・・・・・・サセブタ
を示している。 第2図と第3図はそれぞれ本考案の実施例のサセブタと
キャップを示す断面図であり、゜これらの図において、 13,23・・・・・・キャップ、5,6・・・・・・
突起を示している。
FIG. 1 is a cross-sectional view showing the relationship between a conventional susceptor and a cap, in which: 1... Wafer guide part, 2... Deposit, 3... Cap, 4・・・・・・It shows a sage pig. 2 and 3 are cross-sectional views showing the susceptor and cap of the embodiment of the present invention, respectively. In these figures, 13, 23... Cap, 5, 6...・
It shows a protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フエイスタウン方式のCVDやドライエツチャー装置に
於いて、半導体ウエハーガイドにキャップ全面が接触せ
ず、該半導体ウエハーガイドとキャップ間に空間を有す
ることを特徴とする半導体装置の製造装置。
1. An apparatus for manufacturing a semiconductor device in a Phase Town type CVD or dry etching apparatus, characterized in that the entire surface of the cap does not come into contact with the semiconductor wafer guide and there is a space between the semiconductor wafer guide and the cap.
JP10804784U 1984-07-17 1984-07-17 Semiconductor device manufacturing equipment Pending JPS6127235U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10804784U JPS6127235U (en) 1984-07-17 1984-07-17 Semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10804784U JPS6127235U (en) 1984-07-17 1984-07-17 Semiconductor device manufacturing equipment

Publications (1)

Publication Number Publication Date
JPS6127235U true JPS6127235U (en) 1986-02-18

Family

ID=30667264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10804784U Pending JPS6127235U (en) 1984-07-17 1984-07-17 Semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS6127235U (en)

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