JPS61268090A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS61268090A JPS61268090A JP11070385A JP11070385A JPS61268090A JP S61268090 A JPS61268090 A JP S61268090A JP 11070385 A JP11070385 A JP 11070385A JP 11070385 A JP11070385 A JP 11070385A JP S61268090 A JPS61268090 A JP S61268090A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- insulator
- recess
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線板に関し、特にパターン間が狭い高密
度印刷配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to printed wiring boards, and particularly to high-density printed wiring boards with narrow pattern spacing.
従来、この極の高密度印刷配線板はカプトン等の絶縁物
の一平面に銅箔を密着させた後、衆知のパターニング技
術およびエツチング技術により所定の導電体パターンを
形成していた。Conventionally, high-density printed wiring boards of this type have been produced by closely adhering a copper foil to one surface of an insulator such as Kapton, and then forming a predetermined conductive pattern using well-known patterning and etching techniques.
上述した従来の印刷配線板は絶縁体の同一平面上に導電
体パターンが形成されているため、隣接する導体間が狭
くなりかつ電界が加りた状態で放置すると、導電体が当
該隣接する導電体間に成長し当該隣接する導電体が短絡
するという欠点がある。In the conventional printed wiring board described above, conductor patterns are formed on the same plane of an insulator, so if the distance between adjacent conductors becomes narrow and an electric field is applied, the conductor will It has the disadvantage that it grows between bodies and shorts the adjacent conductors.
第2図に従来技術の一失施例を示す。22はカプトンで
211.212はカプトン上に形成さnた隣接する導電
体である。導体211と212の距離210が数十ミク
ロン程度と短くし、かつ導体211と212間に数ボル
トの電圧を印加した状態で空中に放置するとマイグレー
ション現象が起る。即ちイオン化した金属イオンが電界
によって負電極側に堆積する。この現象が進行すると導
体211と212が短絡する。 。FIG. 2 shows an example of a failure of the prior art. 22 is a Kapton, and 211 and 212 are adjacent conductors formed on the Kapton. If the distance 210 between the conductors 211 and 212 is shortened to about several tens of microns and the conductors 211 and 212 are left in the air with a voltage of several volts applied between them, a migration phenomenon occurs. That is, ionized metal ions are deposited on the negative electrode side by the electric field. As this phenomenon progresses, conductors 211 and 212 become short-circuited. .
本発明の印刷配線板は導電体と隣接する導゛越体間に凹
部を有する絶縁体を有している。The printed wiring board of the present invention has an insulator having a recess between a conductor and an adjacent conductor.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の断面図である。絶縁体12
の上に鍋箔111.112をラミネートした後、衆知の
パターニング技術とエツチング技術によって所定のパタ
ーン111 、i12を形成する。しかる後隣接する導
電体111,112の間の絶縁体に溝又は凹部121を
形成する。FIG. 1 is a sectional view of an embodiment of the present invention. Insulator 12
After laminating pan foils 111 and 112 on top, predetermined patterns 111 and i12 are formed using well-known patterning and etching techniques. Thereafter, a groove or recess 121 is formed in the insulator between the adjacent conductors 111 and 112.
この凹部121により次の効果がある。一つは導電体1
11が正に、導電体112が負に印加された場合、ie
縁体の凹部121の垂直部122には垂直方向に電界が
加らないため前述のマイグレーション現象は起らないと
いう効果がある。This recess 121 has the following effects. One is conductor 1
11 is applied positively and the conductor 112 is applied negatively, ie
Since no electric field is applied in the vertical direction to the vertical portion 122 of the concave portion 121 of the edge, there is an effect that the above-mentioned migration phenomenon does not occur.
もう一つは、隣接する導電体111と112の空間的距
離は110であるが、絶縁体の凹部121が存在するこ
とによりマイグレーションの実効距離は凹の垂直部12
2だけ増加するという効果である。Another reason is that the spatial distance between adjacent conductors 111 and 112 is 110, but due to the presence of the recess 121 in the insulator, the effective migration distance is
The effect is to increase by 2.
以上説明したように本発明は隣接する導電体間の絶縁体
に凹部を設けることにより隣接する導電体間に発生する
マイグレーション現象を防止し、高密度印刷配線板を実
現できる効果がめる。As explained above, the present invention prevents the migration phenomenon that occurs between adjacent conductors by providing recesses in the insulator between adjacent conductors, and has the effect of realizing a high-density printed wiring board.
第1図は本発明の印刷配線板の断面図、第2図は従来の
配線板の断面図である。
111.112,211.212−°゛・・・導電体パ
ターン、12.22・・・・・・絶縁体、121・・・
・・・絶縁体上の凹部、122・・・・・・絶縁体上の
凹部の垂直部分、110.210・・・・・“隣接する
導体間の距離。
\、−FIG. 1 is a sectional view of a printed wiring board of the present invention, and FIG. 2 is a sectional view of a conventional wiring board. 111.112, 211.212-°゛...Conductor pattern, 12.22...Insulator, 121...
... recess on the insulator, 122 ... vertical part of the recess on the insulator, 110.210 ... "distance between adjacent conductors. \, -
Claims (1)
た印刷配線板において、隣接する導電体間の当該絶縁物
に凹部を設けたことを特徴とする印刷配線板。1. A printed wiring board in which a predetermined conductor pattern is formed on the same plane of an insulator, characterized in that a recess is provided in the insulator between adjacent conductors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11070385A JPS61268090A (en) | 1985-05-23 | 1985-05-23 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11070385A JPS61268090A (en) | 1985-05-23 | 1985-05-23 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61268090A true JPS61268090A (en) | 1986-11-27 |
Family
ID=14542314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11070385A Pending JPS61268090A (en) | 1985-05-23 | 1985-05-23 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61268090A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0254983A (en) * | 1988-08-19 | 1990-02-23 | Ricoh Co Ltd | Conductor pattern molded body and formation thereof |
US5969412A (en) * | 1997-04-09 | 1999-10-19 | Nec Corporation | Tape-fixed leadframe |
JP2004031428A (en) * | 2002-06-21 | 2004-01-29 | Toray Eng Co Ltd | Metal wiring circuit board, and method of improving insulation between adjacent metal wiring |
JP2010129767A (en) * | 2008-11-27 | 2010-06-10 | Nidec Sankyo Corp | Printed board |
JP2011155296A (en) * | 2004-10-27 | 2011-08-11 | Carleton Life Support Systems Inc | Buffer zone for preventing metallic migration |
JP2014175399A (en) * | 2013-03-07 | 2014-09-22 | Denso Corp | Static electricity protection circuit board |
-
1985
- 1985-05-23 JP JP11070385A patent/JPS61268090A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0254983A (en) * | 1988-08-19 | 1990-02-23 | Ricoh Co Ltd | Conductor pattern molded body and formation thereof |
US5969412A (en) * | 1997-04-09 | 1999-10-19 | Nec Corporation | Tape-fixed leadframe |
JP2004031428A (en) * | 2002-06-21 | 2004-01-29 | Toray Eng Co Ltd | Metal wiring circuit board, and method of improving insulation between adjacent metal wiring |
JP2011155296A (en) * | 2004-10-27 | 2011-08-11 | Carleton Life Support Systems Inc | Buffer zone for preventing metallic migration |
JP2010129767A (en) * | 2008-11-27 | 2010-06-10 | Nidec Sankyo Corp | Printed board |
JP2014175399A (en) * | 2013-03-07 | 2014-09-22 | Denso Corp | Static electricity protection circuit board |
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