JPS61268090A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS61268090A
JPS61268090A JP11070385A JP11070385A JPS61268090A JP S61268090 A JPS61268090 A JP S61268090A JP 11070385 A JP11070385 A JP 11070385A JP 11070385 A JP11070385 A JP 11070385A JP S61268090 A JPS61268090 A JP S61268090A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
insulator
recess
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11070385A
Other languages
Japanese (ja)
Inventor
比企 能正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11070385A priority Critical patent/JPS61268090A/en
Publication of JPS61268090A publication Critical patent/JPS61268090A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は印刷配線板に関し、特にパターン間が狭い高密
度印刷配線板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to printed wiring boards, and particularly to high-density printed wiring boards with narrow pattern spacing.

〔従来の技術〕[Conventional technology]

従来、この極の高密度印刷配線板はカプトン等の絶縁物
の一平面に銅箔を密着させた後、衆知のパターニング技
術およびエツチング技術により所定の導電体パターンを
形成していた。
Conventionally, high-density printed wiring boards of this type have been produced by closely adhering a copper foil to one surface of an insulator such as Kapton, and then forming a predetermined conductive pattern using well-known patterning and etching techniques.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の印刷配線板は絶縁体の同一平面上に導電
体パターンが形成されているため、隣接する導体間が狭
くなりかつ電界が加りた状態で放置すると、導電体が当
該隣接する導電体間に成長し当該隣接する導電体が短絡
するという欠点がある。
In the conventional printed wiring board described above, conductor patterns are formed on the same plane of an insulator, so if the distance between adjacent conductors becomes narrow and an electric field is applied, the conductor will It has the disadvantage that it grows between bodies and shorts the adjacent conductors.

第2図に従来技術の一失施例を示す。22はカプトンで
211.212はカプトン上に形成さnた隣接する導電
体である。導体211と212の距離210が数十ミク
ロン程度と短くし、かつ導体211と212間に数ボル
トの電圧を印加した状態で空中に放置するとマイグレー
ション現象が起る。即ちイオン化した金属イオンが電界
によって負電極側に堆積する。この現象が進行すると導
体211と212が短絡する。  。
FIG. 2 shows an example of a failure of the prior art. 22 is a Kapton, and 211 and 212 are adjacent conductors formed on the Kapton. If the distance 210 between the conductors 211 and 212 is shortened to about several tens of microns and the conductors 211 and 212 are left in the air with a voltage of several volts applied between them, a migration phenomenon occurs. That is, ionized metal ions are deposited on the negative electrode side by the electric field. As this phenomenon progresses, conductors 211 and 212 become short-circuited. .

〔問題点を解決するための手段〕[Means for solving problems]

本発明の印刷配線板は導電体と隣接する導゛越体間に凹
部を有する絶縁体を有している。
The printed wiring board of the present invention has an insulator having a recess between a conductor and an adjacent conductor.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の断面図である。絶縁体12
の上に鍋箔111.112をラミネートした後、衆知の
パターニング技術とエツチング技術によって所定のパタ
ーン111 、i12を形成する。しかる後隣接する導
電体111,112の間の絶縁体に溝又は凹部121を
形成する。
FIG. 1 is a sectional view of an embodiment of the present invention. Insulator 12
After laminating pan foils 111 and 112 on top, predetermined patterns 111 and i12 are formed using well-known patterning and etching techniques. Thereafter, a groove or recess 121 is formed in the insulator between the adjacent conductors 111 and 112.

この凹部121により次の効果がある。一つは導電体1
11が正に、導電体112が負に印加された場合、ie
縁体の凹部121の垂直部122には垂直方向に電界が
加らないため前述のマイグレーション現象は起らないと
いう効果がある。
This recess 121 has the following effects. One is conductor 1
11 is applied positively and the conductor 112 is applied negatively, ie
Since no electric field is applied in the vertical direction to the vertical portion 122 of the concave portion 121 of the edge, there is an effect that the above-mentioned migration phenomenon does not occur.

もう一つは、隣接する導電体111と112の空間的距
離は110であるが、絶縁体の凹部121が存在するこ
とによりマイグレーションの実効距離は凹の垂直部12
2だけ増加するという効果である。
Another reason is that the spatial distance between adjacent conductors 111 and 112 is 110, but due to the presence of the recess 121 in the insulator, the effective migration distance is
The effect is to increase by 2.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は隣接する導電体間の絶縁体
に凹部を設けることにより隣接する導電体間に発生する
マイグレーション現象を防止し、高密度印刷配線板を実
現できる効果がめる。
As explained above, the present invention prevents the migration phenomenon that occurs between adjacent conductors by providing recesses in the insulator between adjacent conductors, and has the effect of realizing a high-density printed wiring board.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の印刷配線板の断面図、第2図は従来の
配線板の断面図である。 111.112,211.212−°゛・・・導電体パ
ターン、12.22・・・・・・絶縁体、121・・・
・・・絶縁体上の凹部、122・・・・・・絶縁体上の
凹部の垂直部分、110.210・・・・・“隣接する
導体間の距離。 \、−
FIG. 1 is a sectional view of a printed wiring board of the present invention, and FIG. 2 is a sectional view of a conventional wiring board. 111.112, 211.212-°゛...Conductor pattern, 12.22...Insulator, 121...
... recess on the insulator, 122 ... vertical part of the recess on the insulator, 110.210 ... "distance between adjacent conductors. \, -

Claims (1)

【特許請求の範囲】[Claims]  絶縁物の同一平面上に所定の導電体パターンを形成し
た印刷配線板において、隣接する導電体間の当該絶縁物
に凹部を設けたことを特徴とする印刷配線板。
1. A printed wiring board in which a predetermined conductor pattern is formed on the same plane of an insulator, characterized in that a recess is provided in the insulator between adjacent conductors.
JP11070385A 1985-05-23 1985-05-23 Printed wiring board Pending JPS61268090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11070385A JPS61268090A (en) 1985-05-23 1985-05-23 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11070385A JPS61268090A (en) 1985-05-23 1985-05-23 Printed wiring board

Publications (1)

Publication Number Publication Date
JPS61268090A true JPS61268090A (en) 1986-11-27

Family

ID=14542314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11070385A Pending JPS61268090A (en) 1985-05-23 1985-05-23 Printed wiring board

Country Status (1)

Country Link
JP (1) JPS61268090A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254983A (en) * 1988-08-19 1990-02-23 Ricoh Co Ltd Conductor pattern molded body and formation thereof
US5969412A (en) * 1997-04-09 1999-10-19 Nec Corporation Tape-fixed leadframe
JP2004031428A (en) * 2002-06-21 2004-01-29 Toray Eng Co Ltd Metal wiring circuit board, and method of improving insulation between adjacent metal wiring
JP2010129767A (en) * 2008-11-27 2010-06-10 Nidec Sankyo Corp Printed board
JP2011155296A (en) * 2004-10-27 2011-08-11 Carleton Life Support Systems Inc Buffer zone for preventing metallic migration
JP2014175399A (en) * 2013-03-07 2014-09-22 Denso Corp Static electricity protection circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254983A (en) * 1988-08-19 1990-02-23 Ricoh Co Ltd Conductor pattern molded body and formation thereof
US5969412A (en) * 1997-04-09 1999-10-19 Nec Corporation Tape-fixed leadframe
JP2004031428A (en) * 2002-06-21 2004-01-29 Toray Eng Co Ltd Metal wiring circuit board, and method of improving insulation between adjacent metal wiring
JP2011155296A (en) * 2004-10-27 2011-08-11 Carleton Life Support Systems Inc Buffer zone for preventing metallic migration
JP2010129767A (en) * 2008-11-27 2010-06-10 Nidec Sankyo Corp Printed board
JP2014175399A (en) * 2013-03-07 2014-09-22 Denso Corp Static electricity protection circuit board

Similar Documents

Publication Publication Date Title
US4616292A (en) Multilayer printed circuit board
GB2184882A (en) High capacitance bus bar including multilayer ceramic capacitors
JPS61268090A (en) Printed wiring board
JPS596861U (en) wiring board
US4237469A (en) Electrostatic write head
JPS6141272Y2 (en)
JPS6027101A (en) Multistage chip resistor
JPH087649Y2 (en) Printed wiring board
JPH0617332Y2 (en) Printed wiring board connection structure
JPH0767001B2 (en) Substrate for electronic parts
JP2503052B2 (en) Printed board
TW202135618A (en) Wiring circuit board and method for manufacturing same
JPS6342536Y2 (en)
JPS63102392A (en) Ceramic multilayer substrate
JPH066002A (en) Printed wiring board
JPS58105589A (en) Printed circuit board
JPS6184893A (en) Silver through hole printed circuit board
JPS58162667U (en) printed board
JPH0652824B2 (en) Flexible printed wiring board terminal formation method
JPS643354B2 (en)
JPH01208874A (en) Led head
JPS6139600A (en) Method of producing both-side flexible printed board
JPS59230756A (en) Electrode head
JPH0520391U (en) Shield printed wiring board
JPS6336593A (en) Hybrid integrated circuit board