JPH0254983A - Conductor pattern molded body and formation thereof - Google Patents

Abstract

PURPOSE:To increase a creepage distance between conductor patterns by forming a conductor film on the surface of an insulator, forming a conductor pattern by eliminating one part of the conductor film, and simultaneously eliminating one part of the insulator corresponding to the conductor film part in a recessed shape. CONSTITUTION:A conductor film 2A is formed nearly all over the surface of an insulator 1. By applying a resist film 8 consisting of a photo resist material to nearly the entire surface of the conductor film 2A, pattern exposure is provided to the resist film 8. By developing the resist film 8 after exposure and forming a slit 8a, one part 2Aa of the insulator is exposed. Furthermore, an etching agent 9 is applied to one part 1a of the exposed insulator 1 to allow a recessed part 1b to be formed. Then, an etching agent 9 and a resist film 8 are eliminated and a conductor pattern 2 is formed on the surface of the insulator 1 with the recessed part 1b in-between. Thus, by increasing creepage distance between conductor patterns, generation of electrical short-circuiting, leak etc., can be prevented between conductor patterns.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a conductive pattern forming body suitable for use in fine circuit forming bodies such as bar code display tubes and phosphor dot array tubes, and a method for forming the same. .

(Prior Art) Conventionally, as a conductor pattern forming body, A
Q: Those that are patterned with conductors such as ITO and Ni, those that are patterned with conductors such as Cu and Ni on ceramics, and those that are patterned with conductors such as Cu and Ni on glass epoxy substrates. Many of them are configured to provide desired functions by applying conductor wiring according to various uses. The conductor patterns are arranged in rows with as fine spacing as possible.

What is steadily progressing in the direction of development of this type of thing is technology to ensure reliability as microstructures, as represented by the names of high integration, high density, high definition, and high miniaturization. . With regard to the miniaturization of conductor patterns, remarkable progress has been made in pattern exposure technology in particular due to the development of photophosphorographic technology.

(Problem to be solved by the invention) As the conductor patterns become finer, the distance between the conductors inevitably becomes smaller, and the frequency of occurrence of phenomena such as electrical shorts and leaks between the patterns increases. becomes higher. Such a phenomenon is a major factor in reducing the reliability of conductive pattern formed bodies as fine structures.

(Means for Solving 111i!) An object of the present invention is to provide a conductive pattern formed body and a method for forming the same, which can reduce phenomena such as short circuits and leaks between conductive patterns.

The conductor pattern forming body is characterized in that a portion of the surface of the insulator between adjacent conductor patterns is formed into a concave shape, thereby increasing the substantial creeping distance of the insulator between the conductor patterns.

The formation method includes a conductor film formation step in which a conductor film is formed on the surface of the insulator, a conductor film removal step in which a part of this conductor film is removed to form a desired conductor pattern, and this conductor film removal step. and an insulator removal step in which a part of the insulator corresponding to the conductor film portion to be removed is removed in a concave shape, and the conductor film removal step and the insulator removal step are performed in the same step. do.

(Operations/Effects) According to the conductor pattern formed body of the present invention, since the insulator surfaces between the conductor patterns are formed in a concave shape, the length of the insulator surface between adjacent conductor patterns, that is, the creepage distance is reduced. This increases the length, reduces phenomena such as electrical leakage and short circuits, and improves reliability despite being a fine structure.

Further, according to the method for forming a conductive pattern formed body of the present invention,
The conductor film removal process, in which the conductor film formed on the surface of the insulator is formed into a desired conductor pattern, and the insulator removal process, in which a part of the insulator is removed into a concave shape, are performed in the same process, reducing the number of processes. It is possible to easily obtain a conductor pattern formed body having a small creepage distance and a long creepage distance between adjacent conductor patterns.

(Example) Hereinafter, the present invention will be described in detail based on the illustrated example. First, a phosphor dot array tube will be described as an example of a device using a conductor pattern formed body. Figure 9 and 1
In Figure 0, reference numeral 1 indicates a plate-shaped insulator made of glass, ceramic, resin, or the like. ``A series of conductor patterns 2 are arranged in a row in the longitudinal direction of the insulator 1 on the insulator 1, and a fluorescent screen 3 is formed on each of the conductor patterns 2. Each conductor pattern 2 and the fluorescent screen 3 formed thereon are extremely minute.

In the illustrated example, each member and the spacing between the members are greatly exaggerated. On both sides of the array of fluorescent screens 3 on the insulator 1,
Insulating layers 4, 4 are formed along the longitudinal direction, and grid electrodes 5, 5 are formed on these, respectively. In FIG. 9, reference numeral 6.6 indicates a tungsten wire as a hot cathode stretched in the longitudinal direction of the insulator 1, and 7 indicates a face member made of a transparent material such as glass. As shown in FIG. 10, it is integrated with the insulator 1. And insulator 1. Insulating layer 4, 4. The grid electrode 5.5 and the face member 7 form a highly evacuated closed space, and conductor patterns 2, 2..., are formed in this space.
The fluorescent screens 3, 3, . . . and the tungsten wire 6, 6 are confined. Since the function of such a phosphor dot array tube is well known, a description thereof will be omitted.

An embodiment of the conductive pattern formed body and its forming process will be described based on FIGS. 1 and 2. FIG. In the step of forming a conductor film on an insulator, a conductor film 2A made of AM, Ni, Cr, Au, etc. is formed on substantially the entire surface of the insulator 1 made of glass, ceramic, plastic, etc. by appropriate means such as sputtering or vapor deposition. form.

A conductor pattern is formed in a conductor pattern forming process using photolithography. This step includes a resist coating step in which a resist film 8 made of a photoresist material is applied to substantially the entire surface of the conductive film 2A formed on the insulator 1, a pre-bake step in which the resist film 8 is baked, and a pattern exposure to the resist film 8. a pattern exposure step in which the exposed resist film 8 is developed to form a slit 8a and a portion 2Aa of the conductor film 2A is exposed; a rinsing step in which the developed resist film is washed away; and a rinsing step after the rinsing step. a post-bake step in which the resist film is baked again; and an etching solution is supplied to the exposed part 2Aa of the conductor film to etch the conductor film in that part.

Conductor etching step (
The process consists of a conductor film removal process) and a rinsing process to wash away the conductor after etching. Through the conductor etching process, the conductor film 2A is shaped into a conductor pattern 2.2 having a shape based on the pattern selected by pattern exposure. Although the steps up to this point are the same as the conventional steps, the present invention has a major feature in the steps that follow.

Next, in the step of etching the insulator, at least the exposed part 1a of the insulator 1 is coated with an etching agent 9 that dissolves or corrodes the insulator 1, or exposed to an etching solution to etch the part. A recess 1b is formed in. Next.

In the process of removing etching agents and resist films.

When the etching agent 9 and the resist film 8 are removed, the insulator 1
This means that conductor patterns 2, 2 are formed on the surface with the recess 1b in between. The etching agent for etching the insulator 1 is selected depending on the material of the insulator 1. For example, when glass is used as the insulator, a fluorine-based corrosive ink is applied and the etching agent is applied for about 60 seconds. If left alone, a recess 1b with a depth of about 3 μm is formed.Depending on the conditions, it is also possible to form a recess with a depth of about 10 μm. In the case of soda lime glass, the inner surface of the recess becomes a finely uneven surface, making it optically opaque, but in the case of silicate glass, the etched surface is relatively smooth, and the transparency is lower than that of the former. Therefore, the combination of insulator and etching agent is selected depending on the usability of the conductor pattern forming process.

3 and 4, a method for forming a conductor pattern formed body according to the present invention and a conductor pattern formed body obtained by implementing this method will be explained. In the step of forming a conductor film on the insulator, a conductor film 2A is formed on the surface of the insulator 1.

A conductor pattern is formed in a conductor pattern forming process using photolithography. This process is the same from the resist coating process to the post-bake process among the processes explained in FIG. 1 and FIG.
A a is exposed. Next, in the conductor film and insulator etching process (conductor removal process and insulator removal process), a resist film 8,
8 does not dissolve (or erode), but 2 conductor films and 1 insulator
The conductor pattern 2A and part of the insulator 1 are removed in the same process by applying an etching agent 9° made of an acidic solution that dissolves or erodes both the conductor pattern 2A and the insulator 1.
2 and a recess 1b is formed. After this, etching agent.

In the resist agent removal process, when the etching agent 9° and the resist films 8, 8 are removed, the conductor pattern 2 is removed.
, a conductive pattern formed body A having a recessed portion 1b between the two is obtained. As the etching agent 90, an appropriate material is selected depending on the combination of the materials of the insulator 1 and the conductive film 2A.

When glass is used as an insulator and a conductor film made of AJ, Cu, Ni, etc. is formed as a conductor material, an etching solution made of hydrofluoric acid, nitric acid, hydrochloric acid, acetic acid, etc. is used. . - Numerically, the combination of AQ-glass-hydrofluoric acid is advantageous in terms of cost. According to this formation method, the conductor removal process and the insulator removal process are performed in the same process, so that the efficiency of processes such as cleaning and drying after removing the etching agent and removing the resist film can be improved.

5 and 6, another method of forming the conductive pattern formed body A will be explained. In a pattern forming process using conductor printing, a paste-like conductor 2 is directly patterned on the surface of an insulator 1 by printing or the like. Conductor pattern 2, 2
Due to the formation of the insulator 1, a portion 1a of the insulator 1 is exposed. In the insulator etching step, at least the exposed portion 1a
An etching agent 91 for etching the insulator 1 is applied thereto to form a recess 1b in the insulator. At this time, the conductor patterns 2, 2 function as an etching mask. Regarding the etching agent for insulator 1.

As explained with reference to FIG. 1, conditions such as time and conditions that match the material of the insulator are selected. and.

After a predetermined period of time has elapsed, the etching agent 91 is removed in an etching agent removal step, and a conductor pattern forming body A having conductor patterns 2, 2 formed on the surface of the insulator 1 with a recess 1b between them is formed. That means that.

7 and 8, another embodiment of the method invention will be described. This embodiment is characterized in that the concave shape is formed mechanically, without using the photolithography method explained in FIGS. 3 and 4. In the process of forming a conductor film of the insulator, a conductor film 2A is formed on substantially the entire surface of the insulator 1, and in the process of forming a conductor pattern using a cutting machine, the conductor film 2A and the insulator 1 are cut with a cutting machine 92. Conductor pattern 2
Form ゜2. The cutting machine 92 cuts the conductor and the insulator while moving in a direction perpendicular to one sheet of paper. After cutting, when cutting waste, oil used for cutting, etc. are removed in a cutting waste removal step, a conductive pattern formed body A having conductive patterns 2, 2 with recesses 1b interposed therebetween is obtained. In the illustrated embodiment, the recess 1b is formed mechanically using a cutting machine, but the recess 1b may also be formed by melting the conductor and insulator using a laser beam. Also, the conductor film removal process and the insulator removal process can be performed in the same process.

In the method for forming a conductive pattern formed body, since the surface of the insulator formed with the recesses has an uneven shape, if a step of applying a resin coating to the surface is added, the resulting conductive pattern formed body This eliminates the adhesion of moisture, foreign matter, etc., and has the effect of further reducing electrical shorts and leaks between conductor patterns.

The larger the depth of the concave portion 1b, the longer the distance along the insulator surface between adjacent conductor patterns, which is effective against electrical shorts, etc. The depth is determined taking into account the strength of the insulator 1 as a substrate.

A fluorescent screen 3 (see FIGS. 9 and 10) is formed on the conductor patterns 2, 2 by a well-known method such as electrophoresis. In the above explanation, an example was given in which a fluorescent screen is formed as a conductive pattern formed body, but the conductive pattern formed body of the present invention is not limited to this, and may be a conductive pattern formed body such as an integrated circuit. Of course, it can also be applied to

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing an example of the process of forming a conductor pattern formed body of the present invention, FIG. 2 is a sectional view showing the process of forming a conductor pattern formed body of the present invention, and FIG. FIG. 4 is a cross-sectional view showing the process of forming a conductor pattern formed body obtained by the above-mentioned forming method, and FIG. FIG. 6 is a cross-sectional view of a conductor pattern formed body obtained by the above-mentioned forming method. FIG. 7 is a process diagram showing another embodiment of the method for forming a conductor pattern formed body of the present invention, FIG.
The figure is an exploded perspective view schematically showing a phosphor dot array tube using a conductor pattern forming body, and FIG. 10 is a sectional view of the same. DESCRIPTION OF SYMBOLS 1... Insulator, 2... Conductor pattern, 2A... Conductor film, 1b... Recessed part. 1 mouth shape 1 A 'rP) 6 figure δ Japanese broom A Uq figure

Claims (2)

[Claims] 1. 1. A conductor pattern formed body having conductive conductor patterns arranged in rows on an insulator surface, characterized in that a part of the insulator surface between adjacent conductor patterns is configured in a concave shape. 2. a conductor film forming step of forming a conductor film on the surface of the insulator;
A conductor film removal step in which a part of this conductor film is removed to form a desired conductor pattern, and an insulation step in which a part of the insulator corresponding to the conductor film portion to be removed in this conductor film removal step is removed in a concave shape. 1. A conductor pattern forming method comprising a conductor film removal step and an insulator removal step, the conductor film removal step and the insulator removal step being performed in the same step.