JPS61267605A - Conveying apparatus for electronic part - Google Patents

Abstract

PURPOSE:To reduce man power and to improve productivity by holding an electronic part with a lead terminal thereof inseted in a mesh belt and conveying same in a conveying apparatus for a blank substrate for a focus block. CONSTITUTION:When an elementary substrate 1 where a lead terminal 2 is soldered is supplied to a conveying apparatus, a sucking disc 3 is lowered to adsorb the elementary substrate 1 are lifted up together and moved onto a mesh conveyer 8. Simultaneously the mesh conveyer 8 is fed by fixed pitch. Lead terminal guide portions 11-12 are lifted up by a cylinder 14, and the guide plates 11 are expanded and passed through a mesh of the conveyer 8 to confront with the lead terminal 2. Subsequently, the sucking disc 3 is lowered by a cylinder 5 to insert the lead terminal 2 in the guide plates 11, and the adsorption is released. After that, the guide plates 11 are lowered to hold the substrate 1 on the conveyer 8. This arrangement can improve productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for transporting electronic components, such as a focus block element substrate, in which a variable resistance section and a fixed resistance section are provided in the same plane.

BACKGROUND OF THE INVENTION Conventionally, in this type of electronic component, a part of the conductive cover and the back surface were connected by a soldering method, and the element substrate was cleaned after soldering. There is no mechanized transport device for this cleaning, and the element substrates are manually aligned with the cleaning jig and loaded into the cleaning device. Figure 7 a- below
The conventional conveying method as described above will be described with reference to d.

First, in Fig. 7a, 1 is a focus block element substrate in which a variable resistor part and a fixed resistor part are provided in the same plane, and a lead terminal for connecting a part of the conductive path to the back surface. It has 2. As shown in FIG. 7, the element substrate 1 is placed obliquely between the guide rods 16 of the cleaning jig 16, and the element substrate 1 is held by the guide rods 16 by the lead terminals 2 and cleaned. They are aligned on the jig 16.

Next, the cleaning jig 16 is placed into the cleaning basket 17 shown in FIG. 7C, and then into the cleaning device 18 shown in FIG. I was going.

Problems to be Solved by the Invention However, with the above configuration, the element substrate 1 is transported manually, which requires a lot of manpower when producing in large quantities continuously, resulting in poor productivity. Ta.

Means for Solving the Problems In order to solve this problem, the present invention includes inserting lead terminals of electronic components into a mesh belt constructed by knitting wires in multiple rows in a mesh shape, and holding the electronic components on the mesh belt. It is something.

For production The effect of this technical means is as follows.

In other words, electronic components having multiple lead terminals can be easily transported by inserting the lead terminals into the gaps between the mesh belts, and by guiding the lead terminals, the electronic components can be transported continuously. This eliminates the need for conveyance, improving production efficiency.

EXAMPLES Hereinafter, examples of the present invention will be explained based on the drawings of FIGS. 1 to 6.

In FIG. 1, reference numeral 1 denotes an element substrate having lead terminals 2, which is supplied to a transport device as shown in FIG.

Further, as shown in FIG. 2, the suction cup 3 suctions and holds the surface of the element substrate 1, and is guided by the guides 4 and 6 by the cylinder 6.7 and can be moved in the vertical and horizontal directions, respectively.

8 is Metschbelt, details are shown in Figure 3a,
It is constructed by knitting wire rods in multiple rows in a mesh shape, and as shown in FIG. 3, lead terminals 2 are inserted between mesh belts 8, thereby holding the element substrate 1. Further, 9 is a sprocket for feeding the mesh belt, which feeds the mesh belt 8 at a constant pitch. A guide portion for the lead terminal 2 is attached below the mesh belt 8, the details of which are shown in FIGS. 4 and 5. That is, the guide plate 11 of the guide part has a thickness of 0.4 fl.
Two pieces of spring material are stacked and bent into a shape with one side open, and one set is attached to each side of the block 13. The guide plate 11 is then moved up and down by a cylinder 14 through two square holes 12a provided in the guide 12 to open and close the guide plate 11. No. 411a
, b show a perspective view of the guide plate 11 in the closed state and the teeth seen from the direction of arrow A, and FIGS. 5 a and 5 b show the guide plate 11 in the open state. In FIG. 4, the guide plate 11 is restrained by the square hole 12a of the guide 12 and is elastically deformed and closed, and in FIG. The structure is restored and opened. Next, the operation and effect of the structure according to this embodiment are shown in
The explanation will be based on -h.

First, as shown in FIG. 6a, the element substrate 1 to which the lead terminals 2 are soldered is supplied to a transport device. Next, as shown in FIG. 6, the suction cup 3 is guided by the guide 4 by the cylinder 5, moves downward, comes into close contact with the surface of the element substrate 1, and adsorbs the element substrate 1. Then, as shown in FIG. 6C, it is guided by the guide 4 by the cylinder 5 and moves upward. Next, as shown in FIG. 6d, the cylinder 7 moves to the right while being guided by the guide 6 and stops on the mesh conveyor 8.

At the same time, the mesh conveyor 8 is fed in fixed pitches by the sprocket 9, and the guide portion of the lead terminal 2 below the mesh conveyor 8 rises and moves directly below the mesh belt 8. Next, as shown in FIG.
The guiding plate 11 comes out from the square hole 12a of the guide 12 and is released from the restraint, and the guiding plate 11 opens due to the restoring force of the spring and in this state protrudes from the gap between the mesh belts 8. Next, as shown in FIG. 6f, the suction cup 3
1C adsorbed element substrate 1 is guided by cylinder 5 to guide 4
The lead terminal 2 is guided down and inserted into the guide plate 11 which is open from the gap between the mesh belts 8. Next, the suction of the suction cup 3 is released, and the block 13 is lowered by the cylinder 14 as shown in FIG. It is inserted between the mesh while still being held. next,
As shown in the sixth diagram, the guide portion of the lead terminal 2 moves downward, and the element substrate 1 is placed on the mesh belt 8. Next, the mesh belt 8 is fed at a fixed pitch by the sprocket 9, and by repeating the above operation,
The element substrate 1 is continuously conveyed onto the mesh belt 8.

Effects of the Invention As described above, the present invention has an electronic component having a plurality of lead terminals placed on a mesh belt. It is possible to mechanize the work of loading and transporting to the cleaning equipment, thereby improving productivity.

Further, by guiding the lead terminals, the electronic components can be continuously conveyed onto the conveyor, the conveyor can be made smaller, and the supply speed can also be improved.

[Brief explanation of the drawing]

FIG. 1 is an overall view of an electronic component transport device according to an embodiment of the present invention, FIG. 2 is a perspective view of the main parts of the same transport device, and FIG. 3 a
, b is a perspective view of the mesh belt of the same conveying device, Fig. 4a
, b and FIGS. 5a and 5b are perspective views and plan views showing the closed and open states of the guide plate of the guide section of the conveying device,
FIG. 6 a % h is an explanatory diagram of the operation of the conveying device of the present invention,
FIGS. 7a to 7d are explanatory diagrams showing a cleaning step in the manufacturing process of a focus block element body component. 1...Element board, 2...Lead terminal,
8... Metsch belt, 9... Sprocket, 10... Cleaning device. Name of agent: Patent attorney Toshio Nakao and 1 other person/-
--Temporary physical card figure 1
2---Reed Saki; 8---Metschwert's words 2nd page 3rd page ts 4 mouth 5th page

Claims (2)

[Claims] (1) It has a mesh belt constructed by weaving multiple rows of wire rods into a mesh shape, and the lead terminals of electronic components having multiple lead terminals are inserted into the gaps of the mesh belt, and the electronic components are placed on the mesh belt. A conveying device for electronic components, which is characterized by holding electronic components. (2) The electronic component conveyance device according to claim 1, further comprising a guide portion that guides the lead terminal of the electronic component into the gap between the mesh belts.