JPS61266575A - Substrate stuck with thin tin nitride film and its production - Google Patents

Abstract

PURPOSE:To stick a thin film of tin nitride having a uniform compsn. on a substrate by evaporating tin in an ionized or activated nitrogen atmosphere and bringing tin and gaseous introgen into reaction. CONSTITUTION:The inside of a vacuum bell-jar 1 is evacuated and thereafter gaseous N2 is introduced therein to maintain about 10<-4>-10<-1>Torr in the bell-jar 1. A crucible 2 is heated to evaporate the tin. A filament 3 is heated to release thermoelectrons. A positive DC voltage is impressed to an anode electrode 4 to accelerate the thermoelectrons and to bombard the same against the tin atoms and gaseous nitrogen, thereby ionizing or activating the same. Then the tin and the gaseous nitrogen react with each other to form the tin nitride which is deposited on the transparent substrate 5 and the film is thus formed. The thin tin nitride film is stuck thereon to 500-5,000Angstrom thickness. An electrochromic material having broad light absorption in a visible light region is obtd. by the above-mentioned method.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a tin nitride thin film-deposited substrate that has broad absorption characteristics in the visible range and is promising as an electrochromic material, and a method for manufacturing the same.

Conventional technology Conventionally, as a method of forming nitrided steel, a tin electrode and a copper electrode are placed in a reduced pressure nitrogen gas, and a tin electrode and a copper electrode are placed between them.

There is a known method in which nitrided steel is formed on the surface of a tin electrode by causing an arc discharge, accelerating the generated nitrogen ions by an electric field, and causing them to collide with a tin electrode.

Problems to be Solved by the Invention The nitrided steel made by this method cannot have a uniform composition, so its physical properties are not constant, and it has the disadvantage that it cannot be formed on any substrate. Ta.

The present invention provides a method for depositing a tin nitride thin film with a uniform composition on the surface of a transparent substrate, and also provides a tin nitride thin film-deposited substrate that has Teflon absorption characteristics in the visible region and is suitable as an electrochromic material.

Means for Solving the Problems The present invention is a tin nitride thin film-adhered substrate, which is formed by depositing a tin nitride thin film with a thickness of 5ooX to sooog on the surface of a transparent substrate. Furthermore, the present invention produces an ionized or activated nitrogen atmosphere by generating a discharge in a reduced pressure nitrogen gas,
This is a method for manufacturing a substrate to which a tin nitride thin film is attached, in which tin is evaporated in the atmosphere and a tin nitride thin film is formed on the surface of the transparent substrate placed in the atmosphere.

Function: The present invention can be applied to a transparent substrate of 500 to 500 mm! By depositing a tin nitride thin film with a thickness of 0OOA, it is possible to have broad light absorption in the visible light range.

In addition, the present invention evaporates tin in an ionized or activated nitrogen atmosphere and reacts the tin with nitrogen gas to deposit a thin film of nitride steel on a substrate, forming a tin nitride thin film with a uniform composition. be done.

EXAMPLES Hereinafter, examples of the present invention will be described in detail with reference to the drawings. Inside the vacuum Versier is a crucible in which tin is to be evaporated. A filament 3 is attached to the top of this crucible. The filament is made of tungsten or molybdenum wire and emits thermoelectrons.

An anode electrode t installed facing the filament
is for accelerating and concentrating hot electrons, and a positive DC voltage is applied. A substrate is placed directly above the crucible 2 and above the filament. A N2 gas introduction pipe 6 is connected to the vacuum verdure/.

After evacuating the inside of the vacuum bell share l to / Next, the tin crucible is heated to evaporate the copper. Furthermore, the filament 3 is also heated to emit thermoelectrons.

In this state, a positive DC voltage is applied to the anode at pole t to accelerate the hot electrons and cause them to collide with tin atoms and nitrogen gas, ionizing or activating them. The ionized or activated substances are highly reactive, and the two react to form nitrided steel, which is deposited on the substrate to form a film.

Ionization or activation requires a DC voltage of 20 V or more. Further, film formation is possible at a deposition rate of / to A, /Sec.

Using soda lime glass with a thickness of /m for the substrate, nitrogen pressure cuff, Ox / 0-3tOrr, ionization power JOVX /
A tin nitride film with a thickness of 3000 was created under the conditions of , fl)A, substrate temperature of 100°C-/20'' CI).The color of the film was as follows.
It turned a beige color with a slight purplish tinge. The spectral transmission ratio is as shown in Figure 2, from 300nm to 6oonm.
There was broad light absorption throughout the period.

In the embodiment, direct current discharge is used to ionize or activate nitrogen and tin, but high frequency waves or microwaves may also be used. Further, although soda lime glass was used as the substrate in the embodiment, since the substrate can be kept at 750° C. or lower in the vapor deposition method of the present invention, organic resin substrates such as plastic and acrylic plates can also be used. In this case, since the tin nitride thin film is strong, it also functions as a protective film.

Effects of the Invention The present invention can be applied to a transparent substrate of 500~! By depositing a tin nitride thin film with a thickness of 0OOIL, an electrochromic material having broad light absorption in the visible light region can be obtained.

In addition, the present invention evaporates tin in an ionized or activated nitrogen atmosphere and reacts tin with nitrogen gas.
A thin film of nitrided steel of uniform composition can be deposited on a substrate.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a conceptual diagram of a tin nitride thin film deposition apparatus, and FIG. 2 is a graph showing the spectral transmittance of the tin nitride thin film. /: Vacuum Beljua, Koni Crucible. 3: filament, 11: @polar electrode. ! : Substrate, Otsu: Gas introduction pipe Figure 2 Kaede L (nm)

Claims (2)

[Claims] (1) A tin nitride thin film-attached substrate, which is formed by depositing a tin nitride thin film with a thickness of 500 Å to 5000 Å on the surface of a transparent substrate. (2) Generate a discharge in a reduced pressure nitrogen gas to create an ionized or activated nitrogen atmosphere, evaporate tin in the atmosphere, and form a tin nitride thin film on the surface of the transparent substrate placed in the atmosphere. A method for manufacturing a substrate with a tin nitride thin film attached thereon.