JPS61265891A - Wiring tool - Google Patents

Wiring tool

Info

Publication number
JPS61265891A
JPS61265891A JP10897185A JP10897185A JPS61265891A JP S61265891 A JPS61265891 A JP S61265891A JP 10897185 A JP10897185 A JP 10897185A JP 10897185 A JP10897185 A JP 10897185A JP S61265891 A JPS61265891 A JP S61265891A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
wiring
view
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10897185A
Other languages
Japanese (ja)
Inventor
栄 内梨
博 真鍋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10897185A priority Critical patent/JPS61265891A/en
Publication of JPS61265891A publication Critical patent/JPS61265891A/en
Pending legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (技術分野〕 本発明は配線具に関する。[Detailed description of the invention] (Technical field〕 TECHNICAL FIELD The present invention relates to a wiring tool.

(背景技術〕 第9図は負荷および開閉器を4つ備えた制御回路金示し
ており、この制御回路においては電源スイッチ5t−O
Nモードにすると制御部11に電源Eが供給され、開閉
器としてのリレー接点Ry1〜Ry4’を制御すること
によって負荷H1〜H4に電源Et−供給するものであ
る。このような制御回路において、実際の結線は第10
図に示すようにプリント基板の表面の回路パターン12
および裏面の回路パターン13ヲ用いて電源E、各リレ
ー10〜40および負荷H3〜L’を互いに接続する方
法や、第11図に示す如くプリント基板の裏面にのみ回
路パターン13ヲ形成してプリント基板の表面において
ジャンパーリード線14を配線に用いる方法が考えられ
る。
(Background Art) Fig. 9 shows a control circuit equipped with four loads and switches, and in this control circuit, a power switch 5t-O
When the N mode is set, power E is supplied to the control unit 11, and power Et- is supplied to the loads H1 to H4 by controlling relay contacts Ry1 to Ry4' as switches. In such a control circuit, the actual connection is the 10th
As shown in the figure, the circuit pattern 12 on the surface of the printed circuit board
There is also a method of connecting the power supply E, each relay 10 to 40, and loads H3 to L' using the circuit pattern 13 on the back side, or a method of forming and printing the circuit pattern 13 only on the back side of the printed circuit board as shown in FIG. A possible method is to use jumper lead wires 14 for wiring on the surface of the substrate.

しかしながら、第10図に示す方法によると表裏両面に
回路パターン12.13が形成されたプリント基板上用
いる必要があり、コストの増加を招く一方、負荷容量が
大きい場合には整列される回路パターン12.13の@
を広くしなくてはならず、必然的にプリント基板が大型
化するという欠点があつ几。一方、第11図に示す方法
ではプリント基板は比較的、Jぐさなものですむ反面、
ジャンパーリード線14が例えば8本も必要となリ、実
装性が悪い等の欠点を有していた。
However, according to the method shown in FIG. 10, it is necessary to use a printed circuit board with circuit patterns 12 and 13 formed on both the front and back surfaces, which increases cost. .13@
The drawback is that the printed circuit board must be made larger. On the other hand, in the method shown in Fig. 11, the printed circuit board can be relatively J type, but on the other hand,
It has drawbacks such as requiring eight jumper lead wires 14 and poor mounting performance.

(発明の目的) 本発明は上記の欠点を解消するべく提案されたもので、
その目的とするところは、片面にのミ回路パターンが形
成されたプリント基板を使用可能としてコストの低減を
図9、シかもプリント基板の大型化を招くことなく実質
的に実装密度全高め、更にジャンパーリード線等を不要
として実装性を向上させるようにした配線具を提供する
ことにある。
(Object of the invention) The present invention has been proposed to solve the above-mentioned drawbacks.
The purpose of this is to reduce costs by making it possible to use a printed circuit board with a circuit pattern formed on one side, and to substantially increase the packaging density without increasing the size of the printed circuit board. An object of the present invention is to provide a wiring tool which eliminates the need for jumper lead wires and improves mounting performance.

(発明の開示) 以下、図に沿って本発明を説明する。まず、第1図およ
びi2図は本発明の一実施例を示すもので、第1図にお
いて1は本発明に用いられる配線金具であシ、この配線
金具1は長尺の連結片1aと、この連結片1aに等間隔
で垂設された複数の脚片1bとを備えている。また、こ
れらの脚片1b相互の間隔は、プリント基板上に実装さ
れる回路部品としての、後述のリレー10〜40の接点
間隔に適合するように設定されていると共に、先端部I
ce除く脚片1bの長さdは例えば3W程度として、プ
リント基板への実装時に連結片1aがプリント基板の表
面から若干浮くように設定される。なお、配線金具1の
肉厚は、負荷容量に合わせて適宜選択されるものである
(Disclosure of the Invention) The present invention will be described below with reference to the drawings. First, FIG. 1 and FIG. This connecting piece 1a is provided with a plurality of leg pieces 1b vertically arranged at equal intervals. Further, the mutual spacing between these leg pieces 1b is set to match the contact spacing of relays 10 to 40, which will be described later, as circuit components mounted on a printed circuit board, and the distance between the tip portions I
The length d of the leg piece 1b excluding ce is, for example, about 3W, and is set so that the connecting piece 1a is slightly lifted from the surface of the printed circuit board when mounted on the printed circuit board. Note that the thickness of the wiring fitting 1 is appropriately selected according to the load capacity.

次に、第2図は合成樹脂成形品等の絶縁物からなる絶縁
用ダクト2を示しておフ、その基台2aには配線金具I
t受容し得るような凹溝2bが複数形成され、ま元沿面
距離が3■以上となるように形状、構造が考慮されてい
る。
Next, FIG. 2 shows an insulating duct 2 made of an insulating material such as a synthetic resin molded product.
A plurality of concave grooves 2b are formed so as to accommodate t, and the shape and structure are taken into consideration so that the original creepage distance is 3 mm or more.

第3図は本発明金柑いて配線し次場合の第1の応用例を
示しておシ、プリント基板Pの表面に実装され九回路部
品としての複数のリレー10〜40に近接させて2個の
配線金具1を立設し、各リレー接点R3’+〜Ry、の
各一端をプリント基板Pの裏面に形成された回路パター
ンP1ヲ介して配線金具1の先端部ICにそれぞれ接続
すると共に、各リレー接点R’A〜Ry4の他端と負荷
H1〜H4と全同じく回路パターンPIを介して接続す
るようにしたものである。なお、第3図においてt+、
hは!1Mの接続端子を示している0この場合において
、前述の絶縁用ダクト2(第2図参照)は凹溝2bが2
つあるものを用い、これを配線金具1に被装すればよい
FIG. 3 shows a first application example of the present invention, in which two relays are mounted on the surface of a printed circuit board P and placed close to a plurality of relays 10 to 40 as circuit components. The wiring fitting 1 is installed upright, and one end of each relay contact R3'+ to Ry is connected to the tip IC of the wiring fitting 1 via the circuit pattern P1 formed on the back surface of the printed circuit board P. The other ends of the relay contacts R'A to Ry4 are connected to the loads H1 to H4 through the same circuit pattern PI. In addition, in FIG. 3, t+,
h is! In this case, the above-mentioned insulating duct 2 (see Fig. 2) has a concave groove 2b with a 1M connection terminal.
The wiring fitting 1 may be covered with this.

次いで、第4図および第5図は本発明の第2の応用例を
示している。すなわち、この例では1!源回路が2つあ
る場合に、電源A、Bの接続端子t、〜L、にそれぞれ
接続される4個の配線金具1を用いている。そして、こ
の例では、各配線金具1の不要な連結片1aや脚片1b
t適宜切除することにより、絶縁を一層確実に行なうこ
とが可能であり、また、1個の配線金具1を切断して分
割した各部を例えば接続端子t、+ Ltに接続するべ
く配設することによって配線金具1を無駄なく利用する
ことができる。なお、他の構成は第3図の例と同様であ
るため、詳述を省略する。
Next, FIGS. 4 and 5 show a second application example of the present invention. That is, in this example, 1! When there are two power supply circuits, four wiring fittings 1 are used which are respectively connected to the connection terminals t and -L of the power supplies A and B. In this example, the unnecessary connecting pieces 1a and leg pieces 1b of each wiring fitting 1 are
By appropriately cutting off the wiring fitting 1, insulation can be further ensured, and each of the divided parts can be arranged to be connected to, for example, the connection terminals t and +Lt. This allows the wiring fitting 1 to be used without waste. Note that the other configurations are the same as the example shown in FIG. 3, so detailed description will be omitted.

第6図および第7図は絶縁用ダクト2を用い之場合の応
用例であり、第4図および第5図のように配線金具1を
複数近接させて立設することによって配線金具1の相互
の間隔が例えば2.5■以下となった場合に、このよう
に絶縁用ダクト2を被装すると絶縁対策上、極めて有効
である0 更に第8図は本発明の他の実施例を示しており、第4図
ないし第7図の如く結線パターンが一様に決まっている
ような場合に、予め配線金具1と絶縁用ダクト2とを一
体成形するようにしたもので、こうすることにより実装
性をより一層向上させることが可能である。
6 and 7 are application examples in which the insulating duct 2 is used, and by standing a plurality of wiring fittings 1 close to each other as shown in FIGS. 4 and 5, the wiring fittings 1 can be connected to each other. For example, when the distance between the insulating ducts 2 is 2.5 square meters or less, covering the insulating duct 2 in this way is extremely effective as an insulation measure.Furthermore, FIG. 8 shows another embodiment of the present invention. When the wiring pattern is uniformly determined as shown in Figures 4 to 7, the wiring fitting 1 and the insulating duct 2 are integrally molded in advance. It is possible to further improve performance.

(発明の効果) 以上述べたように本発明によれば、一方の面に回路部品
が実装されるプリント基板と、このプリント基板の前記
一方の面に複数の脚片を介して立設される配線金具と全
備え、この配線金具の一端を電源に接続すると共に、前
記プリント基板の他方の面に形成された回路パターンを
介して前記回路部品を前記脚片と負荷とに接続し几から
、プリント基板の表面に実装されたすレーの如き回路部
品を、同じく表面に立設されi 配M 金具と、プリン
ト基板の裏面に形成されり回路パターンと金倉して電源
および負荷に接続することができ、片面にのみ(gl回
路パターン形成され九プリント基板を使用可能として従
来例(第10図参照)よすもプリント基板自体のコスト
の低減が図れるという効果がある。
(Effects of the Invention) As described above, according to the present invention, there is provided a printed circuit board on which a circuit component is mounted on one surface thereof, and a printed circuit board that is erected on the one surface of the printed circuit board via a plurality of leg pieces. Completely equipped with a wiring fitting, one end of the wiring fitting is connected to a power source, and the circuit component is connected to the leg piece and the load via a circuit pattern formed on the other side of the printed circuit board. It is possible to connect circuit components such as strips mounted on the surface of a printed circuit board to a power source and load by connecting them to metal fittings also erected on the surface and circuit patterns formed on the back surface of the printed circuit board. This has the effect of reducing the cost of the printed circuit board itself (as compared to the conventional example (see FIG. 10)) by making it possible to use a printed circuit board with a GL circuit pattern formed on only one side.

また、配線金具によって立体的に結線を行なうため、小
型のプリント基板であっても平面的なスペースに対する
実装密度を高めることができ、更に従来例(第11図参
照)のよりなジャンパーリードM’に不要として実装性
の飛躍的な向上が可能である。
In addition, since three-dimensional connections are made using wiring fittings, it is possible to increase the mounting density in a flat space even on a small printed circuit board, and furthermore, the jumper lead M' Since this is not necessary, it is possible to dramatically improve the ease of implementation.

加えて、必要に応じて絶縁用ダクトを使用すれば、高密
度の配線であっても絶縁を確実に担保することができる
等の利点含有する。
In addition, if an insulating duct is used as necessary, there are advantages such as ensuring insulation even in high-density wiring.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(イ)は配線金具の正面図、同(ロ)は同じく側
面図、第2図@)は絶縁用ダクトの平面図、同(o、)
は同じく側面図、第3図は本発明の第10応用例を示す
平面図、第4図は同じく第2の応用例を示す平面図、第
5図は第4図の正面図、第6図は本発明の第3の応用例
を示す平面図、第7図は同じく正面図、第8図は本発明
の他の実施例を示すもので同@)は要部の平面図、同(
ロ)は同じく正面図、同(ハ)は同じく側面図、第9図
は制御回路の説明図、第10図および第11図は従来の
配線方法の説明図である。 1・・・・・・配線金具、1b・・・・・・脚片、 1
0.20.30゜伯・・・・・・回路部品としてのリレ
ー% HI I L I H31山・・・・・・負荷、
P・・・・・・プリント基板、P、・・・・・・回路パ
ターン
Figure 1 (A) is a front view of the wiring fitting, Figure 2 (B) is a side view, Figure 2 @) is a plan view of the insulating duct, and Figure 2 (O, ) is a plan view of the insulating duct.
is a side view, FIG. 3 is a plan view showing a tenth application example of the present invention, FIG. 4 is a plan view showing a second application example, FIG. 5 is a front view of FIG. 4, and FIG. is a plan view showing the third application example of the present invention, FIG. 7 is a front view, and FIG. 8 is a plan view of the main part, and FIG.
(b) is a front view, (c) is a side view, FIG. 9 is an explanatory diagram of a control circuit, and FIGS. 10 and 11 are explanatory diagrams of a conventional wiring method. 1... Wiring fittings, 1b... Leg pieces, 1
0.20.30°...Relay as a circuit component% HI I L I H31 mountain...Load,
P...Printed circuit board, P...Circuit pattern

Claims (2)

【特許請求の範囲】[Claims] (1)一方の面に回路部品が実装されるプリント基板と
、このプリント基板の前記一方の面に複数の脚片を介し
て立設される配線金具とを備え、この配線金具の一端を
電源に接続すると共に、前記プリント基板の他方の面に
形成された回路パターンを介して前記回路部品を前記脚
片と負荷とに接続してなる配線具。
(1) A printed circuit board on which circuit components are mounted on one surface, and a wiring fitting that is erected on the one surface of the printed circuit board via a plurality of legs, and one end of the wiring fitting is connected to a power source. and the circuit component is connected to the leg piece and the load via a circuit pattern formed on the other surface of the printed circuit board.
(2)互いに並設された複数の配線金具に絶縁用ダクト
を被装してなる特許請求の範囲第1項記載の配線具。
(2) The wiring fitting according to claim 1, wherein a plurality of wiring fittings arranged in parallel are covered with an insulating duct.
JP10897185A 1985-05-20 1985-05-20 Wiring tool Pending JPS61265891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10897185A JPS61265891A (en) 1985-05-20 1985-05-20 Wiring tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10897185A JPS61265891A (en) 1985-05-20 1985-05-20 Wiring tool

Publications (1)

Publication Number Publication Date
JPS61265891A true JPS61265891A (en) 1986-11-25

Family

ID=14498291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10897185A Pending JPS61265891A (en) 1985-05-20 1985-05-20 Wiring tool

Country Status (1)

Country Link
JP (1) JPS61265891A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920667B2 (en) * 1977-01-27 1984-05-15 塩野義製薬株式会社 Sulfonamide benzamide derivatives

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920667B2 (en) * 1977-01-27 1984-05-15 塩野義製薬株式会社 Sulfonamide benzamide derivatives

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