JP2002208675A - Power system electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the wiring resistance of a member which constitutes a large current line and to suppress the heat generation of the large current line low, without increasing the dimensions of a control board and a product so much. SOLUTION: For this power system electronic components, a plurality of power system bare chips 10 and the control board 11, where a control circuit for controlling the power system bare chips 10 is formed, are loaded on a lead frame 1. The lead frame 1 is provided with a bus bar 8 for large current feeding cable, and the bus bar 8 for the large current feeding cable is turned to the large current line of the plurality of the power system bare chips 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a power electronic component having a plurality of power semiconductor elements mounted on a lead frame.

[0002]

2. Description of the Related Art A conventional power electronic component of this type is shown in FIG. 5, and FIG. 5 is a plan view showing a state in which three power bare chips and a control board are mounted on a lead frame. It is.

[0003] As shown in FIG.
Has a substantially rectangular frame-shaped carrier portion 50a, and four component mounting portions 50c each connected to the carrier portion 50a via a connecting piece portion 50b or the like, and three of the four component mounting portions 50c. And a control board 52 is mounted over the four component mounting portions 50c. The control circuit of the power system bare chip 51 is formed on the control board 52, and a large current routing circuit pattern 53 is provided on the control board 52.

Each power system bare chip 51 and control board 52
Are electrically connected to each other by two wires 54, and one wire 54 of each power system bare chip 51 is connected.
Are connected to the large current routing circuit pattern 53. The large current routing circuit pattern 54 is a component mounting portion 50c on which the power system bare chip 51 is not mounted by the wire 54.
Is electrically connected to That is, the three power-related bare chips 51 are electrically connected to each other via the large-current routing circuit pattern 53 on the control board 52, and the large-current routing circuit pattern 53 is connected to the large-current line (ground). line)
It has been.

[0005]

By the way, in the conventional power electronic component, a circuit pattern 53 for routing a large current is used.
It is necessary to increase the width and thickness of the large current routing circuit pattern 53 in order to suppress the wiring resistance of the high current wiring. However, in order to reduce the wiring resistance of the large current routing circuit pattern 53 provided on the control board 52 to a desired value, the large current routing circuit pattern 53 needs to have a very large width and thickness. Become. As a result, there is a problem that the size of the control board 52 is increased, and the size of the product is increased.

Accordingly, the present invention has been made to solve the above-mentioned problems, and has been made to reduce the wiring resistance of members constituting a large current line without increasing the size of a control board or a product. It is an object of the present invention to provide a power electronic component capable of suppressing the amount of heat generated in a current line low.

[0007]

According to a first aspect of the present invention, there is provided a power electronic device having a lead frame on which a plurality of power semiconductor elements and a control board on which a control circuit for controlling the power semiconductor elements are formed are mounted. A large current routing bus bar is provided on the lead frame, and the large current routing bus bar is a large current line of a plurality of the power semiconductor elements.

In this power electronic component, a large current routing bus bar is provided on a lead frame having a smaller wiring resistance value than a circuit pattern on a control board, and the large current routing bus bar is a large current line. Therefore, the amount of heat generated in the large current line can be reduced.

According to a second aspect of the present invention, there is provided the power electronic component according to the first aspect, wherein the power semiconductor element is a power bare chip.

With this power system electronic component, the same effect as the first aspect of the invention can be obtained for a large current line of a plurality of power system bare chips.

According to a third aspect of the present invention, there is provided the power electronic component according to the second aspect, wherein each of the power bare chips is electrically connected to the high current routing bus bar via a wire. It is characterized by.

In this power system electronic component, in addition to the function of the invention described in claim 2, each power system bare chip can be connected to the large current routing bus bar by wire bonding.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

1 to 4 show an embodiment of the present invention.
In this embodiment, a case where the power electronic component is a power bare chip mounted component is shown. FIG. 1 is a plan view of a lead frame, FIG. 2 is a plan view showing a state where a power bare chip and a control board are mounted on the lead frame, FIG. 3 is a plan view showing a cut position of the lead frame, and FIG. It is a top view of the completed product of FIG.

As shown in FIG. 1, the lead frame 1
A substantially rectangular frame-shaped carrier portion 4 and four component mounting portions 4 respectively connected to the carrier portion 2 via a connection piece 3 and the like.
a to 4d, at positions opposite to the mounting positions of the power-related bare chips 10 (described below) of the component mounting portions 4a to 4d,
A plurality of connector terminal portions 6 directly guided from the component mounting portions 4a to 4d or connected from the carrier portion 2 via the connecting piece portions 5, and connector terminal portions for the four component mounting portions 4a to 4d. At the position opposite to the position where 6 was placed,
Further, the bus bar 8 includes a large current routing busbar 8 connected to the carrier unit 2 via a connection piece 7. The lead frame 1 is formed of a Cu alloy material.

The carrier section 2 is provided with holes 9 for reference positioning and conveyance at appropriate positions. Four component mounting parts 4a to
The component mounting portions 4a to 4d are integrally connected to different ones of the connector terminal portions 6, respectively. Thus, each of the four component mounting portions 4a to 4d also has a function as a wiring (current line).

As shown in FIG. 2, four component mounting portions 4a
Power-based bare chips 10, which are power-based semiconductor elements, are mounted on three of 4a to 4c by bonding with an adhesive or the like. Each component mounting part 4a-4d
Has a function as a heat radiating plate for each mounted power system bare chip 10, and as described above, each of the component mounting portions 4a to 4d
The space is made as large as possible within the rectangular frame-shaped carrier portion 2 so that effective heat radiation is achieved. A control board 11 is mounted on all of the four component mounting sections 4a to 4d, and a control circuit for controlling the three power-related bare chips 10 is formed on the control board 11. The control board 11 is not provided with the large current routing circuit pattern as in the conventional example.

Each power system bare chip 10 and control board 11
Are electrically connected to each other via wires 12a, and each power system bare chip 10 and the bus bars 8 for high current routing are also electrically connected to each other via wires 12b. The bus bar 8 for large current routing and the component mounting portion 4d on which the power system bare chip 10 is not mounted are also electrically connected by the wire 12c, and the rightmost connector terminal 6 is used as a ground terminal. . In other words, the ground terminals of the three power system chips 10 are electrically connected to each other via the large current routing bus bar 8, and the large current routing bus bar 8 is a large current line. Also, each input / output terminal of the control board 11 and each component mounting section 4
The connector terminals 6 that are not directly connected to a to 4d are also electrically connected via wires 12d.

As described above, the three power-related bare chips 10 and the control board 11 are mounted on the lead frame 1 and the wire-bonded one is provided with the package 13 by transfer molding, and a part of the lead frame 1 is removed. And is enclosed in the package part 13.

Then, the lead frame 1 is moved to the position c shown in FIG.
Unnecessary portions of the lead frame are cut at the portions, and the unnecessary portion of the lead frame is cut, thereby completing the power-based bare chip mounting component A as shown in FIG.

As described above, the power-based bare chip mounting component A
Then, a large current routing bus bar (Cu alloy) 8 is provided on the lead frame 1 having a smaller wiring resistance value than the circuit pattern (Pt-Ag) on the control board 11, and a plurality of the large current routing bus bars 8 are provided. By using the power-based electronic component 10 as a large current line, the amount of heat generated by the large current line can be reduced. Further, it is not necessary to form a large current routing circuit pattern on the control board 11 as in the conventional example, and the large current routing bus bar 8 of the lead frame 1 can be arranged in a small space. Without increasing the dimensions of the control board 11 and the product, the wiring resistance of the members constituting the large current line can be reduced, and the heat generation of the large current line can be reduced.

In this embodiment, the lead frame 1
A plurality of power-bearing chips 10 and a control board 11 are mounted thereon, electrical connection between predetermined portions is performed by wire bonding, and transfer molding is performed. A power system bare chip mounting module (module) having the connector terminal portion 6 can be provided.

In this embodiment, since the power bare chip 10 is mounted on each of the component mounting portions 4a to 4c of the lead frame 1 having good heat radiation, the component mounting portions 4a to 4c of the lead frame 1 And the transient thermal resistance can be kept low.

Further, in this embodiment, the case where the power semiconductor element is the power bare chip 10 is shown. However, the present invention can be applied to a case where a semiconductor element having a large heat generation other than the power bare chip 10 is mounted. Can be applied.

In this embodiment, a component on which three power-related bare chips 10 are mounted has been described. However, the number of mounted components may be two or four or more.

In this embodiment, since each power system bare chip 10 is connected to the large current routing bus bar 8 via the wire 12b, each power system bare chip 10 and the large current routing bus bar 8 are connected to each other. Can be connected by wire bonding.

Further, in this embodiment, the power-based bare chip mounting component A is provided with a plurality of connector terminals 6 for making an electrical connection to the outside, so that connection to a wire harness or the like is easy.

[0028]

As described above, according to the first aspect of the present invention, a plurality of power semiconductor elements and a control board on which a control circuit for controlling the power semiconductor elements are formed are mounted on a lead frame. Power electronic components,
A large current routing bus bar is provided on the lead frame, and the large current routing bus bar is used as a large current line for a plurality of power semiconductor elements. A large current routing bus bar is provided on the control board, and the large current routing bus bar is used as a large current line for a plurality of power system electronic components. There is no need to form a pattern, and a bus bar for routing a large current of a lead frame can be arranged in a small space. As described above, the heating resistance of the large current line can be reduced by reducing the wiring resistance of the members constituting the large current line without increasing the dimensions of the control board and the product.

According to the second aspect of the present invention, in the power electronic component according to the first aspect, since the power semiconductor element is a power bare chip, it can be used for a large current line of a plurality of power bare chips. The same effect as that of the first aspect can be obtained.

According to a third aspect of the present invention, there is provided the power electronic component according to the second aspect, wherein each power system bare chip comprises:
Since each of the power-bearing busbars and the high-current routing busbar are electrically connected to the high-current routing busbar via a wire, the power-bearing chip and the high-current routing busbar are individually connected by wire bonding. Can connect.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame according to an embodiment of the present invention.

FIG. 2 shows one embodiment of the present invention, and is a plan view showing a state in which a power bare chip and a control board are mounted on a lead frame.

FIG. 3 is a plan view showing an embodiment of the present invention and showing a cut position of a lead frame.

FIG. 4 shows one embodiment of the present invention, and is a plan view of a completed product of a power-based bare chip mounting component.

FIG. 5 is a plan view showing a conventional example, in which three power bare chips and a control board are mounted on a lead frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 8 Bus bar for wiring large current 10 Power bare chip 11 Control board 12a ~ 12d Wire A Power bare chip mounted part (power electronic part)

 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Kaoru Kurita 2464-48 Washitsu, Kosai-shi, Shizuoka Yazaki Parts Co., Ltd. F-term (reference) 4M109 DB20 FA01 GA02

Claims (3)

[Claims] A power electronic component in which a lead frame is mounted with a plurality of power semiconductor elements and a control board on which a control circuit for controlling the power semiconductor elements is formed. A power electronic component comprising: a routing bus bar; and the large current routing bus bar serving as a large current line of a plurality of the power semiconductor elements. 2. The power electronic component according to claim 1, wherein the power semiconductor element is a power bare chip. 3. The power electronic component according to claim 2, wherein each of the power bare chips is electrically connected to the large current routing busbar via a wire. Electronic parts.