JPS6126572A - セラミツク製品およびその製造方法 - Google Patents
セラミツク製品およびその製造方法Info
- Publication number
- JPS6126572A JPS6126572A JP14716084A JP14716084A JPS6126572A JP S6126572 A JPS6126572 A JP S6126572A JP 14716084 A JP14716084 A JP 14716084A JP 14716084 A JP14716084 A JP 14716084A JP S6126572 A JPS6126572 A JP S6126572A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- ceramic
- adhesive
- product according
- ceramic product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000853 adhesive Substances 0.000 claims description 72
- 230000001070 adhesive effect Effects 0.000 claims description 72
- 238000010304 firing Methods 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 29
- 239000013078 crystal Substances 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 229910052878 cordierite Inorganic materials 0.000 claims description 22
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 22
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 11
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 11
- 239000011707 mineral Substances 0.000 claims description 11
- 229910052644 β-spodumene Inorganic materials 0.000 claims description 10
- 239000000395 magnesium oxide Substances 0.000 claims description 9
- 229910000502 Li-aluminosilicate Inorganic materials 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 238000005304 joining Methods 0.000 claims description 7
- 229910000174 eucryptite Inorganic materials 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 229910000505 Al2TiO5 Inorganic materials 0.000 claims description 4
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052634 enstatite Inorganic materials 0.000 claims description 4
- 229910052839 forsterite Inorganic materials 0.000 claims description 4
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 4
- BBCCCLINBSELLX-UHFFFAOYSA-N magnesium;dihydroxy(oxo)silane Chemical compound [Mg+2].O[Si](O)=O BBCCCLINBSELLX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052863 mullite Inorganic materials 0.000 claims description 4
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 claims description 4
- 229910052596 spinel Inorganic materials 0.000 claims description 4
- 239000011029 spinel Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052643 α-spodumene Inorganic materials 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 6
- 235000012245 magnesium oxide Nutrition 0.000 claims 3
- 235000010755 mineral Nutrition 0.000 claims 2
- 239000005995 Aluminium silicate Substances 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- 235000012211 aluminium silicate Nutrition 0.000 claims 1
- HEHRHMRHPUNLIR-UHFFFAOYSA-N aluminum;hydroxy-[hydroxy(oxo)silyl]oxy-oxosilane;lithium Chemical compound [Li].[Al].O[Si](=O)O[Si](O)=O.O[Si](=O)O[Si](O)=O HEHRHMRHPUNLIR-UHFFFAOYSA-N 0.000 claims 1
- 239000010431 corundum Substances 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 229910052906 cristobalite Inorganic materials 0.000 claims 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 claims 1
- 229910052808 lithium carbonate Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims 1
- 239000001095 magnesium carbonate Substances 0.000 claims 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims 1
- 229910052670 petalite Inorganic materials 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 18
- 239000002994 raw material Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 229910001416 lithium ion Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 polysiloxane Chemical group 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 241000219104 Cucurbitaceae Species 0.000 description 1
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 1
- 229910003134 ZrOx Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052656 albite Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical group 0.000 description 1
- DLHONNLASJQAHX-UHFFFAOYSA-N aluminum;potassium;oxygen(2-);silicon(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Si+4].[Si+4].[Si+4].[K+] DLHONNLASJQAHX-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052652 orthoclase Inorganic materials 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Chemical group 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- FKHIFSZMMVMEQY-UHFFFAOYSA-N talc Chemical compound [Mg+2].[O-][Si]([O-])=O FKHIFSZMMVMEQY-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716084A JPS6126572A (ja) | 1984-07-16 | 1984-07-16 | セラミツク製品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716084A JPS6126572A (ja) | 1984-07-16 | 1984-07-16 | セラミツク製品およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6126572A true JPS6126572A (ja) | 1986-02-05 |
| JPH048397B2 JPH048397B2 (en, 2012) | 1992-02-14 |
Family
ID=15423941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14716084A Granted JPS6126572A (ja) | 1984-07-16 | 1984-07-16 | セラミツク製品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6126572A (en, 2012) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4792537A (en) * | 1985-07-13 | 1988-12-20 | Murata Manufacturing Co., Ltd. | Dielectric ceramic composition for high frequencies |
| WO2003031371A1 (fr) * | 2001-10-02 | 2003-04-17 | Ngk Insulators, Ltd. | Corps structural en nid d'abeille et procede de fabrication |
| WO2003048072A1 (en) * | 2001-12-06 | 2003-06-12 | Ngk Insulators, Ltd. | Honeycomb structure body and method for manufacturing the same |
| JP2004059402A (ja) * | 2002-07-31 | 2004-02-26 | Taiheiyo Cement Corp | 低熱膨張セラミックス接合体 |
| JP2004179353A (ja) * | 2002-11-27 | 2004-06-24 | Taiheiyo Cement Corp | ステージ部材 |
| WO2008096851A1 (ja) * | 2007-02-08 | 2008-08-14 | Ngk Insulators, Ltd. | 接合材組成物及びその製造方法並びに接合体及びその製造方法 |
| WO2008117611A1 (ja) * | 2007-03-26 | 2008-10-02 | Ngk Insulators, Ltd. | 接合材組成物及びその製造方法並びに接合体及びその製造方法 |
| JP2010234333A (ja) * | 2009-03-31 | 2010-10-21 | Ngk Insulators Ltd | 目封止ハニカム構造体、およびそれを用いたディーゼルパティキュレートフィルタ |
| JP2010247999A (ja) * | 2009-04-10 | 2010-11-04 | Nikko Co | 低温焼成高強度低熱膨張性磁器及びその製造方法 |
| JP2011046607A (ja) * | 2003-11-12 | 2011-03-10 | Ibiden Co Ltd | セラミック構造体の製造装置、及び、セラミック構造体の製造方法 |
| JP2015224173A (ja) * | 2014-05-29 | 2015-12-14 | 京セラ株式会社 | コージェライト接合体 |
| JP2016113335A (ja) * | 2014-12-16 | 2016-06-23 | 三井金属鉱業株式会社 | セラミックス接合体、セラミックス接合用接着剤の製造方法およびセラミックス接合体の製造方法 |
| JP2016222884A (ja) * | 2014-12-30 | 2016-12-28 | ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ | 異なるセラミック構成要素の結合 |
| US20220168901A1 (en) * | 2020-12-01 | 2022-06-02 | Premium Aerotec Gmbh | System And Method For Inserting Or Removing Cutting Inserts Of A Cutting Tool |
| WO2023048194A1 (ja) * | 2021-09-27 | 2023-03-30 | 株式会社プロテリアル | セラミックハニカム構造体及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60141667A (ja) * | 1983-12-28 | 1985-07-26 | 日本碍子株式会社 | セラミックハニカム構造体を接合若しくはコーティングまたは封着するためのセラミック材料組成物 |
-
1984
- 1984-07-16 JP JP14716084A patent/JPS6126572A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60141667A (ja) * | 1983-12-28 | 1985-07-26 | 日本碍子株式会社 | セラミックハニカム構造体を接合若しくはコーティングまたは封着するためのセラミック材料組成物 |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4792537A (en) * | 1985-07-13 | 1988-12-20 | Murata Manufacturing Co., Ltd. | Dielectric ceramic composition for high frequencies |
| WO2003031371A1 (fr) * | 2001-10-02 | 2003-04-17 | Ngk Insulators, Ltd. | Corps structural en nid d'abeille et procede de fabrication |
| WO2003048072A1 (en) * | 2001-12-06 | 2003-06-12 | Ngk Insulators, Ltd. | Honeycomb structure body and method for manufacturing the same |
| US7138168B2 (en) | 2001-12-06 | 2006-11-21 | Ngk Insulators, Ltd. | Honeycomb structure body and method for manufacturing the same |
| JP2004059402A (ja) * | 2002-07-31 | 2004-02-26 | Taiheiyo Cement Corp | 低熱膨張セラミックス接合体 |
| JP2004179353A (ja) * | 2002-11-27 | 2004-06-24 | Taiheiyo Cement Corp | ステージ部材 |
| JP2011046607A (ja) * | 2003-11-12 | 2011-03-10 | Ibiden Co Ltd | セラミック構造体の製造装置、及び、セラミック構造体の製造方法 |
| WO2008096851A1 (ja) * | 2007-02-08 | 2008-08-14 | Ngk Insulators, Ltd. | 接合材組成物及びその製造方法並びに接合体及びその製造方法 |
| JP5244619B2 (ja) * | 2007-02-08 | 2013-07-24 | 日本碍子株式会社 | 接合材組成物及びその製造方法並びに接合体及びその製造方法 |
| WO2008117611A1 (ja) * | 2007-03-26 | 2008-10-02 | Ngk Insulators, Ltd. | 接合材組成物及びその製造方法並びに接合体及びその製造方法 |
| JP2010234333A (ja) * | 2009-03-31 | 2010-10-21 | Ngk Insulators Ltd | 目封止ハニカム構造体、およびそれを用いたディーゼルパティキュレートフィルタ |
| JP2010247999A (ja) * | 2009-04-10 | 2010-11-04 | Nikko Co | 低温焼成高強度低熱膨張性磁器及びその製造方法 |
| JP2015224173A (ja) * | 2014-05-29 | 2015-12-14 | 京セラ株式会社 | コージェライト接合体 |
| JP2016113335A (ja) * | 2014-12-16 | 2016-06-23 | 三井金属鉱業株式会社 | セラミックス接合体、セラミックス接合用接着剤の製造方法およびセラミックス接合体の製造方法 |
| JP2016222884A (ja) * | 2014-12-30 | 2016-12-28 | ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ | 異なるセラミック構成要素の結合 |
| US10894747B2 (en) | 2014-12-30 | 2021-01-19 | The Boeing Company | Bonding dissimilar ceramic components |
| US11780781B2 (en) | 2014-12-30 | 2023-10-10 | The Boeing Company | Bonding dissimilar ceramic components |
| US20220168901A1 (en) * | 2020-12-01 | 2022-06-02 | Premium Aerotec Gmbh | System And Method For Inserting Or Removing Cutting Inserts Of A Cutting Tool |
| WO2023048194A1 (ja) * | 2021-09-27 | 2023-03-30 | 株式会社プロテリアル | セラミックハニカム構造体及びその製造方法 |
| JP7318841B1 (ja) * | 2021-09-27 | 2023-08-01 | 株式会社プロテリアル | セラミックハニカム構造体及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH048397B2 (en, 2012) | 1992-02-14 |
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