JPS61261241A - Method for strenghening solder adhesive force to electrically conductive material provided on glass surface - Google Patents

Abstract

PURPOSE:To firmly solder a metal member to an electrically conductive material fired on a glass surface, by plating partially a metal on the electrically conductive material and soldering the metal member through the plating film of the metal to the electrically conductive material. CONSTITUTION:An electrically heating heater wire 5, for removing clouding, busbar 4, etc., are formed in one surface 1 of glass (G) by firing, and an electric plating is applied selectively to a suitable site of the busbar 4 as an electrically conductive material to form a plating film 11 of a metal. Another metal member 7 is subsequently formed on the plating film 11 by soldering. Since the plating film 11 of the metal is formed on the busbar 4 as the electrically conductive material, the spread of the solder is improved. The metal member 7, e.g. connecting terminal, can be fixed by retaining sufficient practical tensile strength.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to strengthening solder adhesion to a conductive substance provided on a glass surface, such as a bus bar in an electric heating heater for defogging provided on the rear window of an automobile. Regarding the method.

[Prior Art] Conductive materials fired on glass surfaces, such as bus bars in twin electric heating heaters for defogging installed on the rear window of automobiles or antenna conductors constituting glass antennas, cannot be connected to an external power source. Since it is necessary to transfer current between the two, it is necessary to attach other metal members such as connection terminals at appropriate locations while maintaining a practical tensile strength.

For example, if an energizing heater for defogging is to be fired on the rear glass surface of a car, it is made up of multiple heater wires and busbars arranged on the left and right sides to supply power to these heater wires. It is necessary to connect the power supply line from the battery to the bus bar, and the ground line leading to the vehicle body to the other bus bar. In this case, it is not normally done to connect the power supply line or the ground line directly to the bus bar, which is formed by firing a conductive material into a thin layer, because it is difficult in terms of connection strength. Generally, a metal connection terminal made of an appropriate shape and material is soldered and fixed onto the bus bar, and a power supply line or ground line is connected through this connection terminal. However, it has been found that in some cases, even if the connecting terminals are soldered to the bus bar, the desired tensile strength may not be obtained.

That is, in the normal case, a black ceramic film of a certain width is baked or dried and attached to the peripheral edge of one side of the molded rear glass for reasons such as improving the appearance. For this reason, when a conductive material such as the bus bar is provided on the same glass surface, it is inevitable that some of it will have to be overlapped on the black ceramic film due to space considerations. If there is at least one film layer made of a different composition between the conductive material such as a bus bar and the glass surface, the bus bar etc. It has been found that the molten solder adheres poorly to the conductive material, and other members such as connection terminals cannot be fixed with sufficient practical tensile strength.

In order to improve the solder adhesion to the conductive material such as a bus bar in such cases, it has traditionally been recommended to print the conductive material on the glass surface twice and then bake it. . At this time, the conductive material on the glass surface is fired to form a thickly printed layer with the upper layer having a larger mesh than the lower layer. It has become possible to solder materials that maintain sufficient tensile strength for practical use.

[Problems to be Solved by the Invention] However, when laminating conductive materials by printing twice in this way, the amount of conductive materials containing expensive silver etc. increases, and it is necessary to change the method. The need for multiple coatings results in poor efficiency, and there has been a strong desire for improvements in terms of both cost and workability.

On the other hand, due to the heating temperature during glass molding, if a conductive material such as a bus bar is excessively baked on the glass surface, the solder may not adhere to the conductive material. It has been found that the situation becomes worse in the same manner as in case 1 & above when the black ceramic film is present, and a method to deal with such cases has also been sought.

In view of the above-mentioned problems found in the prior art, the present invention aims to reliably, simply and quickly solder other components to a conductive material provided on a glass surface while maintaining a predetermined practical tensile strength. The purpose of the present invention is to provide a method for strengthening solder adhesion to conductive materials.

[Means for Solving the Problems] In order to achieve this object, the present invention has the following configuration.

In other words, the method of strengthening the solder adhesion to a conductive substance provided on a glass surface according to the present invention is to selectively electroplat only appropriate parts of the conductive substance fired on the glass surface, thereby increasing the solder adhesion of the metal. The structure is characterized by forming a plating film and soldering the conductive substance and another metal member through the plating film.

[Production] Therefore, a metal plating film can be easily and quickly formed by applying electroplating to an appropriate part of a conductive material. Even if there is a film layer composed of another composition, such as
Since the adhesion of solder can be significantly improved by the plating film provided on the conductive material, other components such as connection terminals can be soldered onto the conductive material while maintaining the required practical tensile strength. can.

[Example] Hereinafter, the method according to the present invention will be explained in detail with reference to the drawings.

On one side of the rear glass G of an automobile constituting the glass surface 1, a black ceramic H10 is coated to surround the periphery for reasons of appearance, etc., and an electrified heating heater 2 for defogging is used to remove fog. is provided.

Among these, the black ceramic-rich film 10 is usually produced by printing black ceramic color paint on the glass surface 1 in a predetermined width.
Although it is formed by drying and fixing, it may be formed by sintering on the glass surface 1 depending on the case.

On the other hand, the energizing heater 2 for defogging the rear glass G
It consists of a pair of buspars 4, 4 along the left and right edges of the glass surface 1, and a plurality of heater wires 5 stretched between these bussers 4, 4. .

The busper 4 and the heater wire 5 are made by mixing and kneading a highly conductive metal powder such as silver, gold, copper, platinum, or palladium, a low melting point glass frit, an organic binder, and other additive components. The conductive material 3 is formed by printing the formed conductive glass paste by a method such as screen printing, and then firing it.

Since the black ceramic film 1O and the energizing heating heater 2 for defogging are formed on the same glass surface 1 located on the indoor side of the rear glass G, the energizing heating heater 2 for defogging is formed in relation to the space. The busper 4 as the conductive material 3 constituting the
It is not uncommon for them to overlap so that part or all of them are placed on O.

In addition, a busper 4 as a conductive material 3 constituting an energizing heater 2 for defogging provided on the glass surface 1 of the rear glass G is connected to a power supply line 8 for supplying power from a battery as a power source to the vehicle body. Since it is necessary to connect a ground wire 9 for grounding, a metal connection terminal 7 as another member 6 is fixed.

The connection terminals 7 as other members 6 are fixed to the bussers 4 as the conductive substance 3 by soldering via plating films 11 provided on appropriate parts of the bussers 4.

These platings [11] are formed by applying required metal plating to the buspar 4, which is the conductive material 3, by electroplating means.

The electroplating means employed in this case is generally called brush plating, and the negative terminal 14 of the DC power supply 13 is connected to an appropriate position of the energizing heater 2 for defogging, and the j-current power supply 13 is The positive terminal 15 is connected to an electrode 16 made of any suitable material such as graphite or Ti-Pt alloy. An impregnating body 17 for impregnating the electrode with a plating solution is attached to the tip of the electrode 16.

The impregnated body 17 is made of a continuous cotton body such as absorbent cotton, gauze, felt, etc., or a continuous porous body. Specifically, absorbent cotton is wrapped around the tip of the electrode 16, and this is covered with a tube-shaped gauze. Preferably, it is formed by

The composition of the plating solution used is, for example, when copper plating is performed, a solution containing copper salts such as copper sulfate or pyrroline gradation is used as the main component, and when performing nickel plating, nickel sulfate or chloride is used. A material containing a nickel salt such as nickel, nickel acetate, or nickel sulfamate as a main component can be used.

In electroplating, a plating solution having a desired composition is appropriately selected, the impregnated body 17 is impregnated with it, and a predetermined voltage is applied between the electrode 16 and the fog removal energizing heater 2. 17 as an example, Buspar 4 as Li electric substance 3
The fixing of the connecting terminal 7 as the other member 6 is carried out by rubbing it in contact with the intended site.As a result, the impregnated body 17 plays the role of an electrolytic bath, and the metal ions in the plating solution act as a cathode. The conductive material 3 is deposited on the contact surface of the impregnated body 17 in the busper 4, and is deposited as a metal and plated. At this time, Buspar 4
By making appropriate changes to the operation method, such as holding the top surface for a predetermined time or rubbing it multiple times, the thickness of the plating film 11 can be changed, the plating efficiency can be increased, or the film can be made homogeneous or the film thickness can be changed. can be made uniform.

Further, plating may be performed using one type of metal such as nickel or copper, but it is also possible to perform plating using multiple types of metals, such as applying copper plating to the busper 4 as the conductive substance 3 and further applying nickel plating to the upper layer. It can also be done by laminating them. - In this way, the plating film 11 is provided at an appropriate location on the busper 4 as the conductive material 3 to strengthen the adhesion of the solder. Position and solder to secure. At this time, metal plating [911] is formed on the buspar 4, which is the conductive material 3, so that solder adhesion is improved, and a black ceramic film 10 is formed between the buspar 4 and the glass surface 1. Even if there is at least one film layer having a different composition such as
can be fixed.

Note that the reference numeral 12 in the figure indicates that another member 6 is placed on the plating 1111.
This is the adhered solder that fixes the connection terminal 7 as the base.

Next, the difference in effect between the prior art and the embodiment of the present invention when the connecting terminal 7, which is another member 6, is soldered to the conductive material 3 will be shown below by comparing their tensile strengths.

(1) The test sample was produced by printing black ceramic color paint on a glass plate and drying it, then printing conductive silver paint, which is a conductive substance, on the top surface and baking the knee at a predetermined temperature. did.

(2) Sample A Sample A is made by first soldering the entire conductive silver paint surface of the test sample in (1) with low melting point solder, and then attaching connection terminals as other components to this using silver-containing sparkle solder. It was obtained by soldering.

(3) Sample B For sample B, the conductive silver paint surface of the test sample in (1) is plated under the following conditions, then solder plated in the same manner as in (2), and connected to a power supply terminal. 8=
4 solder.

(a) System used: So-called brush plating method (b) Plating solution used: Ni-nickel plating solution (C) Current density: 150
~180A/dm2(d) ffl calculation volume 30
x 0.0 for a conductive silver paint surface with an area of 30 (7 layers).
02~G, 04A @H Sample C is the test sample in (1), after plating the conductive silver paint surface under the following conditions, followed by solder plating in the same manner as in (2), and connecting terminals to this. It was obtained by soldering with 6=4 solder.

(a) System used: So-called brush plating method (b) Plating solution used: Copper plating solution (flow density: 70-100 A/dm2)
d) Cumulative amount of electricity: 0.02 to 0.04 A for a conductive silver paint surface with an area of 30 x 3 G (m/II) @H Star Comparison 1 *Tensile strength is for the power supply terminal.

As is clear from the above comparison values, when the electroconductive paint surface of E3 conductive substance 3 is plated by the so-called brush plating method, the difference between the glass surface l and the electroconductive paint surface as conductive substance 3 is Even with the black ceramic film IO interposed between them, it was found that the solder adhesion to the conductive paint surface as the conductive substance 3 was significantly improved, and therefore, the connection terminal as the other member 6 was sufficient. It can be soldered while maintaining a practical tensile strength.

"Effects" As described above, according to the present invention, a film layer made of another composition such as a black ceramic film is interposed between the glass surface and a conductive material such as a busper or antenna wire, or Even if the conductive material is excessively baked onto the glass surface, making it difficult for solder to adhere to the conductive material, electroplating can be applied to one part of the surface to remove the plating film. By forming a solder, it is possible to strengthen the adhesion of the solder to the conductive material, so that other metal parts such as connection terminals can be easily hung with sufficient practical tensile strength. Can be soldered quickly,
Therefore, the workability and economic efficiency can be significantly improved.

[Brief explanation of the drawing]

FIG. 1 is a front view of a rear glass as an example to which the present invention is applied, FIG. 2 is an explanatory diagram showing an example of the plating method according to the present invention, and FIG. 3 is a sectional view showing the state of solder adhesion according to the present invention. . l...Glass surface, 2.Φ.Electric heating heater for defogging, 3..Conductive material, 4.Bus bar, 5..
Heater wire, 6...Other parts, 7...Connection terminal, 8.
...Power supply line, 9...Earth wire, 10...Black ceramic film, 11...-Plated film, 1211.Red adhesion solder, 1
3...DC power supply, 14...negative terminal, 15...
Positive terminal, 16... Electrode, 17... Impregnated body,
G...Rear glass Figure 1 Figure 2

Claims (1)

[Claims] A metal plating film is formed by selectively electroplating only appropriate parts of the conductive material fired on the glass surface, and the conductive material and other metal members are connected through this plating film. A method for strengthening solder adhesion to a conductive substance provided on a glass surface, the method comprising soldering.