JPS61256312A - Manufacture of light emission or photodetection module - Google Patents
Manufacture of light emission or photodetection moduleInfo
- Publication number
- JPS61256312A JPS61256312A JP60098093A JP9809385A JPS61256312A JP S61256312 A JPS61256312 A JP S61256312A JP 60098093 A JP60098093 A JP 60098093A JP 9809385 A JP9809385 A JP 9809385A JP S61256312 A JPS61256312 A JP S61256312A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- connector receptacle
- optical connector
- emitting element
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、光通信に使用する発光若しくは受光モジュー
ルの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a light emitting or light receiving module used for optical communication.
（従来の技術）
発光モジュール若しくは受光モジュールを製造するとき
には、発光素子１若しくは受光素子２とロッドレンズ３
との間隔ａ（第３図参照）の調整及び光軸合せ、ロッド
１ノンズ３と光ファイバ４との間隔ｂ（第３図参照）の
調整及び光軸合せが必要であるが、その精度は数μｍか
ら数十ｐｍである。もしこの精度が維持できないと、光
結合効率が低下して、発光モジュール若しくは受光モジ
ュールの性能を低下させてしまう。ところが、従来の発
光モジュール若しくは受光モジュールの製造方法では、
発光素子１若しくは受光素子２とロッドレンズ３との間
隔ａの調整及び光軸合せの精度に関して、十分満足でき
るものが得られなかった。(Prior art) When manufacturing a light emitting module or a light receiving module, a light emitting element 1 or a light receiving element 2 and a rod lens 3 are used.
It is necessary to adjust the distance a (see Figure 3) between the rod 1 and the optical fiber 4 and align the optical axis, and adjust the distance b (see Figure 3) between the rod 1 and the optical fiber 4 and align the optical axis. The range is from several μm to several tens of pm. If this accuracy cannot be maintained, the optical coupling efficiency will decrease, resulting in a decrease in the performance of the light emitting module or light receiving module. However, in the conventional manufacturing method of light emitting module or light receiving module,
Regarding the adjustment of the distance a between the light emitting element 1 or the light receiving element 2 and the rod lens 3 and the accuracy of optical axis alignment, it was not possible to obtain sufficiently satisfactory results.
以下、発光モジュール若しくは受光モジュールの従来の
製造方法について説明する。Hereinafter, a conventional method of manufacturing a light emitting module or a light receiving module will be explained.
第４図は従来の発光モジュールの製造方法を示すもので
、５は内部にロッドレンズ３を固着した中空の光コネク
タレセプタクル、６は微移動ツマミ７を操作すると、固
定台８がロッドレンズ３の光軸方向及び光軸と直角の方
向に微移動する可動治具で、この可動治具６の固定台８
には光コネクタレセプタクル５が固定される。９は発光
素子１を固定する固定治具、１０は発光素子１のリード
端子に接続する電流計、１１は光パワーメータ１２に接
続した光プラグコネクタで、この光プラグコネクタ１１
は光コネクタレセプタクル５の先端部に接続される。１
３は半田、１４は半田１３を溶融する半田ごてである。FIG. 4 shows a conventional manufacturing method of a light emitting module, in which 5 is a hollow optical connector receptacle with a rod lens 3 fixed therein, and 6 is a hollow optical connector receptacle in which a rod lens 3 is fixed. This is a movable jig that moves slightly in the direction of the optical axis and in the direction perpendicular to the optical axis.
An optical connector receptacle 5 is fixed to. 9 is a fixture for fixing the light emitting element 1; 10 is an ammeter connected to the lead terminal of the light emitting element 1; 11 is an optical plug connector connected to the optical power meter 12;
is connected to the tip of the optical connector receptacle 5. 1
3 is solder, and 14 is a soldering iron for melting the solder 13.
このように構成された従来例では、発光素子１を固定治
具９に固定した上、発光素子１のリード端子に電流計１
０を接続すると共に、光コネクタレセプタクル５の後端
部に発光素子〕−が位置するように、光コネクタレセプ
タクル５を可動治具６の固定台８に固定した上、光コネ
クタレセプタクル５の先端部に光プラグコネクタ１１を
接続する。そして、所定の電流を発光素子１に通電する
と、発光素子１から射出された光がロッドレンズ３を介
して光プラグコネクタ１１に入射するので、光プラグコ
ネクタ１１に入射する光の量を光パワーメータＩ２で確
認しながら、微移動ツマミ７を操作して、光コネクタレ
セプタクル５をロッドレンズ３の光軸方向及び光軸と直
角の方向に微移動させると、発光素子１とロッドレンズ
３との間で最大結合効率となる位置を検出することがで
きる。そこで、最大結合効率となる位置を検出したなら
ば、半田ごて１４によって発光素子１の底面のフランジ
と光コネクタレセプタクル５の後端とを半田付けすれば
、発光素子１が光コネクタレセプタクル５の後端に接合
される。In the conventional example configured in this way, the light emitting element 1 is fixed to the fixture 9, and an ammeter 1 is connected to the lead terminal of the light emitting element 1.
0, and the optical connector receptacle 5 is fixed to the fixed base 8 of the movable jig 6 so that the light emitting element]- is located at the rear end of the optical connector receptacle 5. Connect the optical plug connector 11 to the. When a predetermined current is applied to the light emitting element 1, the light emitted from the light emitting element 1 enters the optical plug connector 11 via the rod lens 3, so the amount of light entering the optical plug connector 11 is determined by the optical power. While checking with the meter I2, operate the fine movement knob 7 to slightly move the optical connector receptacle 5 in the direction of the optical axis of the rod lens 3 and in the direction perpendicular to the optical axis. It is possible to detect the position where the coupling efficiency is maximum between the two. Therefore, once the position with the maximum coupling efficiency is detected, the bottom flange of the light emitting element 1 and the rear end of the optical connector receptacle 5 are soldered using the soldering iron 14, and the light emitting element 1 is connected to the optical connector receptacle 5. It is joined at the rear end.
第５図は発光モジュールの従来の他の製造方法を示すも
ので、第４図の符号と同一符号のものは同一部分を示し
ており、又、１５は接着剤１６を注入する注入器である
。FIG. 5 shows another conventional manufacturing method of a light emitting module, in which the same reference numerals as those in FIG. 4 indicate the same parts, and 15 is a syringe for injecting adhesive 16. .
このように構成された従来例では、前述の第１の従来例
と同様に、最大結合効率となる位置を検出したならば、
発光素子１を挿入した光コネクタレセプタクル５の後端
部に注入器１５によって接着剤を注入して乾燥させれば
、発光素子１が光コネクタレセプタクル５の後端に接合
される。In the conventional example configured in this way, as in the first conventional example described above, once the position at which the maximum coupling efficiency is obtained is detected,
The light emitting element 1 is bonded to the rear end of the optical connector receptacle 5 by injecting adhesive with a syringe 15 into the rear end of the optical connector receptacle 5 into which the light emitting element 1 has been inserted and drying it.
（発明が解決しようとする問題点）
しかしながら、第１の従来例においては、発光素子１と
光コネクタレセプタクル５とを半田付けするときに、半
田ごて１４を発光素子１及び光コネクタレセプタクル５
に接触させながら移動させるので、発光素子１及び光コ
ネクタレセプタクル５に衝撃が加わったり、振動が生じ
る。このため、衝撃や振動が加わって、発光素子１−と
光コネクタレセプタクル５との間の位置関係がずれてい
る状態で、両者が接合されるので、光結合効率が低下す
る問題があった。(Problems to be Solved by the Invention) However, in the first conventional example, when soldering the light emitting element 1 and the optical connector receptacle 5, the soldering iron 14 is connected to the light emitting element 1 and the optical connector receptacle 5.
Since the light emitting element 1 and the optical connector receptacle 5 are moved while being in contact with the light emitting element 1 and the optical connector receptacle 5, shocks and vibrations are generated. For this reason, the light emitting element 1- and the optical connector receptacle 5 are bonded together in a state where the positional relationship between them is shifted due to the application of shocks and vibrations, resulting in a problem of reduced optical coupling efficiency.
又、第２の従来例においては、硬化による接着剤１６の
経時変化、長期にわたる温度及び湿度の変化による接着
剤１６の強度の劣化、接着剤１６の膨張、収縮等による
位置ずれが生じるので、光結合効率が低下する問題があ
った。その上、発光素子１の発光面まで浸透した接着剤
１６、或いは、接着剤１６の硬化時に発生したガスによ
って発光素子１の発光面曇らせて、光結合効率を低下さ
せる問題があった・
本発明は、このような問題に鑑みてなされたもので、発
光素子若しくは受光素子や光コネクタレセプタクルに加
熱手段を接触することなく半田を溶融できる発光若しく
は受光モジュールの製造方法を提供することを目的とし
ている。In addition, in the second conventional example, the adhesive 16 changes over time due to curing, the strength of the adhesive 16 deteriorates due to long-term changes in temperature and humidity, and positional displacement occurs due to expansion, contraction, etc. of the adhesive 16. There was a problem that the optical coupling efficiency decreased. Moreover, the adhesive 16 that has penetrated to the light emitting surface of the light emitting element 1 or the gas generated when the adhesive 16 is cured may cloud the light emitting surface of the light emitting element 1, reducing optical coupling efficiency. was developed in view of these problems, and aims to provide a method for manufacturing a light-emitting or light-receiving module that can melt solder without bringing a heating means into contact with the light-emitting element, light-receiving element, or optical connector receptacle. .
（問題点を解決するための手段）
光コネクタレセプタクルの発光素子若しくは受光素子と
の接合部の外周壁面上に形成した凹部にリング半田を嵌
装するか或いはクリーム半田を充填した上、その半田を
近赤外線加熱装置によって加熱、溶融することにより、
発光素子若しくは受光素子を光コネクタレセプタクルに
接合するものである。(Means for solving the problem) A ring solder is fitted into the recess formed on the outer peripheral wall surface of the joint part with the light emitting element or the light receiving element of the optical connector receptacle, or cream solder is filled, and then the solder is filled. By heating and melting with a near-infrared heating device,
A light emitting element or a light receiving element is connected to an optical connector receptacle.
（作用）
光コネクタレセプタクルの凹部に嵌装したリング半田或
いは充填したクリーム半田を近赤外線加熱装置によって
加熱、溶融することにより、受光素子若しくは発光素子
と光コネクタレセプタクル“とが静止した状態で、一定
量の半田を所定の位置に、均一に半田付けできるので、
受光素子若しくは発光素子と光コネクタレセプタクルと
の間にずれが生じない。(Function) By heating and melting the ring solder or filled cream solder fitted into the recess of the optical connector receptacle using a near-infrared heating device, the light-receiving element or light-emitting element and the optical connector receptacle are kept stationary and constant. Since it is possible to solder a large amount of solder evenly in the specified position,
No misalignment occurs between the light receiving element or the light emitting element and the optical connector receptacle.
（実施例）
第１図及び第２図は本発明の一実施例の構成を示すもの
で、第４図の符号と同一符号のものは同一部分を示して
おり、又、１７は発光素子１の底部外周を覆うようにし
て発光素子１の底面のフランジに固定した接合リング（
第２図参照）、１８は接合リング１７に接合する光コネ
クタレセプタクル５の後端縁部に円周方向に凹設した凹
部（第２図参照）で、この凹部１８は接合リング１７の
先端内部に嵌挿できる。１９は光コネクタレセプタクル
５の凹部１８に装填したリング半田、２０は３方向微移
動ツマミ２１をそれぞれ操作すると、固定台２２がロッ
ドレンズ３（第２図参照）の光軸方向及び光軸と直角の
方向に微移動する可動治具で、光コネクタレセプタクル
５を固定する固定台２２は予め加熱されている。(Embodiment) FIGS. 1 and 2 show the structure of an embodiment of the present invention. The same reference numerals as those in FIG. 4 indicate the same parts, and 17 is a light emitting element 1 A bonding ring (
(See Figure 2), 18 is a recess (see Figure 2) that is recessed in the circumferential direction at the rear end edge of the optical connector receptacle 5 that is joined to the joining ring 17; Can be inserted into. 19 is a ring of solder loaded into the recess 18 of the optical connector receptacle 5, and 20 is a ring of solder loaded into the recess 18 of the optical connector receptacle 5. When the three-direction fine movement knob 21 is operated, the fixing base 22 is moved in the direction of the optical axis of the rod lens 3 (see FIG. 2) and perpendicular to the optical axis. The fixing base 22 that fixes the optical connector receptacle 5 is a movable jig that moves slightly in the direction of the fixing table 22, which is heated in advance.
２３は発光素子１を固定する固定台で、この固定台２３
は予め加熱されている。２４は近赤外線をリング半田１
９に向けて照射してリング半田１９を加熱、溶融する近
赤外線加熱装置、２５は発光素子１と光コネクタレセプ
タクル５との半田付は部にのみ近赤外線が照射され、そ
の他の発光素子１と光コネクタレセプタクル５との半田
付は部以外の部分や治工具等に近赤外線が照射されない
ように近赤外線加熱装置２４との間に設置した光反射板
である。23 is a fixing base for fixing the light emitting element 1; this fixing base 23
is preheated. 24 is near-infrared ring solder 1
A near-infrared heating device 25 heats and melts the ring solder 19 by irradiating it toward the light-emitting element 1 and the optical connector receptacle 5. For soldering with the optical connector receptacle 5, a light reflecting plate is installed between the optical connector receptacle 5 and the near-infrared heating device 24 so that near-infrared rays are not irradiated to other parts, tools, etc.
このように構成された本実施例では、接合リング１７を
固定した発光素子１を固定台２３に固定した上、発光素
子１のリード端子に電流計１０を接続すると共に、光コ
ネクタレセプタクル５を可動治具２０の固定台２２に固
定した上、光コネクタレセプタクル５の先端部に光プラ
グコネクタ１１を接続する。In this embodiment configured as described above, the light emitting element 1 with the bonding ring 17 fixed thereon is fixed on the fixed base 23, the ammeter 10 is connected to the lead terminal of the light emitting element 1, and the optical connector receptacle 5 is movable. After fixing the jig 20 to the fixing base 22, the optical plug connector 11 is connected to the tip of the optical connector receptacle 5.
次に、３方向微移動ツマミ２１をそれぞれ操作して、光
コネクタレセプタクル５の後端部に発光素子１を挿入し
た上、所定の電流を発光素子１に通電すると、発光素子
１から射出された光がロッドレンズ３を介して光プラグ
コネクタ１１に入射するので、光プラグコネクタ１１に
入射する光の量を光パワーメータ１２で確認しながら、
微移動ツマミ２１をそれぞれ操作して、光コネクタレセ
プタクル５をロッドレンズ３の光軸方向及び光軸と直角
の方向に微移動させると、発光素子１とロッドレンズ３
との間で最大結合効率となる位置を検出することができ
る。そして、最大結合効率となる位置を検出したならば
、光コネクタレセプタクル５の凹部１８に嵌挿されたリ
ング半田１９に近赤外線を照射して、リング半田１９を
加熱、溶融すると、光コネクタレセプタクル５とこの光
コネクタレセプタクル５の後端に近接した接合リング１
７とが半田付けされて、発光素子１が光コネクタレセプ
タクル５の後端に接合される。Next, the light emitting element 1 is inserted into the rear end of the optical connector receptacle 5 by operating the three direction fine movement knobs 21, and when a predetermined current is applied to the light emitting element 1, light is emitted from the light emitting element 1. Since light enters the optical plug connector 11 via the rod lens 3, while checking the amount of light entering the optical plug connector 11 with the optical power meter 12,
When the optical connector receptacle 5 is slightly moved in the direction of the optical axis of the rod lens 3 and in the direction perpendicular to the optical axis by operating the fine movement knobs 21, the light emitting element 1 and the rod lens 3 are moved.
It is possible to detect the position where the coupling efficiency is maximum between the two. After detecting the position where the maximum coupling efficiency is achieved, the ring solder 19 fitted into the recess 18 of the optical connector receptacle 5 is irradiated with near infrared rays to heat and melt the ring solder 19, and the optical connector receptacle 5 is heated and melted. and the joining ring 1 close to the rear end of the optical connector receptacle 5.
7 is soldered to join the light emitting element 1 to the rear end of the optical connector receptacle 5.
尚、本発明の実施例では、発光素子１を光コネクタレセ
プタクル５に接合する例で説明したが、受光素子２も同
様の方法で光コネクタレセプタクル５に接合することが
できる。In the embodiment of the present invention, an example has been described in which the light emitting element 1 is joined to the optical connector receptacle 5, but the light receiving element 2 can also be joined to the optical connector receptacle 5 in the same manner.
又、本発明の実施例では、凹部１８に装填したリング半
田１９を近赤外線で加熱、溶融して、発光素子１を光コ
ネクタレセプタクル５に接合する例で−１０＝
説明したが、凹部１８に装填したクリーム半田（図示し
ない）を近赤外線で加熱、溶融して、発光素子１を光コ
ネクタレセプタクル５に接合してもよい。Furthermore, in the embodiment of the present invention, the ring solder 19 loaded in the recess 18 is heated and melted with near infrared rays to join the light emitting element 1 to the optical connector receptacle 5. The light emitting element 1 may be joined to the optical connector receptacle 5 by heating and melting the loaded cream solder (not shown) with near infrared rays.
更に、光コネクタレセプタクル５において、半田付は不
要部分を光反射性材料で形成すれば、光コネクタレセプ
タクル５の温度上昇を極力抑制することができる。Furthermore, if the parts of the optical connector receptacle 5 that do not require soldering are made of a light reflective material, the temperature rise of the optical connector receptacle 5 can be suppressed as much as possible.
（発明の効果）
以上説明したように、本発明によれば、近赤外線を照射
して、光コネクタレセプタクルの凹部に装填したリング
半田或いはクリーム半田を加熱、溶融して、発光素子若
しくは受光素子や光コネクタレセプタクルに衝撃や振動
を加えることなく、発光素子若しくは受光素子と光コネ
クタレセプタクルとを半田付けできるので、発光素子若
しくは受光素子と光コネクタレセプタクルとの半田付は
時における位置ずれがなくなって、光結合効率が高く保
持できる効果がある。(Effects of the Invention) As explained above, according to the present invention, near-infrared rays are irradiated to heat and melt the ring solder or cream solder loaded in the recess of the optical connector receptacle, thereby forming a light-emitting element or a light-receiving element. Since the light emitting element or light receiving element and the optical connector receptacle can be soldered without applying shock or vibration to the optical connector receptacle, there is no misalignment during soldering between the light emitting element or light receiving element and the optical connector receptacle. This has the effect of maintaining high optical coupling efficiency.
又、半田の溶融状態は近赤外線の照射時間と出力により
容易に管理できるため、半田伺Ｉづが均一になって、高
品質の接合状態が得られる効果がある。In addition, since the melting state of the solder can be easily controlled by the near-infrared irradiation time and output, the solder spread becomes uniform and a high-quality bonded state can be obtained.
更に、発光素子若しくは受光素子と光コネクタレセプタ
クルとの半田付は部や発光素子若しくは受光素子の固定
台、光コネクタレセプタクルの固定台等の治工具類は予
め加熱されているので、半田の溶融が促進されて、発光
素子若しくは受光素子の熱による破壊を防止できるよう
になると共に、近赤外線照射による急激な加熱が防止さ
れて、治工具類の歪みが少なくなり、光結合効率が高く
保持できる効果がある。Furthermore, when soldering the light-emitting element or light-receiving element to the optical connector receptacle, the jigs and tools, such as the fixing base of the light-emitting element or light-receiving element and the fixing base of the optical connector receptacle, are heated in advance, so that the solder does not melt. In addition to preventing the light-emitting element or light-receiving element from being destroyed by heat, rapid heating due to near-infrared irradiation is prevented, distortion of jigs and tools is reduced, and optical coupling efficiency can be maintained at a high level. There is.
更に、発光素子若しくは受光素子と光コネクタレセプタ
クルとの半田付は部具外の部分や治工具等は光反射材で
覆われているので、近赤外線の照射による治工具類の歪
みや熱損傷が防止できて、光結合効率が高く保持できる
効果がある。Furthermore, when soldering a light-emitting element or light-receiving element and an optical connector receptacle, the outside parts and jigs and tools are covered with a light-reflecting material, so there is no possibility of distortion or thermal damage to the jigs and tools caused by near-infrared irradiation. This has the effect of being able to prevent this and maintain high optical coupling efficiency.
更に、発光素子若しくは受光素子と光コネクタレセプタ
クルとを半田付けしても、半田は経時変化がほとんどな
いので、経時変化による位置ずれが起き難く、又、硬化
時にガス等を発生しないので、発光素子の発光面若しく
は受光素子の受光面を曇らせることはなく、光結合効率
を高く保持できる効果がある。Furthermore, even if the light emitting element or light receiving element and the optical connector receptacle are soldered together, the solder hardly changes over time, so it is difficult for the solder to become misaligned due to change over time.Also, since no gas is generated during curing, the light emitting element The light emitting surface of the light emitting element or the light receiving surface of the light receiving element is not clouded, and the optical coupling efficiency can be maintained at a high level.
第１図は本発明の製造方法による発光若しくは受光モジ
ュールの製造装置の構成図、第２図は第１図の要部拡大
図、第３図は発光若しくは受光モジュールの原理図、第
４図は従来の製造方法による発光若しくは受光モジュー
ルの製造装置の構成図、第５図は従来の他の製造方法に
よる発光若しくは受光モジュールの製造装置の構成図で
ある。
１ ・ 発光素子、 ２・・・受光素子、 ３ ・・・
ロッドレンズ、 ５ ・・・光コネクタレセプタクル、
１７・・・接合リング、１８・・・凹部、１９・・・リ
ング半田、２０・・・治具（可動治具）、２３・・・治
具（固定治具）、２４・・・近赤外線加熱装置、２５
・・光反射板。
−１３＝FIG. 1 is a block diagram of a manufacturing apparatus for a light emitting or light receiving module according to the manufacturing method of the present invention, FIG. 2 is an enlarged view of the main parts of FIG. 1, FIG. 3 is a diagram of the principle of the light emitting or light receiving module, and FIG. FIG. 5 is a block diagram of a light emitting or light receiving module manufacturing apparatus using a conventional manufacturing method. FIG. 5 is a block diagram of a light emitting or light receiving module manufacturing apparatus using another conventional manufacturing method. 1. Light emitting element, 2... Light receiving element, 3...
Rod lens, 5... Optical connector receptacle,
17... Joining ring, 18... Concavity, 19... Ring solder, 20... Jig (movable jig), 23... Jig (fixed jig), 24... Near infrared rays heating device, 25
...Light reflecting plate. −13=
Claims (5)
タクルに発光素子若しくは受光素子を挿入且つ接合して
なる発光若しくは受光モジュールの製造方法において、
前記発光素子若しくは受光素子を前記光コネクタレセプ
タクルの端部に挿入した上、前記発光素子若しくは受光
素子と前記光コネクタレセプタクルとの接合部に円周方
向に形成した凹部に装填された半田を近赤外線加熱装置
で加熱、溶融して、前記受光素子若しくは発光素子と前
記光コネクタレセプタクルとを接合することを特徴とす
る発光若しくは受光モジュールの製造方法。(1) A method for manufacturing a light emitting or light receiving module in which a light emitting element or a light receiving element is inserted and bonded into a hollow optical connector receptacle to which a rod lens is fixed,
The light emitting element or the light receiving element is inserted into the end of the optical connector receptacle, and the solder loaded in the recess formed in the circumferential direction at the joint between the light emitting element or the light receiving element and the optical connector receptacle is exposed to near infrared rays. A method of manufacturing a light emitting or light receiving module, characterized in that the light receiving element or the light emitting element and the optical connector receptacle are joined by heating and melting with a heating device.
部に固着する接合リングを介して前記光コネクタレセプ
タクルに接合されることを特徴とする特許請求の範囲第
（１）項記載の発光若しくは受光モジュールの製造方法
。(2) The light emitting or light receiving element according to claim 1, wherein the light emitting element or the light receiving element is joined to the optical connector receptacle via a joining ring fixed to the outer peripheral edge of the light emitting element or the light receiving element. A method of manufacturing a light receiving module.
分が光反射性材料で形成されていることを特徴とする特
許請求の範囲第（１）項記載の発光若しくは受光モジュ
ールの製造方法。(3) The method of manufacturing a light emitting or light receiving module according to claim (1), wherein the optical connector receptacle includes a portion that does not require soldering and is formed of a light reflective material.
は、前記光コネクタレセプタクルを支持する治具及び前
記発光素子若しくは受光素子を支持する治具と共に、光
反射性部材で覆われることを特徴とする特許請求の範囲
第（１）項記載の発光若しくは受光モジュールの製造方
法。(4) A patent characterized in that the portion of the optical connector receptacle that does not require soldering is covered with a light reflective member, together with a jig that supports the optical connector receptacle and a jig that supports the light emitting element or light receiving element. A method for manufacturing a light emitting or light receiving module according to claim (1).
光コネクタレセプタクルを支持する治具及び前記発光素
子若しくは受光素子を支持する治具は、予め加熱される
ことを特徴とする特許請求の範囲第（１）項記載の発光
若しくは受光モジュールの製造方法。(5) The soldering portion of the optical connector receptacle, the jig that supports the optical connector receptacle, and the jig that supports the light emitting element or the light receiving element are heated in advance. 1) A method for manufacturing a light emitting or light receiving module according to item 1).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60098093A JPS61256312A (en) | 1985-05-10 | 1985-05-10 | Manufacture of light emission or photodetection module |
| DE8686304958T DE3683693D1 (en) | 1985-05-10 | 1986-06-26 | TURNTABLE WITH AUTOMATIC CHARGING. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60098093A JPS61256312A (en) | 1985-05-10 | 1985-05-10 | Manufacture of light emission or photodetection module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61256312A true JPS61256312A (en) | 1986-11-13 |
Family
ID=14210725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60098093A Pending JPS61256312A (en) | 1985-05-10 | 1985-05-10 | Manufacture of light emission or photodetection module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS61256312A (en) |
| DE (1) | DE3683693D1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0473705A (en) * | 1990-07-16 | 1992-03-09 | Mitsubishi Electric Corp | Manufacture of semiconductor element module |
-
1985
- 1985-05-10 JP JP60098093A patent/JPS61256312A/en active Pending
-
1986
- 1986-06-26 DE DE8686304958T patent/DE3683693D1/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0473705A (en) * | 1990-07-16 | 1992-03-09 | Mitsubishi Electric Corp | Manufacture of semiconductor element module |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3683693D1 (en) | 1992-03-12 |
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