JPS62211965A - Photosemiconductor device - Google Patents
Photosemiconductor deviceInfo
- Publication number
- JPS62211965A JPS62211965A JP61053743A JP5374386A JPS62211965A JP S62211965 A JPS62211965 A JP S62211965A JP 61053743 A JP61053743 A JP 61053743A JP 5374386 A JP5374386 A JP 5374386A JP S62211965 A JPS62211965 A JP S62211965A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- optical semiconductor
- semiconductor element
- optical
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 52
- 239000004065 semiconductor Substances 0.000 claims abstract description 49
- 239000013307 optical fiber Substances 0.000 claims abstract description 45
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、光半導体素子と光ファイバとを光結合させ
た光半導体装置に関する。Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to an optical semiconductor device in which an optical semiconductor element and an optical fiber are optically coupled.
（従来の技術）
半導体レーザ、発光ダイオード、フｔトダイオード等の
光半導体素子と光ファイバとを光結合させた光半導体装
置は、光フアイバ通信等に利用されている。一般に、こ
のような光半導体装置では、光ファイバと光半導体素子
との光軸を合せて、光半導体素子を固定した基台に光フ
ァイバを、直接あるいは光ファイバを保持したホルダ等
を介してを固定している。例えば特開昭６０−５９３０
９号公報に記載されたものでは、容器内部で光半導体素
子をマウントしたヒートシンクの近傍に光フアイバ支持
台を設け、光フアイバ先端部を、硬化収縮の少ない接着
剤や半田によって固定している。特に、光ファイバの先
端部を光半導体素子の近傍で支持台に固定しているので
、光半導体素子と光ファイバとの固定精度を極めて高く
することができ、また振動に対して光軸ずれを起さない
という利点を有する。(Prior Art) Optical semiconductor devices in which optical semiconductor elements such as semiconductor lasers, light emitting diodes, and foot diodes are optically coupled to optical fibers are used in optical fiber communications and the like. Generally, in such an optical semiconductor device, the optical axes of the optical fiber and the optical semiconductor element are aligned, and the optical fiber is connected to a base on which the optical semiconductor element is fixed, either directly or through a holder holding the optical fiber. Fixed. For example, JP-A-60-5930
In the method described in Publication No. 9, an optical fiber support is provided inside a container near a heat sink on which an optical semiconductor element is mounted, and the tip of the optical fiber is fixed with an adhesive or solder that has little curing shrinkage. In particular, since the tip of the optical fiber is fixed to the support near the optical semiconductor element, the fixing precision between the optical semiconductor element and the optical fiber can be extremely high, and optical axis deviation due to vibration can be prevented. It has the advantage of not causing
（発明が解決しようとする問題点）
しかし、接着剤で光ファイバを固定した場合には、時間
とともにガスやクランクが発生し、長期にわたる信頼性
を維持できない。また、半田で固定する場合には、半田
付けの際の熱が、支持台を伝わって逃げてしまうため、
半田の溶融状態を維持するためには必要以上の熱エネル
ギーを長時間加えなければならず、作業性が悪い。更に
は、この熱が光フアイバ支持台、容器、ヒートシンクを
介して光半導体素子に伝わり、この光半導体素子の動作
特性が変化し、モニタリングによる光ファイバとの光軸
合せが困難になる上光半導体素子の劣化を招く危険性が
ある。(Problems to be Solved by the Invention) However, when optical fibers are fixed with adhesive, gas and cranks are generated over time, making it impossible to maintain long-term reliability. Also, when fixing with solder, the heat during soldering is transmitted through the support base and escapes.
In order to maintain the molten state of the solder, more heat energy than necessary must be applied for a long time, resulting in poor workability. Furthermore, this heat is transmitted to the optical semiconductor element via the optical fiber support, the container, and the heat sink, changing the operating characteristics of the optical semiconductor element and making it difficult to align the optical axis with the optical fiber during monitoring. There is a risk of deterioration of the element.
この発明は、光ファイバを固定する際の作業性が良く、
また熱の影響による光半導体素子の特性劣化がなく、信
頼性の高い光半導体装置を提供するものである。This invention has good workability when fixing optical fibers,
Further, the present invention provides a highly reliable optical semiconductor device in which the characteristics of the optical semiconductor element do not deteriorate due to the influence of heat.
［発明の構成］
（問題点を解決するための手段〉
この発明は、光半導体素子を固定した基台に、光半導体
素子と光結合をする光ファイバを熱遮断部材を介して固
定したことを特徴とする光半導体装置である。[Structure of the Invention] (Means for Solving the Problems) This invention provides a method in which an optical fiber optically coupled to the optical semiconductor element is fixed to a base on which the optical semiconductor element is fixed via a heat shielding member. This is a characteristic optical semiconductor device.
（作用）
光半導体素子を固定した基台に光ファイバを固定する当
り、熱伝導率が低い材料からなる熱遮断部材を介在させ
ることにより、光ファイバを基台に固定する際の熱が他
に逃げることがなく、固定作業が容易に行なえ、また、
光半導体素子の加熱による特性劣化を防ぐことができる
。(Function) When fixing the optical fiber to the base on which the optical semiconductor element is fixed, by interposing a heat shielding member made of a material with low thermal conductivity, the heat generated when fixing the optical fiber to the base is transferred to other sources. It does not escape, making fixing work easy, and
Deterioration of characteristics due to heating of the optical semiconductor element can be prevented.
（発明の実施例）
第１図および第２図は、この発明の一実施例の平面図と
断面図である。(Embodiment of the Invention) FIGS. 1 and 2 are a plan view and a sectional view of an embodiment of the invention.
光半導体素子１、例えば半導体レーザ素子はサブマウン
ト２に固定され、サブマウント２は容器４に固定された
ヒートシンク３に半田固定されている。光半導体素子１
は、容器４と電気的に絶縁されたリード５へ金ワイヤ６
を介して電気的に接続されている。なお、サブマウント
２はダイヤモンド、またヒートシンク３及び容器４はそ
れぞれ銅からなる。An optical semiconductor element 1, such as a semiconductor laser element, is fixed to a submount 2, and the submount 2 is fixed to a heat sink 3 fixed to a container 4 by soldering. Optical semiconductor device 1
The gold wire 6 is connected to the lead 5 which is electrically insulated from the container 4.
electrically connected via. Note that the submount 2 is made of diamond, and the heat sink 3 and container 4 are each made of copper.
一方、光ファイバ７、例えばコア径が１０μｍ程度の単
一モードファイバからなる光ファイバ７の先端部はレン
ズ状に加工され、また側面は半田が付けられるようにメ
タライズされている。光ファイバ７は、容器４のファイ
バ挿入口８を通して挿入され、光半導体素子１を発光さ
せながら、光半導体素子１の出射光と光ファイバ７と光
軸合せを行ない最適の位置で結合するように調整されて
、容器４に予め固定された光フアイバ支持台９上に半田
１０で固定される。この後、光ファイバ７は半田１１に
よりファイバ挿入口８で容器に固定される。On the other hand, the tip of the optical fiber 7, for example, a single mode fiber with a core diameter of about 10 μm, is processed into a lens shape, and the side surface is metalized so that it can be soldered. The optical fiber 7 is inserted through the fiber insertion port 8 of the container 4, and while causing the optical semiconductor element 1 to emit light, the optical axis of the emitted light from the optical semiconductor element 1 and the optical fiber 7 are aligned so that they are coupled at an optimal position. It is adjusted and fixed with solder 10 onto the optical fiber support stand 9 which has been fixed to the container 4 in advance. Thereafter, the optical fiber 7 is fixed to the container at the fiber insertion port 8 with solder 11.
そして、容器４の上部には蓋１２が配置され、シーム溶
接により固定される。A lid 12 is placed on the top of the container 4 and fixed by seam welding.
さて、支持台９は、ヒートシンク３と実質的に同じ熱膨
張率を有する材質、例えばヒートシンク３と材料からな
る支持台本体部１４と、支持台本体部１４よりも熱伝導
率の低い材料からなる熱遮断部１３とから構成される。Now, the support stand 9 is made of a material having substantially the same coefficient of thermal expansion as the heat sink 3, for example, a support stand body part 14 made of the heat sink 3 and a material, and a material having a lower thermal conductivity than the support stand body part 14. It is composed of a heat cutoff section 13.
熱遮断部１３は、例えばセラミックで形成され、支持台
本体部１４および光ファイバ７が固定される面にはそれ
ぞれメタライズが施され、半田付けがし易くしてあり、
また光ファイバが半田付けされる前に予め支持台本体部
１４に固定されている。The heat shielding part 13 is made of ceramic, for example, and the surfaces to which the support body 14 and the optical fiber 7 are fixed are each metallized to facilitate soldering.
Further, the optical fiber is fixed to the support body 14 in advance before being soldered.
上述の構成によれば、熱遮断部１３は、熱抵抗が高く、
光ファイバを半田付けする際の熱エネルギーが支持台本
体部１４及び容器４側に伝わるのを防止する。従って、
光ファイバを支持台９に半田付けする際、必要な熱エネ
ルギーは必要最小限で済み作業性が良く、また光半導体
素子１の加熱を防ぎ特性劣化を防止できる。特に、光半
導体素子１が発光素子である場合には、光半導体素子を
動作させながら素子を加熱した場合には、一般に素子の
特性劣化が著しく、この発明による劣化防止の効果は顕
著である。なお、光フアイバ挿入口８に光ファイバ７を
半田付は固定する場合には、半田付けを行なう場所が光
半導体素子１と充分能れており、熱は途中で放熱され、
光半導体素子１の劣化につながる温度上昇を招く恐れは
少ない。According to the above-described configuration, the heat cutoff section 13 has high thermal resistance;
Thermal energy when soldering the optical fiber is prevented from being transmitted to the support body 14 and the container 4 side. Therefore,
When soldering the optical fiber to the support base 9, the necessary thermal energy is kept to a minimum, resulting in good workability, and heating of the optical semiconductor element 1 can be prevented to prevent characteristic deterioration. In particular, when the optical semiconductor element 1 is a light emitting element, when the optical semiconductor element is heated while operating, the characteristics of the element generally deteriorate significantly, and the deterioration prevention effect of the present invention is remarkable. In addition, when fixing the optical fiber 7 to the optical fiber insertion port 8 by soldering, the place where the soldering is performed is sufficiently close to the optical semiconductor element 1, and the heat is dissipated along the way.
There is little risk of a temperature rise leading to deterioration of the optical semiconductor element 1.
また、この実施例によれば、光ファイバ７を支持する支
持台９に、ヒートシンク３と実質的に同じ熱膨張率を有
する材料を利用しているので、温度変化などの外部環境
の変化に対しても光軸ずれを起すことがない。Furthermore, according to this embodiment, since the support base 9 that supports the optical fiber 7 is made of a material that has substantially the same coefficient of thermal expansion as the heat sink 3, it can withstand changes in the external environment such as temperature changes. The optical axis will not shift even if the
上述の実施例は、光ファイバの先端部を支持台に固定す
ることにより、高精度な位置合せを実現したものである
が、光ファイバがマルチモードファイバであり位置合せ
精度をそれ程要求されないものにも本発明は適用できる
。第３図は本発明の他の実施例を示す。光半導体素子２
０は、サブマウント２２にマウントされ、更に熱伝導性
の良いヒートシンク２４へ固定されている。ヒートシン
ク２４には、光半導体素子２０へ通電するためのり一ド
２６が設けられている。マルチモードの光ファイバ２８
はキャップ状の光フアイバホルダ３０に予め半田３２に
より固定され、光半導体素子２０の出射光と光ファイバ
２８の結合効率が最大となる位置で光フアイバホルダ３
０を熱遮断部材３２を介在させてヒートシンク２４に半
田３４により半田付けして固定されている。この場合、
熱遮断部材３２は予めヒートシンク２４に接合しておく
。この実施例においても、光フアイバホルダ３０をヒー
トシンク２４に接合する際の半田付けの熱が光半導体素
子２０に伝達しにくく、作業性か良く、また光半導体素
子２０の劣化を防止できる。In the above-mentioned embodiment, highly accurate alignment was achieved by fixing the tip of the optical fiber to a support, but the optical fiber is a multimode fiber and alignment accuracy is not required as much. The present invention is also applicable. FIG. 3 shows another embodiment of the invention. Optical semiconductor element 2
0 is mounted on a submount 22 and further fixed to a heat sink 24 with good thermal conductivity. The heat sink 24 is provided with a glue 26 for supplying electricity to the optical semiconductor element 20. Multimode optical fiber 28
is fixed in advance to a cap-shaped optical fiber holder 30 with solder 32, and the optical fiber holder 3 is fixed at a position where the coupling efficiency between the output light of the optical semiconductor element 20 and the optical fiber 28 is maximized.
0 is soldered and fixed to the heat sink 24 with a heat shielding member 32 interposed therebetween. in this case,
The heat shielding member 32 is bonded to the heat sink 24 in advance. Also in this embodiment, the heat of soldering when joining the optical fiber holder 30 to the heat sink 24 is difficult to be transferred to the optical semiconductor element 20, which improves workability and prevents deterioration of the optical semiconductor element 20.
また、上述の実施例では、光半導体素子として発光素子
の場合を示したが、本発明は受光素子の場合にも適用で
きる。更には、熱遮断部材は、上述したセラミックに限
らず、光フアイバ支持台本体部あるいはヒートシンクよ
りも熱伝導率が低い材料が使用できる。Further, in the above embodiments, a light emitting element is used as the optical semiconductor element, but the present invention can also be applied to a light receiving element. Furthermore, the heat shielding member is not limited to the above-mentioned ceramic, but can also be made of a material having a lower thermal conductivity than the optical fiber support main body or the heat sink.
［発明の効果］
この発明によれば、光ファイバを光半導体素子に対して
所定の位置に固定するに当り、熱伝導率の低い熱遮断部
材を介在させているので、光ファイバを半田付は固定す
る際の熱が光半導体素子に伝達せず、光半導体素子の特
性劣化を招くことがない。従って、信頼性の高い光半導
体装置が実現できる。また光半導体装置の組み立て作業
性を向上させることができる。[Effects of the Invention] According to the present invention, when fixing the optical fiber at a predetermined position with respect to the optical semiconductor element, a heat shielding member with low thermal conductivity is interposed, so that it is not necessary to solder the optical fiber. Heat during fixing is not transmitted to the optical semiconductor element, and the characteristics of the optical semiconductor element are not deteriorated. Therefore, a highly reliable optical semiconductor device can be realized. Further, the workability of assembling the optical semiconductor device can be improved.
第１図は本発明の一実施例の光半導体装置の断面図、第
２図は本発明の一実施例の平面図、第３図は本発明の他
の実施例の断面図である。
１．２０・・・光半導体素子
２，２２・・・サブマウント
３．２４・・・ヒートシンク
４・・・容器
７．２８・・・光ファイバ
９・・・ファイバ支持台
１０．１１．３２．３４・・・半田
１３．３２・・・熱遮断部材
代理人弁理士 則 近 憲 １も
同 大胡典夫
第２図FIG. 1 is a sectional view of an optical semiconductor device according to an embodiment of the invention, FIG. 2 is a plan view of an embodiment of the invention, and FIG. 3 is a sectional view of another embodiment of the invention. 1.20... Optical semiconductor elements 2, 22... Submount 3.24... Heat sink 4... Container 7.28... Optical fiber 9... Fiber support stand 10.11.32. 34... Handa 13. 32... Patent attorney Nori Chika, representing heat shielding materials 1 is also the same Norio Ogo Figure 2
Claims (2)
子と光結合をする光ファイバを、熱遮断部材を介して固
定したことを特徴とする光半導体装置。(1) An optical semiconductor device characterized in that an optical fiber optically coupled to the optical semiconductor element is fixed to a base on which the optical semiconductor element is fixed via a heat shielding member.
とする特許請求の範囲第１項記載の光半導体装置。(2) The optical semiconductor device according to claim 1, wherein the heat shielding member is made of ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61053743A JPS62211965A (en) | 1986-03-13 | 1986-03-13 | Photosemiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61053743A JPS62211965A (en) | 1986-03-13 | 1986-03-13 | Photosemiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62211965A true JPS62211965A (en) | 1987-09-17 |
Family
ID=12951295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61053743A Pending JPS62211965A (en) | 1986-03-13 | 1986-03-13 | Photosemiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62211965A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1328047A2 (en) | 2001-12-10 | 2003-07-16 | JDS Uniphase Corporation | Optical component attachment to optoelectronic packages |
-
1986
- 1986-03-13 JP JP61053743A patent/JPS62211965A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1328047A2 (en) | 2001-12-10 | 2003-07-16 | JDS Uniphase Corporation | Optical component attachment to optoelectronic packages |
| EP1328047A3 (en) * | 2001-12-10 | 2006-09-27 | JDS Uniphase Corporation | Optical component attachment to optoelectronic packages |
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