JPS61289309A - Production of optical semiconductor module - Google Patents

Abstract

PURPOSE:To provide excellent stability and airtightness to an optical semiconductor module and to lessen the thermal influence on an optical semiconductor element by the simplified module structure and the shortened fixing operation in the stage of packaging an optical fiber to a package by locally heating and calcining a low m.p. glass material by a CO2 laser, etc. thereby airtightly fixing the optical fiber to the package. CONSTITUTION:A heat sink 7 and an LD element 6 are bonded successively to the package 8 and electric terminals 11 are wired. The LD is made to emit light and the optical fiber 9 is finely adjusted and positioned to maximize the input power to the optical fiber. The low m.p. glass paste (in the liquid state) is poured into a fixing part 10 and, for example, the CO2 laser beam (10.6mum wavelength) is condensed from above to heat and calcine the low m.p. glass, by which the fiber 9 is fixed. A cap 12 is joined to the package 8 by a method such as soldering and the entire part is hermetically sealed.

Description

[Detailed Description of the Invention] [Summary of the Invention] An optical semiconductor element is bonded to a package, and the outer peripheral surface of the cladding (gold@ film) is applied to the original fiber so that its optical axis center and the light emission/reception center of the semiconductor element are aligned. To match (;
, the original fiber is inserted through one side of the package, and the original fiber is inserted through one side of the package C: After the low melting point glass material is injected, the low melting point glass material is heated and fired using a COt radar, etc., and the optical fiber is packaged. By using a low melting point glass material as the fixing material, it has excellent stability, high airtightness, and simplifies the module structure, and is fixed by local heating of the low melting point glass material. A method for manufacturing optical semiconductor modules that requires less work and has less thermal influence on optical semiconductor elements.

[Industrial application field]

The present invention relates to a method for manufacturing an optical semiconductor module, and in particular to a method for manufacturing an optical semiconductor module that is easy to assemble and has excellent workability and reliability.

[Conventional technology]

In conventional methods for manufacturing optical semiconductor element modules, polymer adhesives have often been used to fix optical members such as optical fibers and lenses and to hermetically seal packages. For this reason, it takes a long time for the adhesive to harden, resulting in poor workability. Also, the temperature stability of the module's optical properties is inferior due to the large difference in coefficient of thermal expansion between the optical component and the adhesive. It has disadvantages such as not being able to be airtightly sealed due to its porosity, and reliability decreasing due to aging of the adhesive material. Instead of using a polymer adhesive, a prior art example of a laser diode (LD) module is shown in FIG.

Optical components that have been metalized in advance are bonded and fixed using solder (for example, Minoru Maeda et al. ``Prototype production of hermetically sealed semiconductor laser with optical connector'').

Confucian Technical Report, OQE 76-57, P65~). That is, in this type of conventional example, after bonding the optical coupling cylindrical lens 2, which is an optical member, the optical fiber 4S, which has been metallized in advance, and the LD element 1 to the coupling mount 5 made of Cμ, The optical coupling cylindrical lens 2 and the optical fiber 4 are placed in the Y-groove for positioning on the Macintosh 5 and fixed by adhesive using In solder or the like. 5 is In
The solder fixing part is shown.

[Problem that the invention seeks to solve]

In the conventional LD module manufacturing method, although the time required for assembling the optical components is shortened, (1) when soldering the optical components, a cage is used to prevent the LD element 1 from shifting or deteriorating; It is necessary to select a solder material with a lower melting point than the brazing filler metal for bonding in step 1 (for example, LD
When using Aμ-S (melting point 280°C) as a brazing material for elements, adhesion 1 of optical members is Pb-8S (melting point 189°C).
For this reason, the materials used and soldering are limited by the working temperature, etc., and when soldering the electrical terminals of the module after assembly, C2 and optical components are used. (2) Adhesive fixing of optical components has poor temperature stability. C: The long-term stability of the module optical system is poor due to the creep phenomenon peculiar to soldering materials. (5)
If the optical fibers to be coupled are single-mode optical fibers, the coupling efficiency cannot be improved with positioning accuracy using a V-groove, and it is necessary to fix the optical fibers after aligning the optical axes. Attempts have been made to locally heat the area with a YAG laser and fix it, but the YAG laser beam (
Since the wavelength of 1.06 μm is not reflected by the metal coating material, the optical fiber is locally heated and thermally deteriorated.

[Means for solving problems]

In order to solve the conventional drawbacks, the present invention has been developed by applying C-bond ink to an optical semiconductor element in a package, and then using the cladding outer peripheral surface (
= An optical fiber coated with metal @ is placed so that the optical fiber's optical axis center matches the light emitting/light receiving center of the optical semiconductor element, and the optical fiber is inserted all the way through the package. It is characterized by a manufacturing method that includes a step of flowing a low melting point glass material into a part, locally heating the low melting point glass material with a CO laser, and firing it with a C2 to airtightly fix the optical fiber in a package.

[For production]

Does the invention package optical fiber? = When fixing, a low melting point glass material is used, and this low melting point glass material is locally heated and fired using a laser, etc., and the optical fiber is fixed in a package C: airtight, resulting in excellent stability and airtightness. By simplifying the module structure and shortening the time required for fixing work, the effects of heat on optical semiconductor elements can be reduced. Drawing C below
: Explain further.

〔Example〕

FIG. 1 is a diagram illustrating an embodiment applied to a laser diode (LD) module according to the present invention, and 6 is an L
D element, 7 is a heat sink, 8 is a ceramic package, 9 is a metal film on the outer periphery of the cladding for light output extraction, in this example, an optical fiber coated with At, 10 is a low melting point glass fixing part, 11 is an electrical terminal , 12 is a ceramic cap for hermetically sealing. When assembling these to manufacture an LD module, the following steps are performed.

(2) Heat sink 7 and LD element 6 are sequentially bonded to C package 8, and electrical terminals 111 are wired.

(C) Position the optical fiber 9 by causing the LDf to emit light and slightly moving the optical fiber 9 so that the optical fiber input power is maximized. Note that a quartz-based optical fiber is used as the optical fiber.

■ Pour low melting point glass paste (liquid) into the fixing part 10, and apply CO!, for example, from above. Lede beam (wavelength: 10.6μ door) 1 - Focus the light, heat and bake the low melting point glass, and fix the optical fiber 9.

In this example, the working temperature was 400 to 450°C and the coefficient of thermal expansion was 7 to 8 x 10-'/ as a low melting point glass paste.
”C applies.

(2) Soldering is done by the following method: Therefore, the cap 12 is joined to the package 8, and the entire package is hermetically sealed.

Because of this configuration, compared to conventional LD modules in which optical fibers are fixed using adhesive or solder material, the module assembly work time can be shortened and the optical coupling portion can be highly stabilized.

〔Effect of the invention〕

As explained above, C2, the manufacturing method of the present invention has the following advantages.

(+) Excellent long-term stability as low melting point glass is used as the fixing material. Furthermore, since it has high airtightness, it is possible to seal it airtight at the same time as fixing it, and the module structure can be simplified.

(Lid) Local heating is performed using a Rede beam, etc., so the fixing work is short and there is little thermal influence on the optical semiconductor element.

(11) Since the module assembly order is the same as the conventional one, conventional techniques can be used for the optical axis adjustment method of the optical fiber, etc.

Ov) Optical fiber: Since it is coated with metal, there will be no damage to the optical fiber or deterioration of optical characteristics during assembly work.

[Brief explanation of drawings]

FIG. 1 shows the configuration of an optical semiconductor module manufactured according to the present invention, and FIG. 2 shows the configuration of a conventional radar diode module. DESCRIPTION OF SYMBOLS 1... Raded diode element, 2... Cylindrical lens for optical coupling, 5... Macunto, 4... Optical fiber, 5...
...In solder fixing part, 6... Radede diode element, 7... Heat sink, 8... Ceramic package, 9... At coated optical fiber, 10... Low melting point glass fixing part, DESCRIPTION OF SYMBOLS 11... Electrical terminal, 12... Ceramic camp for hermetically sealing Figure 1 of the optical semiconductor module of the present invention

Claims (1)

[Scope of Claims] A method for manufacturing an optical semiconductor module, which comprises bonding an optical fiber to an optical semiconductor element and then hermetically sealing a joint between the semiconductor element and the optical fiber in a package, comprising: bonding the optical semiconductor element to the package; After that, an optical fiber having a metal film applied to the outer peripheral surface of the cladding is inserted through one surface of the package at a position where the center of the optical axis coincides with the center of light emission and light reception of the optical semiconductor element, and The method includes the steps of: flowing a low-melting glass material into a portion where the fiber penetrates one surface of the package; heating and baking the low-melting glass material that has flowed in with a CO_2 laser to hermetically fix the optical fiber to the package; A method for manufacturing an optical semiconductor module characterized by the following.