JPH0279006A - Manufacture of photosemiconductor module - Google Patents
Manufacture of photosemiconductor moduleInfo
- Publication number
- JPH0279006A JPH0279006A JP63230890A JP23089088A JPH0279006A JP H0279006 A JPH0279006 A JP H0279006A JP 63230890 A JP63230890 A JP 63230890A JP 23089088 A JP23089088 A JP 23089088A JP H0279006 A JPH0279006 A JP H0279006A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- optical semiconductor
- solder plating
- welding
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 67
- 229910000679 solder Inorganic materials 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 31
- 230000004927 fusion Effects 0.000 claims abstract description 3
- 239000004065 semiconductor Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 16
- 239000013307 optical fiber Substances 0.000 claims description 9
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Landscapes
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
光半導体素子・レンズ組立体に対して光ファイバを保持
したホルダを位置決めして固定する光半導体モジュール
の製造方法に関し、
生産性良く製造することを可能とすることを目的とし、
光半導体素子及びレンズが相対向して配置された光半導
体素子・レンズ組立体に対して光ファイバの端を保持し
たホルダを光軸合せ調整し、該ホルダのフランジを溶接
して上記光半導体素子・レンズ組立体に固定してなる光
半導体モジュールの製造方法において、上記ホルダのフ
ランジの端面のうち、溶接予定部を避けた部位に半田メ
ッキ膜を形成すると共に、上記光半導体素子・レンズ組
立体のホルダ取付面のうち、溶接予定部を避けた部位で
あって上記ホルダの半田メッキ膜が形成されている部分
に対応する部位に半田メッキ膜を形成し、上記半田・メ
ッキ膜同志を対向させて光軸合せ調整を行ない、光軸合
せ調整後、上記半田メッキ膜が溶融する温度に加熱して
対向する半田メッキ膜同志の融着により上記ホルダを上
記組立体に仮固定し、仮固定後、上記溶接予定部を溶接
するよう構成する。[Detailed Description of the Invention] [Summary] A method for manufacturing an optical semiconductor module in which a holder holding an optical fiber is positioned and fixed to an optical semiconductor element/lens assembly, which enables manufacturing with high productivity. For this purpose, the optical axis of a holder holding the end of an optical fiber is adjusted with respect to an optical semiconductor element/lens assembly in which an optical semiconductor element and a lens are arranged facing each other, and the flange of the holder is welded. In the method of manufacturing an optical semiconductor module fixed to the optical semiconductor element/lens assembly, a solder plating film is formed on a portion of the end face of the flange of the holder, avoiding the area to be welded, and the optical semiconductor element/lens assembly is fixed to the optical semiconductor element and lens assembly. A solder plating film is formed on the holder mounting surface of the element/lens assembly at a part that avoids the planned welding part and corresponds to the part on which the solder plating film of the holder is formed, and then Optical axis alignment is adjusted by making the films face each other, and after adjusting the optical axis alignment, the holder is temporarily fixed to the assembly by heating to a temperature at which the solder plating film melts and fusing the opposing solder plating films together. After temporary fixing, the welding portion is welded.
本発明は光半導体素子・レンズ組立体に対して光ファイ
バを保持したホルダを位置決めして固定する光半導体モ
ジュールの製造方法に関する。The present invention relates to a method for manufacturing an optical semiconductor module in which a holder holding an optical fiber is positioned and fixed to an optical semiconductor element/lens assembly.
この種の光半導体モジュールをｌｉｌ造する方法は、精
度良く製造することは勿論、生産性良く製造することが
出来るものであることが望ましい。It is desirable that the method for manufacturing this type of optical semiconductor module not only be able to manufacture it with high precision but also with high productivity.
第９図、第１０図は夫々従来例を示す。図中、１は光半
導体モジュールであり、光半導体素子・レンズ組立体２
にホルダ３が固定された構造である。9 and 10 respectively show conventional examples. In the figure, 1 is an optical semiconductor module, and an optical semiconductor element/lens assembly 2
It has a structure in which the holder 3 is fixed to.
光半導体素子・レンズ組立体２は、光半導体素子の一つ
である発光素子４が組み込まれているフレーム５に、レ
ンズ６が組み込まれている円板７が、発光素子４とレン
ズ６が相対向する配置で固定されている構成である。The optical semiconductor element/lens assembly 2 includes a frame 5 in which a light emitting element 4, which is one of the optical semiconductor elements, is incorporated, and a disc 7 in which a lens 6 is incorporated, and a disc 7 in which the light emitting element 4 and the lens 6 are opposed to each other. This configuration is fixed in a position facing the opposite direction.
ホルダ３には光ファイバ８の端が保持しである。The holder 3 holds the end of the optical fiber 8.
ホルダ３はフランジ９を有する。フランジ９には接着剤
の拡がりを制限する溝１０が放射状に形成しである。The holder 3 has a flange 9. The flange 9 has radially formed grooves 10 for restricting the spread of the adhesive.
光半導体モジュール１は、以下のように組立製造される
。The optical semiconductor module 1 is assembled and manufactured as follows.
まず、光ファイバ８が保持しであるホルダ３を組立体２
に対して動かして光軸合せを行ない、接着剤によりホル
ダ３を組立体２に仮固定する。First, the holder 3 that holds the optical fiber 8 is assembled into the assembly 2.
The optical axis is aligned by moving the holder 3 relative to the holder 3, and the holder 3 is temporarily fixed to the assembly 2 with adhesive.
接着は、第１０図生得号１１で示す部分で行なう。Adhesion is performed at the part indicated by number 11 in Figure 10.
接着後数時間経過して接着剤に実用強度が得られるのを
待つ。Wait several hours after bonding until the adhesive reaches practical strength.
この後、第１０図生得号１２で示す個所をレーザ溶接し
てホルダ３を組立体２に固定する。第９図中、１３は溶
接部分である。Thereafter, the holder 3 is fixed to the assembly 2 by laser welding at the location indicated by the number 12 in FIG. In FIG. 9, 13 is a welded portion.
（発明が解決しようとする課題〕
仮固定は接着で行っており、実用強度が得られるまで数
時間の間組立作業を中断する必要があり、生産性がよく
ない。(Problems to be Solved by the Invention) Temporary fixation is performed by adhesive, and it is necessary to interrupt the assembly work for several hours until practical strength is obtained, which is poor productivity.
また接着剤がレーザ溶接部へ流れ込む虞れもあり、この
場合にはレーザ溶接が出来なくなってしまう。There is also a risk that the adhesive will flow into the laser welding area, and in this case, laser welding will no longer be possible.
本発明は生産性良く製造することを可能とする光半導体
モジュールの製造方法を提供することを目的とする。An object of the present invention is to provide a method for manufacturing an optical semiconductor module that enables manufacturing with high productivity.
本発明は、光半導体素子及びレンズが相対向して配置さ
れた光半導体素子・レンズ組立体に対して光ファイバの
端を保持したホルダを光軸合せ調整し、該ホルダのフラ
ンジを溶接して上記光半導体素子・レンズ組立体に固定
してなる光半導体モジュールの製造方法において、
上記ホルダのフランジの端面のうち、溶接予定部を避け
た部位に半田メッキ膜を形成すると共に、上記光半導体
素子・レンズ組立体のホルダ取付面のうち、溶接予定部
を避けた部位であって上記ホルダの半田メッキ膜が形成
されている部分に対応する部位に半田メッキ膜を形成し
、
上記半田・メッキ膜同志を対向させて光軸合せ調整を行
ない、
光軸合せ調整後、上記半田メッキ膜が溶融する温度に加
熱して対向する半田メッキ膜同志の融着により上記ホル
ダを上記組立体に仮固定し、仮固定後、上記溶接予定部
を溶接してなる構成としたものである。The present invention adjusts the optical axis of a holder holding an end of an optical fiber with respect to an optical semiconductor element/lens assembly in which an optical semiconductor element and a lens are arranged facing each other, and welds the flange of the holder. In the method for manufacturing an optical semiconductor module fixed to the optical semiconductor element/lens assembly, a solder plating film is formed on a portion of the end face of the flange of the holder, avoiding the area to be welded, and the optical semiconductor element is fixed to the optical semiconductor element/lens assembly.・A solder plating film is formed on the holder mounting surface of the lens assembly at a part that avoids the area to be welded and corresponds to the part where the solder plating film of the holder is formed, and the solder/plating film is Adjust the optical axes by placing them facing each other, and after adjusting the optical axes, heat the solder plating films to a temperature that melts them, and temporarily fix the holder to the assembly by fusing the opposing solder plating films. After temporary fixation, the welding portion is welded.
半田メッキ膜同志の融着の場合は、接着剤を使用した場
合の実用強度が得られるまでの数時間という長い持ち時
間が不要となり、仮固定後直ぐに溶接工程に進むことが
出来る。In the case of fusing solder plated films together, it is not necessary to take several hours to obtain practical strength when using an adhesive, and the welding process can proceed immediately after temporary fixation.
第１図（Ａ）、（Ｂ）及び第２図は夫々本発明の光半導
体モジュールの製造方法の一実施例を示す。FIGS. 1(A) and 2(B) and FIG. 2 each show an embodiment of the method for manufacturing an optical semiconductor module of the present invention.
第２図は光軸合せ時の状態、第１図（Ａ）。Figure 2 shows the state when the optical axis is aligned, Figure 1 (A).
（Ｂ）は夫々仮固定時及びレーザ溶接時の状態を示す。(B) shows the state during temporary fixing and laser welding, respectively.
第３図は製造工程を示す。FIG. 3 shows the manufacturing process.
第４図は製造された光半導体モジュール２ｏを示する。FIG. 4 shows the manufactured optical semiconductor module 2o.
第５図、第６図はホルダ２１を示し、第７図。5 and 6 show the holder 21, and FIG. 7 shows the holder 21.
第８図は光半導体素子・レンズ組立体３０を示す。FIG. 8 shows an optical semiconductor element/lens assembly 30. As shown in FIG.
各図中、第９図に示す構成部分と対応する部分には同一
符号を付す。In each figure, parts corresponding to those shown in FIG. 9 are given the same reference numerals.
第５．第６図に示すように、ステンレス製のホルダ２１
のフランジ２２の端面２３には、半田メッキ２４−１〜
２４−４が形成しである。Fifth. As shown in FIG. 6, a stainless steel holder 21
The end face 23 of the flange 22 is coated with solder plating 24-1~
24-4 is the formation.
半田メッキｎ ２４− １〜２４−４は夫々扇形状であ
り、周方向上９０°間隔で、周囲４個所の溶接、予定部
２５−１〜２５−４を避けて、且つ、外周縁２６に臨ん
で形成しである。Each of the solder plating n 24-1 to 24-4 has a fan shape, and is welded at four circumferential locations at 90° intervals in the circumferential direction, avoiding the scheduled parts 25-1 to 25-4, and on the outer peripheral edge 26. It is formed by coming.
また、第７図、第８図に示すように、光半導体素子・レ
ンズ組立体３０のステンレス製の円板７の上面であるホ
ルダ取付面３１にも、半田メッキＦＡ ３２−１〜３２
−４が形成しである。Furthermore, as shown in FIGS. 7 and 8, the holder mounting surface 31, which is the upper surface of the stainless steel disc 7 of the optical semiconductor element/lens assembly 30, is also coated with solder plating FA 32-1 to 32.
-4 is formed.
半田メッキ１１１３２−１〜３２−４は上記の半田メッ
キ膜２４−１〜２４−４と同じ大きさ及び同じ形状であ
り、且つ同じパターンで配しである。The solder platings 11132-1 to 32-4 have the same size and shape as the solder plating films 24-1 to 24-4, and are arranged in the same pattern.
即ち、半田メッキ１１１１３２−１〜３２−４は夫々扇
形状であり、周方向上９０°間隔で、周囲４個所の溶接
予定部３３−１〜３３−４を避けて、且つ外周縁３４に
臨んで形成しである。That is, each of the solder platings 111132-1 to 32-4 has a fan shape, and is spaced at 90° intervals in the circumferential direction, avoiding the four surrounding welding areas 33-1 to 33-4, and facing the outer peripheral edge 34. It is formed with.
次に、光半導体モジュール２０の製造方法について説明
する。Next, a method for manufacturing the optical semiconductor module 20 will be explained.
製造は、第３図に示すように、光軸合わせ工程４０→軸
による仮固定工程４１→レーザ溶接工程４２を経て行わ
れる。As shown in FIG. 3, the manufacturing process is performed through an optical axis alignment process 40 -> a temporary fixing process 41 by a shaft -> a laser welding process 42.
第２図は光軸合せ調整工程時の状態を示す。FIG. 2 shows the state during the optical axis alignment adjustment process.
５０は光軸合せ調整装置であり、発光素子４より射出し
て光ファイバ８に入射した光の強度を検知する検知器５
１と、ホルダ２１をＸ、Ｙ方向に微小変位させる微小変
位装置５２とよりなる。50 is an optical axis alignment adjustment device, and a detector 5 detects the intensity of light emitted from the light emitting element 4 and incident on the optical fiber 8.
1, and a minute displacement device 52 for minutely displacing the holder 21 in the X and Y directions.
光軸合せ調整は、光半導体素子・レンズ組立体２をテー
ブル５３に固定し、微小変位装置５２によりホルダ２１
を微小変位させて行ない、検出器５１の検出信号レベル
が最大となった位置で調整を終了する。５４はホルダを
クランパするクランパである。Optical axis alignment adjustment is performed by fixing the optical semiconductor element/lens assembly 2 on a table 53 and moving the holder 21 using a minute displacement device 52.
The adjustment is performed by slightly displacing the sensor 51, and the adjustment is completed at the position where the detection signal level of the detector 51 becomes maximum. 54 is a clamper that clamps the holder.
また光軸合せ調整は、第１図（Ａ）に示すように、ホル
ダ２１及び組立体３０の向きを、半田メッキ膜２４−１
〜２４−４が夫々半田メッキ膜３２−１〜３２−４に対
向してこれを接触するように、且つ接触している各半田
メッキ膜が夫々周囲４個所に配されたレーザ溶接機６０
−１〜６０−４に対向するように定めて行なう。これは
、次の相による仮固定を確実且つ円滑に行なうためであ
る。Further, the optical axis alignment adjustment is performed by adjusting the orientation of the holder 21 and the assembly 30 to the solder plated film 24-1 as shown in FIG. 1(A).
A laser welding machine 60 in which the solder plated films 32-1 to 32-4 are arranged so that the solder plated films 32-1 to 32-4 face each other and come into contact with the solder plated films 32-1 to 32-4.
-1 to 60-4. This is to ensure that temporary fixation in the next phase is performed reliably and smoothly.
次に半田による仮固定を行なう。第１図（Ａ）はこのと
きの状態を示す。Next, temporary fixation is performed using solder. FIG. 1(A) shows the state at this time.
クランパ５４によりホルダ２１を光軸を合せた位置に保
持して、レーザ溶接様制御装置ｆ６１により、レーザ溶
接機６０−１〜６０−４を半田を溶融させる温度に加熱
させる低い出力で同時に一時的１０秒間程度に連続動作
させる。The clamper 54 holds the holder 21 in a position where the optical axis is aligned, and the laser welding control device f61 temporarily heats the laser welders 60-1 to 60-4 to a temperature that melts the solder at a low output. Operate continuously for about 10 seconds.
各レーザ溶接機６０−１〜６０−４よりのレーザビーム
６２−１〜６２−４が突き合わされている半田メッキ膜
の個所を同時に照射し、半田メッキ膜が加熱されて融着
し、ホルダ２１は周方向上４個所を組立体３０に半田付
けされて仮固定される。第１図（Ｂ）中６３−１〜６３
−４は仮固定された部分である。The laser beams 62-1 to 62-4 from the respective laser welding machines 60-1 to 60-4 simultaneously irradiate the parts of the solder plating film that are butted against each other, and the solder plating film is heated and fused, and the holder 21 is temporarily fixed by soldering to the assembly 30 at four locations in the circumferential direction. 63-1 to 63 in Figure 1 (B)
-4 is a temporarily fixed part.
この仮固定は半田によるものであるため、接着剤を使用
した場合におけるような実用強度が得られるまで数時間
行なうような必要はなく、レーザビームの照射が停止さ
れて半田が凝固すると十分な強度で仮固定され、仮固定
工程４１は掻く短い時間で終了する。Since this temporary fixing is done with solder, there is no need to do it for several hours until practical strength is obtained, as is the case with adhesives, and once the laser beam irradiation is stopped and the solder solidifies, sufficient strength is achieved. The temporary fixing step 41 is completed in a very short time.
続いて、クランパ５４によるクランプを解除し、第１図
（Ｂ）に示すように、テーブル５３を矢印へ方向に４５
度回動させて溶接予定部２５−１〜２５−＜、３３−１
〜３３−４を各レーザ溶接機６０−１〜６０−４に対向
させる。Subsequently, the clamp by the clamper 54 is released, and the table 53 is moved in the direction of the arrow 45 as shown in FIG. 1(B).
Rotate the part to be welded 25-1 to 25-<, 33-1
~33-4 are made to face each laser welding machine 60-1~60-4.
この状態で、制御装置６１によりレーザ溶接機６０−１
〜６０−４を再度同時に動作（パズル発振）させる。In this state, the control device 61 controls the laser welding machine 60-1.
- 60-4 are operated simultaneously (puzzle oscillation) again.
今度は、溶接予定部を溶融させるに足る大きな出力で動
作され、溶接予定部２５−１〜２５−４、３３−１〜３
３−４がレーザビーム６４−１〜６４−４によりレーザ
溶接され、ホルダ２１が組立体３０に仮固定される。This time, the operation is performed with a power large enough to melt the welding areas, and the welding areas 25-1 to 25-4, 33-1 to 3
3-4 are laser welded using laser beams 64-1 to 64-4, and the holder 21 is temporarily fixed to the assembly 30.
レーザ溶接時にボルダ２１は動かず、ホルダ２１は仮固
定された位置で、即ち光軸調整された位置で最終的に固
定される。During laser welding, the boulder 21 does not move, and the holder 21 is finally fixed at a temporarily fixed position, that is, at a position where the optical axis is adjusted.
なお、上記仮固定時の半田の流れ出しは殆ど起きず、溶
接予定部には半田は無く、レーザ溶接は正常に行なわれ
る。It should be noted that almost no solder flows out during the temporary fixing, there is no solder in the area to be welded, and laser welding is performed normally.
これにより、第４図に示す光半導体モジュール２０が完
成する。As a result, the optical semiconductor module 20 shown in FIG. 4 is completed.
６５．６６は溶接された部分である。65 and 66 are welded parts.
なお、上記の仮固定のための加熱は、レーザビームをデ
フォーカスするか或いはパルス状に加えて行なえばよい
。またこの加熱をレーザビーム以外の手段、例えばヒー
タにより行なうことも可能である。Note that the above heating for temporary fixing may be performed by defocusing the laser beam or by adding it in a pulsed manner. It is also possible to perform this heating by means other than a laser beam, such as a heater.
また、半田メッキ膜２４−１〜２４−４、３３−１〜３
：ｌ”−４の形状及び配置を上記のものに限定されるも
のではなく、例えば外周縁２６゜２７に臨んでいなくと
もよく、要は溶接予定部２５−１〜２５−ａ、３３−１
〜３３−４以外の部分に形成されており、仮固定時の加
熱より溶融しつるような部位に形成されていればよい。In addition, solder plating films 24-1 to 24-4, 33-1 to 3
:l''-4 is not limited to the above-mentioned shape and arrangement; for example, it does not have to face the outer peripheral edge 26°27; 1
~ 33-4, as long as it is formed in a part that melts and hangs when heated during temporary fixation.
以上説明したように、本発明によれば、溶接時の仮固定
を半田メッキ躾同志の融着により行なっているため、凝
固により直ぐに所定の強度が得られ、仮固定が掻く短時
間で完成し接着剤で仮固定した場合のように実用強度が
得られるまでの持ち時間を不要とし得る。これにより光
軸合せ調整後溶接するまでの時間を短縮することが出来
、光半導体モジュールの生産性の向上を図ることが出来
る。As explained above, according to the present invention, temporary fixation during welding is performed by fusion of the solder plated parts, so the specified strength can be obtained immediately by solidification, and temporary fixation can be completed in a short time. It is possible to eliminate the need for a period of time until practical strength is obtained, which is required when temporarily fixing with adhesive. This makes it possible to shorten the time from optical axis alignment adjustment to welding, and to improve the productivity of optical semiconductor modules.
第１図（Ａ）、（Ｂ）は本発明の光半導体モジュールの
製造方法の一実施例を説明する図、第２図は光軸合せ調
整を説明する図、
第３図は本発明の光半導体モジュールの製造工程を示す
図、
第４図は完成した光半導体モジュールを示す図第５図は
ホルダの断面図、
第６図はホルダの底面図、
第７図は光半導体素子・レンズ組立体の断面図、第８図
は光半導体素子・レンズ組立体の平面図、第９図及び第
１０図は夫々光半導体モジュールの従来の製造方法を説
明する図である。
図において、
４は発光素子、
５はフレーム、
６はレンズ、
７は円板、
８は光ファイバ、
２０は光半導体モジュール、
２１はホルダ、
２２はフランジ、
２３は端面、
２４−１〜２４−４．３２−１〜３２−４は半田メッキ
膜、
２５−１〜２５−４．３３−１〜３３−４は溶接予定部
、
２６．３４は外周縁、
３０は光半導体素子・レンズ組立体、
３１はホルダ取付部
４０は光軸合せ調整工程、
４１は半田による仮固定工程、
４２はレーザ溶接工程、
５０は光軸合せ調整装置、
５１は検知器、
５２は微小変位装置、
５３はテーブル、
５４はクランパ、
６０−１〜６０−４はレーザ溶接線、
６１はレーザ溶接礪制御装置、
６３−１〜６３−４は仮固定された部分、６５．６６は
溶接された部分
を示す。
喜２図
第３図
第４図
第５図
つ１
８６図
１６７図
第８図
１ｊ９図
第１０１！１Figures 1 (A) and (B) are diagrams illustrating an embodiment of the optical semiconductor module manufacturing method of the present invention, Figure 2 is a diagram illustrating optical axis alignment adjustment, and Figure 3 is a diagram illustrating an embodiment of the optical semiconductor module manufacturing method of the present invention. Figure 4 shows the manufacturing process of the semiconductor module. Figure 4 shows the completed optical semiconductor module. Figure 5 is a sectional view of the holder. Figure 6 is a bottom view of the holder. Figure 7 is the optical semiconductor element/lens assembly. FIG. 8 is a plan view of the optical semiconductor element/lens assembly, and FIGS. 9 and 10 are diagrams each illustrating a conventional manufacturing method of an optical semiconductor module. In the figure, 4 is a light emitting element, 5 is a frame, 6 is a lens, 7 is a disk, 8 is an optical fiber, 20 is an optical semiconductor module, 21 is a holder, 22 is a flange, 23 is an end surface, 24-1 to 24- 4. 32-1 to 32-4 are solder plating films, 25-1 to 25-4. 33-1 to 33-4 are welding areas, 26. 34 are outer peripheral edges, 30 is an optical semiconductor element/lens assembly , 31 is a holder mounting part 40 is an optical axis alignment adjustment process, 41 is a temporary fixing process by soldering, 42 is a laser welding process, 50 is an optical axis alignment adjustment device, 51 is a detector, 52 is a minute displacement device, 53 is a table , 54 is a clamper, 60-1 to 60-4 are laser welding lines, 61 is a laser welding depression control device, 63-1 to 63-4 are temporarily fixed portions, and 65.66 is a welded portion. Figure 2 Figure 3 Figure 4 Figure 5 Figure 1 86 Figure 167 Figure 8 Figure 1j9 Figure 101!1
Claims (1)
体素子・レンズ組立体に対して光ファイバの端を保持し
たホルダを光軸合せ調整し、該ホルダのフランジを溶接
して上記光半導体素子・レンズ組立体に固定してなる光
半導体モジュールの製造方法において、 上記ホルダ（２１）のフランジ（２２）の端面（２３）
のうち、溶接予定部（２５−＿１〜２５−＿４）を避け
た部位に半田メッキ膜（２４−＿１〜２４−＿４）を形
成すると共に、上記光半導体素子・レンズ組立体（３０
）のホルダ取付面（３１）のうち、溶接予定部を避けた
部位であって上記ホルダの半田メッキ膜（２４−＿１〜
２４−＿４）が形成されている部分に対応する部位に半
田メッキ膜（３２−＿１〜３２＿４）を形成し、 上記半田・メッキ膜同志（２４−＿１〜２４−＿４、３
２−＿１〜３２−＿４）を対向させて光軸合せ調整を行
ない、 光軸合せ調整後、上記半田メッキ膜が溶融する温度に加
熱して対向する半田メッキ膜同志（２４−＿１〜２４−
＿４、３２−＿１〜３２−＿４）の融着により上記ホル
ダを上記組立体（３０）に仮固定し（４１）、 仮固定後、上記溶接予定部（２５−＿１〜２５−＿４、
３３−＿１〜３３−＿４）を溶接して（４２）なること
を特徴とする光半導体モジュールの製造方法。[Claims] Adjusting the optical axis of a holder holding the end of an optical fiber with respect to an optical semiconductor element/lens assembly in which an optical semiconductor element and a lens are arranged facing each other, and welding the flange of the holder. In the method for manufacturing an optical semiconductor module, the end face (23) of the flange (22) of the holder (21) is fixed to the optical semiconductor element/lens assembly.
Among these, solder plating films (24-_1 to 24-_4) are formed in areas avoiding the planned welding parts (25-_1 to 25-_4), and the optical semiconductor element/lens assembly (30
) of the holder mounting surface (31), which avoids the welding area and which is the solder plated film (24-_1~) of the holder.
Solder plating films (32-_1 to 32_4) are formed on the parts corresponding to the parts where the solder and plating films (24-_1 to 24-_4, 3) are formed.
2-_1 to 32-_4) are faced to each other to perform optical axis alignment adjustment, and after the optical axis alignment adjustment, the solder plated films (24-_1 to 24-
_4, 32-_1 to 32-_4) are temporarily fixed to the assembly (30) by fusion (41), and after the temporary fixation, the welding planned portions (25-_1 to 25-_4,
33-_1 to 33-_4) are welded (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63230890A JPH0279006A (en) | 1988-09-14 | 1988-09-14 | Manufacture of photosemiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63230890A JPH0279006A (en) | 1988-09-14 | 1988-09-14 | Manufacture of photosemiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279006A true JPH0279006A (en) | 1990-03-19 |
Family
ID=16914907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63230890A Pending JPH0279006A (en) | 1988-09-14 | 1988-09-14 | Manufacture of photosemiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279006A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190783A (en) * | 2005-01-05 | 2006-07-20 | Sumitomo Electric Ind Ltd | Optical module and method of manufacturing the same |
| JP2008027989A (en) * | 2006-07-18 | 2008-02-07 | Hamamatsu Photonics Kk | Semiconductor light-emitting device |
-
1988
- 1988-09-14 JP JP63230890A patent/JPH0279006A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190783A (en) * | 2005-01-05 | 2006-07-20 | Sumitomo Electric Ind Ltd | Optical module and method of manufacturing the same |
| JP2008027989A (en) * | 2006-07-18 | 2008-02-07 | Hamamatsu Photonics Kk | Semiconductor light-emitting device |
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