JP2008027989A - Semiconductor light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that is applicable to optical link modules and is equipped with a structure suitable for adjusting emission intensity and making the dispersion uniform. <P>SOLUTION: The semiconductor light-emitting device 1 has a light-emitting element, a drive circuit for driving the light-emitting element, and a lead frame on which the light-emitting element and the drive circuit are mounted. The semiconductor light-emitting device 1 has adjusting leads 27a and 27b, having one end connected to an internal lead of the lead frame, the other end connected with an external lead of the lead frame and parts between those ends that protrude to the outside of a sealing resin. The device is structured so that the voltage applied to the light-emitting element varies, by cutting or eliminating the adjusting leads 27a and 27b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor light emitting device in which a lead frame on which a light emitting element is mounted is molded and covered with a resin.

  Conventionally, semiconductor light emitting devices such as light emitting diodes (Light Emitting Diodes, hereinafter referred to as “LEDs”) and surface emitting semiconductor lasers (Vertical Cavity Surface Emitting Lasers, hereinafter referred to as “VCSELs”) have variations in light emission intensity (output). There was a problem inherent to the device. For example, it is inevitable that the light emission intensity of the LED varies due to non-uniform diffusion at the PN junction such as GaAsP, incomplete light shielding between the electrode and the light-emitting surface, and non-uniform characteristics. This could be an obstacle to stable optical communication. In particular, in the case of a normal monolithic LED in which a large number of light emitting points are formed on one chip, the light emission intensity from the large number of light emitting points is difficult to be uniform. Large variations are likely to occur.

  For this reason, there has conventionally been a technique for adjusting the light emission intensity of a light emitting element to make the variation uniform for a semiconductor light emitting device having a semiconductor light emitting element. For example, by adding a limiting resistor outside the LED array chip to lower the voltage, a technique for making the current flowing through the LED substantially constant, or as disclosed in Patent Document 1, a transistor is connected in series with the LED. There has been a technique that compensates for line resistance loss, connects a Zener diode in parallel to a transistor and an LED, and supplies a predetermined current to the LED, thereby preventing a decrease in light emission luminance of the LED accompanying an increase in line length.

  Further, as disclosed in Patent Document 2, a strip-shaped resistive material is connected to a light emitting surface having a large number of light emitting points in one chip, while a conductor for applying a voltage is parallel to the resistive material. There is also a technique in which the resistance value is continuously changed by changing the bonding position between the resistive material and the conductor so as to reduce the variation in the emission intensity.

Furthermore, as a method of adjusting the current flowing through the light emitting element, an external electric pulse is used, a fuse drom is configured with a Zener Zap technology or the like, and digital control is performed, or an internal resistance using a laser trimming technology or the like is used. There are a method of adjusting the data in an analog manner, a method of digitally adjusting the data in the flash memory from the outside, and the like.
JP 59-1114879 A Japanese Examined Patent Publication No. 7-46735

  As described above, conventionally, there has been known a technique capable of adjusting the light emission intensity of a light emitting element and making the variation uniform with respect to a semiconductor light emitting device.

  However, the semiconductor light emitting device applied to the optical link module attached in a state where the optical fiber and the light emitting element are aligned has the following problems. That is, this type of semiconductor light-emitting device needs to align (align) the optical fiber as the light transmission means and the light-emitting element. For this purpose, a cap member or the like is attached to the substrate on which the light-emitting element is mounted. I had to do the assembly work. However, when the assembly work is performed, the light emitting element and the drive circuit are sealed with a cap member or the like, so that trimming in the package cannot be performed. On the other hand, before the assembly work is performed, the optical fiber and the light emitting element Therefore, the emission intensity could not be adjusted while monitoring through the optical fiber.

  Therefore, this type of semiconductor light-emitting device has a drawback that it is not suitable for adjusting the light emission intensity of the light-emitting element and making the variation uniform as in the conventional technique described above.

  Accordingly, the present invention has been made to solve the above-described problems, and can be applied to an optical link module, and provides a semiconductor light emitting device having a structure suitable for adjusting light emission intensity and uniforming variation. For the purpose.

  In order to solve the above problems, the present invention includes a light emitting element and a drive circuit for driving the light emitting element, and a lead frame on which the light emitting element and the drive circuit are mounted is covered with a molded sealing resin. A semiconductor light emitting device having one end connected to an internal lead of a lead frame, the other end connected to an internal lead or an external lead of the lead frame, and a gap between the one end and the other end for sealing An adjustment lead projecting outside the resin is provided, and the voltage applied to the light emitting element is changed by cutting or excising a portion of the adjustment lead projecting outside the sealing resin. Features a semiconductor light emitting device.

  Since this semiconductor light emitting device has an adjustment lead, and the adjustment lead has a portion protruding outside the sealing resin, it can be cut or excised from the outside of the sealing resin. Further, when the adjustment lead is cut or excised from the outside of the sealing resin, the voltage applied to the light emitting element is changed.

  The semiconductor light emitting device has a configuration in which a light emitting element, a drive circuit, and a lead frame are covered with a molded sealing resin, and an external lead and an adjustment lead are provided on the outside, and a resin case thereof It is preferable to further include a cap member that can be placed on the resin case and whose position on the resin case can be changed.

  In this semiconductor light emitting device, the cap member can be placed on the resin case to change the position, and then the adjustment lead can be cut or excised after the cap member is fixed to the resin case.

  Further, any of the above semiconductor light emitting devices has a fiber guide part into which the cap member can insert the optical fiber, and the cap member is moved while being placed on the resin case, so that the optical axis of the fiber guide part and the optical axis of the light emitting element It is preferable that the cap member is fixed to the resin case by laser welding after the optical axis adjustment is performed so as to match.

  Such a semiconductor light-emitting device can adjust the optical axis by aligning the optical axis of the fiber guide part and the optical axis of the light-emitting element by moving the cap member after inserting the optical fiber into the fiber guide part of the cap member, Then, after fixing the cap member to the resin case by laser welding, the adjustment lead can be cut or cut off.

  As described above, according to the present invention, it is possible to obtain a semiconductor light-emitting device that can be applied to an optical link module and has a structure suitable for adjusting light emission intensity and uniforming variation.

  Preferred embodiments of a semiconductor light emitting device according to the present invention will be described below with reference to the accompanying drawings. In addition, the same code | symbol is used for the same element and the overlapping description is abbreviate | omitted.

(Structure of semiconductor light emitting device)
1 is a plan view showing a semiconductor light emitting device 1 according to the present invention, FIG. 2 is a perspective view, FIG. 3A is a front view, and FIG. 3B is a right side view. 4 is a sectional view taken along line IV-IV in FIG. 1, and FIG. 5 is a sectional view taken along line VV in FIG. The semiconductor light emitting device 1 has a cap member 2 and a pre-molded case 20, and after the cap member 2 is moved while the cap member 2 is placed on the pre-molded case 20, optical axis adjustment described later is performed. The cap member 2 is fixed to the pre-molded case 20, and the light emission intensity of the light emitting element 102 to be described later is adjusted.

  The cap member 2 is made of a light transmissive resin that can transmit laser light having a predetermined wavelength. As shown in FIGS. 6 to 10, the cap member 2 includes a rectangular base portion 3 formed in a rectangular plate shape corresponding to a case main body portion 21 to be described later of the premolded case 20, and one side of the rectangular base portion 3 (this A fiber guide portion 4 provided on 3a and a fitting portion 5 provided on the back surface 3b side of the fiber guide portion 4 of the rectangular base 3 so as to surround the fitting portion 5. An engaging recess 9 is provided in the front.

  The fiber guide portion 4 is near one short side of the surface 3a of the rectangular base portion 3, and the light of the fiber guide portion 4 and a light emitting element 102 to be described later is placed with the cap member 2 placed on the premolded case 20. It is arranged at a place where the axis can be adjusted. As shown in detail in FIG. 9, the fiber guide portion 4 has a height and an inner diameter capable of holding the end portion 100a (see FIGS. 4 and 5) of the optical fiber 100 and holding the inserted state, and has a rectangular base portion. 3, a cylindrical wall portion 6 that protrudes from the surface 3 a, a reduced diameter portion 7 that is dropped from the surface 3 a following the cylindrical wall portion 6, and an inner diameter gradually decreases, and a bottom portion 8 that closes the reduced diameter portion 7. It has a bottomed cylindrical shape.

  In particular, as shown in FIG. 6, the fitting portion 5 is formed in a portion corresponding to a later-described concave portion 26 of the pre-molded case 20 on the back surface 3 b of the rectangular base portion 3. The fitting portion 5 is a curved engagement surface 5a that is curved so as to be recessed toward the center of the back surface 3b so that the side surfaces of the four corners correspond to engagement protrusions 24 described later, and the other is a peripheral wall portion described later. The flat engagement surface 5 b is flat along the line 25, and has a shape corresponding to the recess 26 as a whole.

  The engaging recess 9 is such that the peripheral portion of the back surface 3b is recessed or recessed in the thickness direction of the fitting portion 5 so that the fitting portion 5 is formed with the protruding width h1, and the fitting portion 5 protrudes relatively. It is formed like this. The engagement recess 9 has four corner regions 3c arranged at the four corners of the back surface 3b, each having a size larger than the zenith portion 24a of the engagement projection 24, and is placed on the zenith portion 24a. It has a possible configuration. The engaging recesses 9 can be engaged by the curved engaging surfaces 5 a contacting the engaging protrusions 24 or confronting each other with a gap, and the fitting part 5 is fitted in the recess 26. In this case, a space portion 10 to be described later is secured between each engaging convex portion 24 and the peripheral wall portion 25.

  The pre-molded case 20 is a resin case according to the present invention, and as shown in FIGS. 11 to 15, a case main body 21 and four external leads 22 a, 22 b, 22 c protruding outward from the case main body 21. , 22d and adjustment leads 27a, 27b.

  The case main body 21 has the lead frame 101 covered with a light-absorbing resin that absorbs laser light having a predetermined wavelength as a molded sealing resin. The lead frame 101 includes a light emitting element such as an LED or a VCSEL (in this embodiment, it is an LED, but other light emitting elements may be used as well) 102 and a drive adjustment circuit 103 to be described later for driving the light emitting element 102. In addition to the four external leads 22a, 22b, 22c, and 22d and the adjustment leads 27a and 27b, the IC chip 104 is mounted and the internal leads 28a, 28b, 28c, and 28d covered with the molded light absorbing resin. , 28e, 28f. The internal leads 28a, 28b, 28c, 28d, 28e, and 28f are connected to the IC chip 104 by bonding wires 105, and the internal leads 28a, 28b, 28c, and 28d are connected to the external leads 22a, 22b, 22c, and 22d, respectively. The internal leads 28e and 28f are connected to the adjustment leads 27a and 27b.

  Of the external leads 22a, 22b, 22c, and 22d, the adjustment leads 27a and 27b are connected to the external leads 22a and 22d arranged on both sides, respectively. The adjustment leads 27a and 27b have one end connected to the internal leads 28e and 28f and the other end connected to the external leads 22a and 22d, respectively, between the one end and the other end. The part has protruded outside the light absorptive resin (case main-body part 21). Since the adjustment leads 27a and 27b have a portion protruding to the outside of the case main body portion 21, the adjustment leads 27a and 27b can be cut and cut from the outside of the premolded case 20 or cut off. When the adjustment leads 27a and 27b are cut or cut, one end and the other end of the adjustment leads 27a and 27b are separated, and the external leads 22a and 22d are connected to the internal leads 28e and 28f. Can be cut off.

  In addition, the case main body 21 can be mounted and engaged with the rectangular element mounting portion 23 having the light emitting element 102 and the cap member 2, and is arranged at the four corners outside the light emitting element 102 in the element mounting portion 23. The four engaging convex portions 24 and the peripheral wall portion 25 arranged between the engaging convex portions 24 at the periphery of the element mounting portion 23 are provided. The case body 21 has a concave portion 26 surrounded by the four engaging convex portions 24 and the peripheral wall portion 25, and the above-described fitting portion 5 can be fitted into the concave portion 26.

  Each engagement convex part 24 has the zenith part 24a and the curved side surface 24b which faces the recessed part 26, and is formed in the convex shape which protrudes by the protrusion width h2 (h1> h2) rather than the surrounding wall part 25. FIG. In addition, each engagement convex portion 24 has a function as a placement receiving portion in which the corner region 3c of the cap member 2 is placed on the zenith portion 24a when the fitting portion 5 is fitted in the concave portion 26, respectively. In addition, the curved engaging surfaces 5a and the flat engaging surfaces 5b are brought into contact with the curved side surfaces 24b and the peripheral wall portion 25 or face each other with a gap therebetween, so that the above-described engaging recess 9 is engaged. It is like that.

  On the other hand, the IC chip 104 includes a drive adjustment circuit 103 together with the light emitting element 102 in a circuit configuration as shown in FIG. The drive adjustment circuit 103 includes a drive unit 103a that drives the light emitting element 102 by flowing a current, an adjustment unit 103b that adjusts a current passed through the drive unit 103a, and a logic circuit unit 103c. R32 is included. The drive unit 103a includes transistors MP14, MP15, MP16, and MP17, and by operating the transistors MP14, MP15, MP16, and MP17 by the input signal S, the input voltage Vcc is switched on and off to the light emitting element 102. It has become.

  The adjustment unit 103b includes resistance elements R27, R28, R29, and R30 having different resistance values and transistors MN32, MN33, MN34, and MN35, and is applied to the light emitting element 102 having the input voltage Vcc by the resistance elements R27, R28, R29, and R30. The voltage applied to the gate of the transistor MP14 and the voltage applied to the source and gate of the MP15 are adjusted by the transistors MN32, MN33, MN34, and MN35, and the current flowing through the light emitting element 102 is adjusted. Yes. The logic circuit unit 103c includes AND circuits 51, 53, and 55, an OR circuit 52, and an XOR circuit 54, and these switches the MN32, MN33, MN34, and MN35 on and off.

  Each input terminal of the drive adjustment circuit 103 configured as described above is connected to each internal lead as follows. That is, the GND terminal (not shown) of the drive adjustment circuit 103 is connected to the internal leads 28a and 28d. An input terminal for the input signal S is connected to the internal lead 28b, and an input terminal for the input voltage Vcc is connected to the internal lead 28c. Further, the input terminals Cont1 and Cont2 of the logic circuit unit 103c are connected to the internal leads 28e and 28f.

  Therefore, for example, the protruding portion from the case main body 21 in the adjustment lead 27a is cut as shown in FIG. 25 (A), or the protruding portion is cut out as shown in FIG. 25 (B). Then, since the connection between the external lead 22a and the internal lead 28e is cut, the wiring a is cut in FIG. Therefore, for the AND circuit 51, the OR circuit 52, and the XOR circuit 54, the potential at the GND terminal, which was applied before the disconnection, changes to a voltage drop in the resistance element R32 of the input voltage Vcc. Due to this voltage change, the output of the logic circuit portion 103c changes, and the transistors MN32, MN33, MN34, and MN35 in the adjustment portion 103b are turned on and off, and the voltage applied to the light emitting element 102 is changed from the input voltage Vcc to the resistance element. The voltage drops due to at least one of R27, R28, R29, and R30.

  Similarly, when the adjustment lead 27b is cut off, the connection between the external lead 22d and the internal lead 28f is cut, so that the wiring b in FIG. 17 is cut. Also in this case, the output of the logic circuit section 103c changes, the transistors MN32, MN33, MN34, and MN35 are turned on and off, and the voltage applied to the light emitting element 102 is changed from the input voltage Vcc to the resistance elements R27, R28, R29, The voltage drops due to at least one of R30.

  The cap member 2 and the premolded case 20 having the above configuration further have the following characteristics. That is, the cap member 2 and the pre-molded case 20 are formed such that each corner region 3c has a slightly larger area than each zenith portion 24a. Therefore, the fitting portion 5 of the cap member 2 is fitted into the concave portion 26 of the pre-molded case 20, and the corner region 3 c of the engaging concave portion 9 is placed on the engaging convex portion 24, and the cap member is placed on the pre-molded case 20. When 2 is placed, a gap is created between the pre-molded case 20 and the cap member 2, and a space portion 10 is secured between each engagement convex portion 24 and the peripheral wall portion 25 and the engagement concave portion 9. (See FIG. 1). Therefore, the semiconductor light emitting device 1 is configured so that the fitting portion 5 is fitted in the concave portion 26 and the corner region 3c is placed on the engaging convex portion 24 before the cap member 2 is fixed to the premolded case 20. The position of the cap member 2 can be changed by moving the cap member 2 on the pre-molded case 20 using the part 10. That is, the space portion 10 functions as a grace space (so-called play) that gives the semiconductor light emitting device 1 room for changing the position of the cap member 2 on the pre-molded case 20.

(Method for manufacturing semiconductor light emitting device)
The semiconductor light emitting device 1 is manufactured according to the following procedure using the cap member 2 and the premolded case 20 having the above configuration.

  First, the cap member 2 and the premold case 20 having the above-described configuration are prepared.

  Then, as shown in FIG. 16A, the cap member 2 is aligned and fitted from the upper side of the pre-molded case 20 so that the fiber guide portion 4 is disposed at a position corresponding to the mounting position of the light emitting element 102. The part 5 is fitted into the recess 26 of the premolded case 20. At this time, the four corner regions 3 c of the cap member 2 are placed on the zenith portion 24 a of each engagement convex portion 24 of the pre-mold case 20, and the cap member 2 is placed on the pre-mold case 20. Then, as described above, since the space portion 10 is secured between each engagement convex portion 24 and the peripheral wall portion 25 and the engagement concave portion 9, the corner region 3c is placed on each engagement convex portion 24. The position of the cap member 2 on the premolded case 20 can be changed. At the same time, the engagement concave portion 9 can be engaged with each engagement convex portion 24 by bringing the curved engagement surface 5 a of the engagement concave portion 9 into contact with the curved side surface 24 b of each engagement convex portion 24. it can. Thus, the cap member 2 and the pre-molded case 20 have a range in which the cap member 2 can be moved on the pre-molded case 20 within a certain range, and provisional positioning is performed within the range (temporary positioning). The temporary positioning state is established.

  Next, as shown in FIG. 16B, the optical fiber 100 is inserted into the fiber guide portion 4 of the cap member 2 from the upper side of the premolded case 20, and the end portion 100 a is guided along the reduced diameter portion 7.

  Subsequently, the optical axis adjustment is performed so that the optical axis of the fiber guide portion 4 and the optical axis of the light emitting element 102 coincide with each other. This optical axis adjustment is performed by causing the light emitting element 102 to emit light by inputting the input voltage Vcc and the input signal S from the external leads 22a, 22b, 22c, and 22d, and the cap member 2 being placed on the premolded case 20. The output at the output end of the optical fiber 100 (the end opposite to the end inserted into the fiber guide 4) is monitored with a predetermined measuring instrument while appropriately changing the output, and the monitored output is maximized. Detect position. When the position where the maximum output is detected is detected, the optical axis of the fiber guide portion 4 and the optical axis of the light emitting element 102 coincide with each other, and the optical axis adjustment is completed.

  Then, after performing the optical axis adjustment, as shown in FIG. 16C, the cap member 2 has a predetermined wavelength that can be transmitted through the corner portions 3c at the four corners and can be absorbed by the premold case 20. Laser light L is irradiated from the cap member 2 side. Then, since the cap member 2 is made of a light-transmitting resin that can transmit the laser beam L, the laser beam L reaches the premold case 20 after passing through the cap member 2. Since the premold case 20 is made of a light-absorbing resin capable of absorbing the laser light L, the pre-mold case 20 absorbs the laser light L incident through the cap member 2 and is melted by heat generated during the absorption. Further, the cap member 2 is also melted by the remaining heat of the premolded case 20 that generates heat, and the melted portions of both resins are integrated and cured, whereby the cap member 2 is fixed to the premolded case 20.

  Subsequently, while monitoring the light emission of the light emitting element 102 due to the input voltage Vcc input through the external lead 22c, the adjustment leads 27a and 27b are cut or cut as necessary to cut the external lead 22a and the internal lead. The connection with 28e or the connection between the external lead 22d and the internal lead 28f is disconnected. Then, as described above, the voltage applied to the light emitting element 102 changes, and the light emission intensity of the light emitting element 102 changes. In this way, the light emission intensity of the light emitting element 102 is adjusted. When the adjustment of the light emission intensity of the light emitting element 102 is completed, the semiconductor light emitting device 1 is obtained as shown in FIG.

  The semiconductor light emitting device 1 manufactured as described above can adjust the optical axis so that the optical axis of the fiber guide portion 4 and the optical axis of the light emitting element 102 coincide with each other, and then the cap member 2 is pre-molded by laser welding. It is fixed to 20 and integrated. Therefore, even if there is a deviation between the optical axis of the fiber guide portion 4 and the optical axis of the light emitting element 102 at the stage of temporary positioning, the deviation is eliminated by performing the optical axis adjustment. 2 is fixed to the pre-molded case 20 and integrated.

  Further, even after the cap member 2 is fixed to the pre-molded case 20, the semiconductor light emitting device 1 can cut or cut the adjustment leads 27a and 27b, so that the adjustment leads 27a and 27b By cutting or cutting, the voltage applied to the light emitting element 102 can be changed to change the light emission intensity of the light emitting element 102. Since the adjustment leads 27a and 27b can be cut and cut from the outside of the pre-molded case 20, the semiconductor light emitting device 1 aligns the optical fiber 100 and the light emitting element 102, and the cap member Even when the assembly work is performed with 2 fixed to the pre-mold case 20, the light emission intensity of the light emitting element 102 can be adjusted while monitoring the output through the optical fiber. Therefore, the semiconductor light emitting device 1 has a structure suitable for making the variation in the emission intensity uniform.

  Further, the semiconductor light emitting device 1 can eliminate all slight optical axis deviations, and all such deviations are eliminated after the assembly is completed, so that extremely high alignment accuracy is ensured. ing. In addition, since the engagement recesses 9 can be engaged with the respective engagement protrusions 24 and the peripheral wall portions 25 in a state where the corner regions 3c are placed on the respective engagement protrusions 24, the uneven portions are engaged. On the other hand, the position of the cap member 2 can be changed on the pre-molded case 20 so that the cap member 2 can be aligned with certainty.

  Further, the semiconductor light emitting device 1 adjusts the optical axis after the cap member 2 is temporarily positioned with respect to the premolded case 20 and detects the position where the output of the light emitting element 102 is maximized. The cap member 2 is completed only by fixing the cap member 2 to the pre-molded case 20 by welding (the assembly operation is completed). Therefore, the semiconductor light emitting device 1 can not only ensure high alignment accuracy, but also can perform assembly work efficiently.

  In the semiconductor light emitting device 1, since the fiber guide portion 4 has the reduced diameter portion 7, when the optical fiber 100 is inserted, the end portion 100 a comes into contact with the reduced diameter portion 7, and the optical fiber 100 It is possible to prevent the end face from contacting the bottom 8. Thereby, damage to the end face of the optical fiber 100 can be prevented.

  Moreover, since the fiber guide portion 4 has the bottom portion 8, foreign matter such as dust and dust does not enter from the outside through the fiber guide portion 4 into the inside where the element mounting portion 23 is disposed. Therefore, for example, when the semiconductor light emitting device 1 is mounted on an automobile, the usage environment of the semiconductor light emitting device 1 is outdoor, so that foreign matter entry and removal is more effective than when used indoors. can do.

  Furthermore, since the protrusion width h1 of the fitting portion 5 is formed larger than the protrusion width h2 of the engagement protrusion 24 (h1> h2), the semiconductor light emitting device 1 pre-caps the cap member 2 as described above. When placed on the mold case 20, the planar engagement surface 5 b can face the peripheral wall portion 25. Therefore, the semiconductor light emitting device 1 is difficult for foreign matters such as dust and dust to enter the space 10.

Second Embodiment Next, a semiconductor light emitting device 1 according to a second embodiment will be described with reference to FIGS. The semiconductor light emitting device 1 according to the second embodiment is different from the semiconductor light emitting device 1 according to the first embodiment in that it has a premold case 40 shown in FIG. 18 instead of the premold case 20. Yes. Compared to the premold case 20, the premold case 40 has adjustment leads 37a, 37b, 37c instead of the adjustment leads 27a, 27b, and internal leads 38a, 38b, 38c instead of the internal leads 28e, 28f. , 38d, 38e, and 38f, and a drive adjustment circuit 106 instead of the drive adjustment circuit 103, and the other points are the same.

  The adjustment leads 37a, 37b, and 37c are arranged in different locations from the external leads 22a, 22b, 22c, and 22d in the case body 21, and are respectively connected to the internal leads 38a, 38b, 38c, 38d, and 38e, 38f. One end and the other end are connected, and a portion between the one end and the other end projects to the outside of the case body 21.

  The drive adjustment circuit 106 has a circuit configuration as shown in FIG. The drive adjustment circuit 106 is different from the drive adjustment circuit 103 in that it does not have the adjustment unit 103b and the logic circuit unit 103c, and has resistance elements R19, 20, and 21 instead of the resistance elements R31 and R32. The other points are in agreement. A GND terminal (not shown) is connected to the internal leads 38a, 38c, and 38e, and input terminals Cont1, Cont2, and Cont3 are connected to the internal leads 38b, 38d, and 38f, respectively.

  Therefore, for example, when the adjustment lead 37a is cut so that the connection between the internal lead 38a and the internal lead 38b is cut, the wiring c is cut in FIG. Similarly, when the adjustment leads 37b and 37c are cut, the wires d and e are cut in FIG. 19, respectively. In this way, the drive adjustment circuit 106 removes the adjustment leads 37a, 37b, 37c, and the like, so that the voltage applied to the light emitting element 102 is changed from the input voltage Vcc to at least one of the resistance elements R19, R20, R21. It can be changed to a voltage drop. Therefore, the semiconductor light emitting device 1 according to the present embodiment also has a structure suitable for adjusting the light emission intensity and making the variation uniform, similarly to the semiconductor light emitting device 1 according to the first embodiment. Yes.

(Modification of pre-molded case and cap member)
20 to 24, the semiconductor light emitting device according to the present invention may be a semiconductor light emitting device 11 having a cap member 12 and a premolded case 30 instead of the cap member 1 and the premolded case 20 described above. it can. As shown in FIG. 21, the cap member 12 is different from the cap member 2 in that four engaging convex portions 39 are provided at corresponding positions of the engaging convex portions 24 instead of providing the fitting portions 5. It is different and other points are the same. Further, as shown in FIG. 22, the premold case 30 is different from the premold case 20 in that each engagement projection 24 has an engagement recess 41, and the other points are the same. .

  The engaging concave portion 41 and the engaging convex portion 39 are respectively a cylindrical hole portion and a thin rod-like protrusion, and are disposed at positions where the concave and convex portions can be fitted to each other. Further, as shown in FIG. 23, the inner diameter w1 and the depth h3 of the engaging concave portion 41 are larger than the diameter w2 and the height h4 of the engaging convex portion 39 (w1> w2, h3> h4), respectively.

  When the semiconductor light emitting device 11 having such a configuration is manufactured, the engaging convex portions 39 of the cap member 2 are fitted into the engaging concave portions 41 of the pre-molded case 30, and the engaging convex portions 24 are then fitted. The back surface 3b of the rectangular base 3 of the cap member 12 is placed. That is, when the back surface 3b is placed on each engaging convex portion 24 so that each engaging convex portion 39 and each engaging concave portion 41 are engaged with each other, the inner diameter w1 and the depth h3 of the engaging concave portion 41 are reduced. Since each of the engaging protrusions 39 is larger than the diameter w2 and height h4 (w1> w2, h3> h4), as shown in FIG. A space portion 29 is secured between the convex portion 39. By securing the space portion 29, the cap member 12 is held on the premold case 30 with the engagement concave portions 41 and the engagement convex portions 39 being engaged before the cap member 12 is fixed to the premold case 30. The position of the member 12 can be changed. Therefore, the semiconductor light emitting device 11 including the cap member 12 and the premolded case 30 is also in the same manner as described above after the cap member 12 is temporarily positioned on the premolded case 30 as in the semiconductor light emitting device 1. After adjusting the optical axis, the cap member 12 can be fixed to the pre-molded case 30 by laser welding, and the adjustment leads 27a and 27b can be cut if necessary. Therefore, the semiconductor light-emitting device 11 can ensure high alignment accuracy similarly to the semiconductor light-emitting device 1, can perform assembly work efficiently, and can adjust light emission intensity. In addition, the semiconductor light emitting device 11 has the same effects as the semiconductor light emitting device 1.

  Further, the semiconductor light emitting device according to the present invention is a semiconductor light emitting device 51 having a cap member 52 and a premolded case 60 instead of the cap member 2 and the premolded case 20 described above, as shown in FIGS. You can also. As shown in FIG. 27, the cap member 52 is different from the cap member 2 in that the fitting portion 5 is not formed on the back surface 3b side of the rectangular base portion 3, and the other points are the same. ing. In addition, as shown in FIG. 26, the pre-mold case 60 has a case body portion 21 having a peripheral wall portion 61 and a shelf portion 62 instead of the engaging convex portion 24 and the peripheral wall portion 25, as compared with the pre-mold case 20. This is different from the above point in that the element mounting portion 23 is formed in a rectangular shape somewhat larger than the outer shape of the rectangular base portion 3 of the cap member 52, and the other points are the same.

  The peripheral wall portion 61 is formed on the peripheral portion of the element mounting portion 23 with a uniform height that is greater than the height of the engaging convex portion 24. The shelf 62 has an L shape and is arranged at the four corners slightly above the middle in the height direction of the peripheral wall 61.

  In the premold case 60, the shelf portions 62 are arranged at the four corners, and the size of the element mounting portion 23 is somewhat larger than that of the rectangular base 3, so that the cap member 52 is placed on the four shelf portions 62. be able to. Therefore, the shelf 42 in the pre-molded case 60 has a function as a placement receiving portion, and the rectangular base 3 of the cap member 52 has a function as a placement portion.

  When manufacturing the semiconductor light emitting device 51 having such a configuration, the rectangular base 3 of the cap member 52 is placed on the four shelves 62 of the pre-molded case 60. Then, since the size of the element mounting portion 23 is somewhat larger than the rectangular base portion 3, the space portion 53 can be secured between the rectangular base portion 3 and the peripheral wall portion 61. Therefore, before the cap member 52 is fixed to the pre-mold case 60, the cap member 52 can be moved on the pre-mold case 60 using the space portion 53, and the position of the cap member 52 can be changed. Therefore, the semiconductor light emitting device 51 including the cap member 52 and the premolded case 60 is placed in the temporary positioning state on the premolded case 60 in the same manner as the semiconductor light emitting device 1, and the light is emitted in the same manner as described above. After adjusting the axis, the cap member 52 can be fixed to the pre-mold case 60 by laser welding, and the adjustment leads 27a and 27b can be cut if necessary. Therefore, the semiconductor light-emitting device 51 can ensure high alignment accuracy similarly to the semiconductor light-emitting device 1, can perform assembly work efficiently, and can adjust light emission intensity. In addition, the semiconductor light emitting device 51 has the same effects as the semiconductor light emitting device 1.

(Other variations)
The semiconductor light emitting device 11 has the engagement recess 41 and the engagement projection 39 in the premold case 30 and the cap member 12, respectively, but the arrangement of the engagement recess 41 and the engagement projection 39 is reversed, You may make it have a cap member and a premold case, respectively.

  The semiconductor light emitting devices 1, 11, 51 described above are constituted by the cap members 2, 12, 52 and the premolded cases 20, 40, 60, and the cap members 2, 12, 52 on the premolded cases 20, 40, 60 are arranged. Although the position adjustment can be performed, the semiconductor light emitting device according to the present invention may have a structure in which the position adjustment cannot be performed while the cap member is fixed on the premolded case.

  The drive adjustment circuit only needs to drive the light emitting element 102 described above and adjust the applied voltage, and the specific circuit configuration is not limited to the drive adjustment circuits 103 and 106 described above.

  In each of the semiconductor light emitting devices 1, 11, 51, the fiber guide portion 4 of the cap member is formed in a bottomed cylindrical shape, but the bottom portion is opened as shown in FIG. 24 instead of the fiber guide portion 4. The fiber guide portion 14 may be used. When this fiber guide portion 14 is provided, the end portion of the optical fiber inserted into the fiber guide portion 14 can be brought as close to the optical semiconductor element (light emitting element 102) as possible, and light between the optical fiber and the optical semiconductor element can be obtained. The coupling efficiency can be kept high. Further, when the fiber guide portion 14 that is opened is provided, the light from the optical fiber can reach the light emitting element 102 directly (without passing through the cap member). Alternatively, another resin that is not a light-transmitting resin may be used. Of course, a light transmissive resin may be used.

1 is a plan view showing a semiconductor light emitting device according to a first embodiment of the present invention. Similarly, it is a perspective view. Similarly, (A) is a front view and (B) is a right side view. It is the IV-IV sectional view taken on the line of FIG. It is the VV sectional view taken on the line of FIG. It is the perspective view seen from the back surface of the cap member which comprises the semiconductor light-emitting device concerning 1st Embodiment. Similarly, it is a plan view. Similarly, (A) is a right side view and (B) is a front view. It is the IX-IX sectional view taken on the line of FIG. It is the XX sectional view taken on the line of FIG. It is a perspective view of the premold case which constitutes the semiconductor light emitting device concerning a 1st embodiment. Similarly, it is a plan view. Similarly, (A) is a right side view and (B) is a front view. It is the XIV-XIV sectional view taken on the line of FIG. It is the XV-XV sectional view taken on the line of FIG. FIGS. 2A and 2B are perspective views showing a manufacturing process of the semiconductor light emitting device shown in FIG. 1, where FIG. 1A is a process of placing a cap member 2 on a pre-molded case, and FIG. 2B is an optical fiber inserted into the placed cap member 2. (C) is a step of laser welding, (D) is a semiconductor light emitting device in which the cap member 2 is fixed It is a circuit diagram of the drive adjustment circuit with which the semiconductor light-emitting device which concerns on 1st Embodiment was equipped. It is a top view which shows the premold case of the semiconductor light-emitting device concerning the 2nd Embodiment of this invention. It is a circuit diagram of the drive adjustment circuit with which the semiconductor light-emitting device which concerns on 2nd Embodiment was equipped. It is a top view of the semiconductor light-emitting device concerning a modification. Similarly, it is a top view of a cap member. Similarly, it is a top view of a premold case. Similarly, it is sectional drawing which expands and shows the part in which the uneven | corrugated fitting by the engagement convex part and engagement recessed part of a premold case is formed. It is sectional drawing which shows another cap member. (A) is the top view which shows the state which cut the adjustment lead in the semiconductor light-emitting device concerning 1st Embodiment, and (B) is the state which cut off the adjustment lead. It is a perspective view of the premold case which comprises the semiconductor light-emitting device which concerns on the modification of this invention. Similarly, it is a perspective view of the cap member which comprises a semiconductor light-emitting device. It is sectional drawing which cut | disconnected the semiconductor light-emitting device which concerns on the modification of this invention in the part corresponding to the XXVIII-XXVIII line of FIG. Similarly, it is sectional drawing cut | disconnected by the part corresponding to the XXIX-XXIX line | wire of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 11, 51 ... Semiconductor light-emitting device 2, 12, 52 ... Cap member 3 ... Rectangular base part, 4, 14 ... Fiber guide part 3c ... Corner | angular area | region, 8 ... Bottom part, 9, 27 ... Engagement recessed part 20, 30 , 40, 60... Premolded case 22a, 22b, 22c, 22d. External lead 27a, 27b. Adjustment lead 28a, 28b, 28c, 28d. Internal lead 28e, 28f. Internal lead 101 ... Lead frame, 102 ... Light emitting element 103, 106 ... Drive adjustment circuit

Claims (3)

A semiconductor light emitting device comprising a light emitting element and a drive circuit for driving the light emitting element, wherein a lead frame on which the light emitting element and the drive circuit are mounted is covered with a molded sealing resin,
One end is connected to the internal lead of the lead frame, the other end is connected to the internal lead or the external lead of the lead frame, and the gap between the one end and the other end is made of the sealing resin. It has an adjustment lead that protrudes to the outside,
A semiconductor light-emitting device configured to change a voltage applied to the light-emitting element by cutting or excising a portion of the adjustment lead that protrudes outside the sealing resin.   A resin case in which the light emitting element, the drive circuit, and the lead frame are covered with the molded sealing resin, and the external lead and the adjustment lead are provided on the outside; and the resin case The semiconductor light-emitting device according to claim 1, further comprising a cap member that can be placed on the resin case and whose position on the resin case can be changed. The cap member has a fiber guide part into which an optical fiber can be inserted,
The cap member is moved while being placed on the resin case, and after the optical axis adjustment is performed to make the optical axis of the fiber guide portion coincide with the optical axis of the light emitting element, the cap member is moved by laser welding. The semiconductor light emitting device according to claim 1, wherein the semiconductor light emitting device is fixed to the resin case.

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