JP2000174349A - Optical semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate testing and adjustment after an optical semiconductor package is hermetically sealed. SOLUTION: Test pad terminals 22 are formed on outer leads 18 arranged on the back of laminated ceramic 11, in such a manner that the terminals can be cut and isolated from the leads. The test pad terminals 22, which became unnecessary after test and adjustment are finished, are isolated by cutting bridging parts on trenches 20. With this constitution, the test and adjustment are facilitated after an optical semiconductor package 10 is hermetically sealed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor package and an optical transmission device, and more particularly to a semiconductor package and an optical transmission device capable of easily performing an external test and adjustment.

[0002]

2. Description of the Related Art In general, an optical semiconductor package is formed by sealing an optical semiconductor element such as a light emitting element and a light receiving element, a transmission IC, a reception IC, and the like on a surface of a laminated ceramic. These optical semiconductor elements, transmission ICs, reception ICs, chip resistors, chip capacitors, and the like are fixed to predetermined locations on the surface of the multilayer ceramic with solder or silver paste.

After each of these elements is mounted on the surface of the laminated ceramic, the ceramic package provided with the bonding wires is sealed with a metal shell having a light-transmitting window. Thereafter, an optical fiber connector section made of a molded resin or metal is attached, and the optical transmission apparatus has an external lead for connecting to the outside and an optical input / output section. An opening is formed in the optical fiber connector portion, and an optical fiber cable is connected to the opening so that the optical fiber cable can be guided to the optical semiconductor device.

[0004] The multilayer ceramic has a structure in which a plurality of ceramic layers are superimposed, and an optical semiconductor element, a transmission IC, a reception IC or the like provided therein by wiring each layer.
And the like and the external leads are connected.

[0005] The packaged optical semiconductor elements, transmission ICs and reception ICs, as well as external peripheral circuit elements and external leads are mounted on a printed circuit board (PCB) by soldering. In some cases, it may be an optical transmission device.

[0006]

In the optical transmission apparatus as described above, it is necessary to adjust the optical output level and the peak amount and timing of the peaking current for speeding up. Conventionally, for these adjustments, the bonding of the transmission / reception IC has been replaced, the jumper has been switched, and the resistance value of the chip resistor has been adjusted during package assembly. However, with such a method of adjustment, there is a problem that adjustment cannot be performed anymore when re-adjustment is required in a test after assembling the package.

Accordingly, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an optical semiconductor device and a semiconductor device for a peripheral circuit constituting a peripheral circuit thereof, even after sealing the semiconductor device. The purpose is to facilitate testing and adjustment.

[0008]

In order to solve the above problems, an optical semiconductor package according to the present invention is provided with a multilayer structure insulating member formed by applying wiring to each layer and a surface provided on the multilayer structure insulating member. A semiconductor element for a peripheral circuit provided on the surface of the multilayer structure insulating member and constituting a peripheral circuit of the optical semiconductor element; and the optical semiconductor element or An external lead electrically connected to the semiconductor element for the peripheral circuit via the wiring, wherein the external lead is provided with a test pad terminal, and the test pad terminal is separated from the external lead. It is characterized by being formed so that it is possible.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] In an optical semiconductor package according to a first embodiment of the present invention, a test pad terminal is formed on an external lead provided on the back surface of a laminated ceramic, and this test pad terminal is connected to an external device. Tests and adjustments can be easily performed from the outside even after the optical semiconductor device and the semiconductor device for its peripheral circuits are sealed, by making the lead detachable at the bridging portion that crosses the groove. It is.

FIG. 1 is a plan view showing the back surface of the optical semiconductor package according to the first embodiment of the present invention, FIG. 2 is a view showing a cross section taken along line AA in FIG. 1, and FIG. FIG. 2 is a diagram showing a cross section taken along line BB in FIG.

As shown in FIGS. 2 and 3, the optical semiconductor package 10 is ceramic packaged with a multilayer ceramic 11 having a multilayer structure. The laminated ceramic 11 forms a multilayered insulating member in the present embodiment.
Wiring 12 is provided on each layer in the multilayer structure, and the layers of the wiring 12 are connected by through holes 14 filled with a conductor.

On one surface or a plurality of surfaces exposed on the upper surface of the multilayer ceramic 11, a region for mounting an element and a region for wire bonding are formed. Further, a sealing portion 16 for stopping the sealing member is formed on the surface of the multilayer ceramic 11 so as to surround a region to be wire-bonded. In the present embodiment, the seal portion 16 is made of a ring-shaped metal or ceramic whose surface is metalized in a ring shape.

As shown in FIG. 1, an optical semiconductor package 1
0, the external leads 1
8 is fixed. A groove 20 is formed at the center of the multilayer ceramic 11 on the back surface of the optical semiconductor package. Of the external leads 18, the external leads 18
(3) to (6) are bridged over the groove 20 and extend to the opposite side. External lead 18
Test pad terminals 22 (1) to 22 (4) are formed on the opposite side of the groove 20 in (3) to 18 (6). As shown in FIG. 2, a plurality of wirings 12 may be electrically connected to one external lead 18 (4).
As shown in FIG. 3, one wiring 12 may be connected to one external lead 18 (6).

As shown in FIG. 2, in assembling the optical semiconductor package 10, optical semiconductor elements such as a light emitting element and a light receiving element, a transmission IC and The receiving IC is fixed with silver paste or solder. This fixed element or I
C is collectively shown as an IC element group 24. Also,
A chip resistor, a chip capacitor, and a chip coil are arranged at another predetermined position on the surface of the multilayer ceramic 11 where an element is to be mounted. The arranged chips are collectively shown as a chip group 26. These IC element group 24 and chip group 26 constitute a peripheral circuit of the optical semiconductor element.

Subsequently, predetermined wiring is performed by applying a bonding wire to a region where the multilayer ceramic 11 is to be bonded. As a result, necessary wiring is formed between the IC element group 24 and the chip group 26. After this bonding is completed, the shell 28 is placed on the seal portion 16.
Is fixed by welding or soldering to hermetically seal the area where the element is mounted or the area where the element is bonded. In the present embodiment, the material of the shell 28 is formed of metal, resin, ceramic, or the like. A light-transmissive window 30 is formed in the shell 28 at a position facing the optical axis of the optical semiconductor element. Through the translucent window 30, an optical signal is input and output between the optical fiber cable outside the optical semiconductor package 10 and the optical semiconductor element. By attaching the shell 28, the optical semiconductor package 10 is completed.

FIG. 4 is a cross-sectional view of the optical transmission device 40 in which the optical semiconductor package 10 is stored in a case.

As shown in FIG. 4, the optical semiconductor package 10 which has been hermetically sealed is provided with an optical fiber connector section 42.
After being stored in the storage recess 43, the lid 48 is attached. The optical fiber connector portion 42 has an opening 46 through which the optical fiber cable 44 passes and which guides the distal end side of the optical fiber cable 44 to the window 30 of the optical semiconductor package 10. When the optical fiber cable 44 is inserted into the opening 46, the optical fiber cable 44 into which the ferrule 49 is inserted is connected to the optical connector plug 4 made of resin.
7, the optical fiber cable 44 and the distal end of the ferrule 49 are inserted into the opening 46. The concave portion 42a formed in the optical fiber connector portion 42
And the projection 47a formed on the optical connector plug 47 are fitted to each other to assemble the optical transmission device 40,
The join is completed.

Next, a test process of the optical semiconductor package 10 will be described. Such an optical semiconductor package 10 generally includes (1) an LED (Light Emitting Diode).
aging of de) and laser diodes, etc. (2) IC
(3) It is necessary to test and adjust the output power and the light receiving sensitivity. FIG. 5 illustrates the external leads 18 and the internally mounted I
FIG. 4 is a diagram schematically illustrating a connection relationship between a C element group and a chip group.

(1) Aging of LED and Laser Diode Here, aging is a test for causing an LED or a laser diode or the like to operate under a high temperature condition for a certain period of time to make initial failures evident. For this reason, in aging, it is more efficient to flow a current directly to an LED or a laser diode. Therefore, in the present embodiment, the optical semiconductor package 10 is configured as shown in FIG.

That is, the cathode side of the LED 50 provided therein is connected to the test pad terminal 22 (3) of the external lead 18 (5), and the anode side of the LED 50 is connected to the test pad terminal 22 (3) of the external lead 18 (6). Connect to 4). When aging, the external leads 18
By flowing a current from (6) to the external lead 18 (5), the LED 50 is continuously driven. Therefore LED5
The current to 0 can be freely set without being limited by the transmission IC or the like. After aging,
Since the test pad terminals 22 (3) and 22 (4) become unnecessary, the bridging portions of the external leads 18 (5) and 18 (6) are cut. By cutting the bridging portion in this way, the unnecessary test pad terminals 22 (3), 22
(4) can be separated from the external leads 18 (5) and 18 (6).

(2) Testing of IC The IC can be tested by cutting the bridging portion of the external lead 18 or without cutting the bridging portion of the external lead 18. When an IC test is performed by cutting the bridging portion of the external lead 18, the test is performed using the test pad terminal 22 directly. When performing an IC test without cutting the bridging portion of the external lead 18, the test is performed using the external lead 18. As a result, a defect at the time of the bonding wire can be found at an early stage, and a defective portion of the IC can also be found in a limited manner.

(3) Test and Adjustment of Emission Power and Reception Sensitivity Conventionally, the test and adjustment of these emission power and reception sensitivity are
Adjusting the resistance value of the external circuit of the optical transmission device 40,
This has been done by adjusting the bonding wire setting of the IC provided inside. In this embodiment, the bonding wires of the IC provided inside are connected to the test pad terminals 22.
, And set so as to connect to a predetermined potential (GND or +5 V) from the external lead 18 while leaving a bonding wire necessary for adjustment. The bonding wire determined to be unnecessary at the time of adjustment cuts the bridging portion of the external lead 18.

For example, as shown in FIG. 5, as a result of testing the output power of the LED 50, the bonding wire W1
If it is determined that is unnecessary, the bridging portion of the external lead 18 (4) is cut. Thereby, the external leads 18
The current input from (4) to the IC becomes only to the bonding wire W3. That is, the bonding wire W1
Can be disconnected so that no current is input.

Further, if the test pad terminal 22 is connected to a chip resistor provided inside, and it is determined that the chip resistor is unnecessary at the time of adjustment, the bridging portion of the external lead may be cut off at that time. Good.

As described above, according to the optical semiconductor package 10 of the present embodiment, even after the optical semiconductor element or the like is hermetically sealed with the shell 28, it is possible to perform an external test and adjustment. The optical transmission device 40 with less variation in power sensitivity can be obtained. In addition, since peripheral circuits for adjustment are not required on an external printed circuit board (PCB), an extremely small optical transmission device 40 can be formed.

[Second Embodiment] A second embodiment of the present invention is a modification of the first embodiment described above, in which the test pad terminals are constituted by metallized pads provided on the back surface of the laminated ceramic, and one external pad is provided. A lead is provided with a plurality of bridging portions.

FIG. 6 is a plan view showing the back surface of the optical semiconductor package according to the second embodiment of the present invention, and FIG. 7 is a view showing a cross section taken along line CC in FIG.

As shown in FIG. 6, the optical semiconductor package 1
A plurality of external leads 18 are provided on the back surface of the “0”.
A groove 60 is formed in the center of the multilayer ceramic 11 on the back surface of the optical semiconductor package 10. This groove 60 is formed in an inverted L-shape. That is, the groove 6
0 has a horizontal groove 62 and a vertical groove 64 and is formed in a bent shape.

Out of the plurality of external leads 18, the external leads 18 (3) and 18 (5) are bridged over the horizontal groove 62 and extend to the opposite side of the horizontal groove 62. The horizontal grooves 62 in these external leads 18 (3) and 18 (5)
Are opposite to the test pad terminals 66 (1) and 66 (2).
Are formed. Further, the external lead 18 (3) is bridged from the test pad terminal 66 (1) on the vertical groove 64 and extends to the opposite side of the vertical groove 64. A test pad terminal 66 (3) is formed at a position opposite to the vertical groove 64. Therefore, a plurality of bridging portions are formed in the external lead 18 (3), and a plurality of test pad terminals 66 (1) and 66 (3) are provided. A metallized pad 68 is provided at a position on the opposite side of the external lead 18 (4) across the horizontal groove 62. As shown in FIG.
8 is connected to necessary terminals of the IC group 24 and the chip group 26.

At the time of aging or IC test, the test is performed by applying a socket terminal of a test device to the external lead 18 or the like. The test and adjustment of the output power and the light receiving sensitivity are performed by the necessary metallization pads 68 and external leads 18.
Test and adjust by connecting jumper wires to

Except for the above points, the optical semiconductor package 10 according to the second embodiment has the same configuration as that of the first embodiment, and a detailed description thereof will be omitted.

As described above, also in the optical semiconductor package according to the present embodiment, the same functions and effects as those of the first embodiment can be obtained. That is, even after the optical semiconductor element or the like is hermetically sealed by the shell 28, the test and adjustment can be performed from the outside, and the optical transmission device 40 (see FIG. 4) with less variation in power sensitivity can be obtained. it can. In addition, the peripheral circuit for adjustment is not required on the external printed circuit board (PCB).
0 can be formed.

Moreover, as shown in FIG. 6, since a plurality of bridging portions are provided on one external lead 18 (4), a plurality of test pad terminals 66 (1) and 66 (3) can be formed. Then, by cutting one of the bridging portions by reflecting the test results of the output power and the light receiving sensitivity, more complicated settings can be made.

[0034]

As described above, according to the optical semiconductor package of the present invention, the test pad terminal is provided on the external lead, and the test pad terminal is configured to be separable from the external lead. Tests and adjustments can be easily performed even after the semiconductor element is hermetically sealed.

[Brief description of the drawings]

FIG. 1 is a plan view showing a back surface of an optical semiconductor package according to a first embodiment of the present invention.

FIG. 2 is a view showing a cross section taken along line AA in FIG. 1;

FIG. 3 is a view showing a cross section taken along line BB in FIG. 1;

FIG. 4 illustrates a case where the optical semiconductor package according to the first embodiment of the present invention is housed in a case to form an optical transmission device.
FIG. 3 is a diagram illustrating a cross section of an optical transmission device.

FIG. 5 is a diagram schematically showing a connection relationship between an external lead and an internal element for explaining a test process.

FIG. 6 is a plan view showing the back surface of the optical semiconductor package according to the second embodiment of the present invention.

FIG. 7 is a view showing a cross section taken along line CC in FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Optical semiconductor package 11 Multilayer ceramic 12 Wiring 14 Through hole 16 Seal part 18 External lead 20 Groove 22 Test pad terminal 24 IC element group 26 Chip group 28 Shell 30 Window 40 Optical transmission device 42 Optical fiber connector part 43 Storage concave part 44 Optical fiber Cable 46 Opening 48 Cover 50 LED

Claims (5)

[Claims] An optical semiconductor element provided on a surface of the multilayer structure insulating member; an optical semiconductor element provided on a surface of the multilayer structure insulating member; A peripheral circuit semiconductor element constituting a peripheral circuit of the element; and an external lead provided on the back surface of the multilayer structure insulating member and electrically connected to the optical semiconductor element or the peripheral circuit semiconductor element via the wiring. And a test pad terminal is provided on the external lead, and the test pad terminal is formed to be separable from the external lead. 2. A groove is formed on a back surface of the multilayer structure insulating member, and the external lead is formed so as to bridge over the groove, and the external lead positioned on the groove is cut to form the external lead. The optical semiconductor package according to claim 1, wherein the test pad terminal can be separated from a lead. 3. The optical semiconductor package according to claim 2, wherein said external lead is formed so as to cross over said groove a plurality of times. 4. A multi-layer structure insulating member provided on a back surface thereof,
The optical semiconductor package according to claim 1, further comprising a metallized pad electrically connected to the optical semiconductor element or the semiconductor element for a peripheral circuit. 5. An optical semiconductor package according to claim 1, further comprising: a storage recess for storing the optical semiconductor package;
A state in which an opening for guiding an optical fiber cable to the optical semiconductor element provided in the optical semiconductor package stored in the storage recess is formed, and an optical fiber connector portion; and the optical semiconductor package stored therein An optical transmission device, comprising: a lid for covering the storage unit.