JPS61255061A - 光電変換装置用配線基板の製造方法 - Google Patents

光電変換装置用配線基板の製造方法

Info

Publication number
JPS61255061A
JPS61255061A JP60096959A JP9695985A JPS61255061A JP S61255061 A JPS61255061 A JP S61255061A JP 60096959 A JP60096959 A JP 60096959A JP 9695985 A JP9695985 A JP 9695985A JP S61255061 A JPS61255061 A JP S61255061A
Authority
JP
Japan
Prior art keywords
film
gold
wiring
layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60096959A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0374510B2 (enrdf_load_stackoverflow
Inventor
Senhiko Yamada
山田　千彦
Hitoshi Fujino
仁 藤野
Makoto Arisawa
誠 有沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP60096959A priority Critical patent/JPS61255061A/ja
Publication of JPS61255061A publication Critical patent/JPS61255061A/ja
Publication of JPH0374510B2 publication Critical patent/JPH0374510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/191—Photoconductor image sensors

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP60096959A 1985-05-08 1985-05-08 光電変換装置用配線基板の製造方法 Granted JPS61255061A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60096959A JPS61255061A (ja) 1985-05-08 1985-05-08 光電変換装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60096959A JPS61255061A (ja) 1985-05-08 1985-05-08 光電変換装置用配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61255061A true JPS61255061A (ja) 1986-11-12
JPH0374510B2 JPH0374510B2 (enrdf_load_stackoverflow) 1991-11-27

Family

ID=14178795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60096959A Granted JPS61255061A (ja) 1985-05-08 1985-05-08 光電変換装置用配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61255061A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156250A (ja) * 2015-04-02 2015-08-27 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156250A (ja) * 2015-04-02 2015-08-27 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法

Also Published As

Publication number Publication date
JPH0374510B2 (enrdf_load_stackoverflow) 1991-11-27

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