JPS61255043A - Electronic part device - Google Patents
Electronic part deviceInfo
- Publication number
- JPS61255043A JPS61255043A JP9636585A JP9636585A JPS61255043A JP S61255043 A JPS61255043 A JP S61255043A JP 9636585 A JP9636585 A JP 9636585A JP 9636585 A JP9636585 A JP 9636585A JP S61255043 A JPS61255043 A JP S61255043A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead frame
- electronic
- parts
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品装置に係シ、特に電子部品をリードフ
レームに装着してなる電子部品装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to electronic component devices, and particularly to an electronic component device in which electronic components are mounted on a lead frame.
従来、この種の電子部品装置は第３図に示すごとく構成
されている。第３図（８）は従来の電子部品装置の平面
図であり、の）は同断面図でめる。Conventionally, this type of electronic component device has been constructed as shown in FIG. FIG. 3(8) is a plan view of a conventional electronic component device, and FIG. 3(8) is a sectional view of the same.
第３図囚、（Ｂ）において、１は電子部品であシ、例え
ば半導体チッグ、抵抗体、コンデンサ等である。２は接
着剤で、例えば熱硬化性ペーストが用いられる。３はリ
ードフレームの電子部品装着部（以下、装着部と呼ぶ）
である。この種の電子部品装置では装着部３上の適所に
、接着剤２が注射器等によって適量塗布され、その上に
電子部品１がコレ、ト等によシ上方より押し付けて取シ
付けられていた。In FIG. 3(B), 1 is an electronic component, such as a semiconductor chip, a resistor, a capacitor, etc. 2 is an adhesive, for example, a thermosetting paste is used. 3 is the electronic component mounting part of the lead frame (hereinafter referred to as the mounting part)
It is. In this type of electronic component device, an appropriate amount of adhesive 2 is applied with a syringe or the like to a suitable place on the mounting portion 3, and the electronic component 1 is mounted on top of the adhesive by pressing it from above with a hand or a tool. .
しかしながら、上記従来の電子部品装置においては、電
子部品１と装着部３とは互いに位置を合わせる為の構造
を持っておらず、手作業による電子部品の装着工程では
位置合わせ全目視で行っておシ、その位置合わせの精度
は非常に低いものであった。さらに電子部品１と装着部
３の位置を、機械的及び光学的な手段によシ検出し、位
置合わせする装置を用いても、通常±０．１關程度０誤
差が有シ、またこのような装置は極めて高価なものであ
り、低コストでの量産化には不向きであった。However, in the conventional electronic component device described above, the electronic component 1 and the mounting section 3 do not have a structure for aligning each other, and the manual mounting process of electronic components is performed by fully visual inspection. However, the accuracy of the alignment was very low. Furthermore, even if a device is used to detect and align the positions of the electronic component 1 and the mounting portion 3 by mechanical and optical means, there is usually a zero error of approximately ±0.1 degrees. Such equipment was extremely expensive and unsuitable for low-cost mass production.
上記の問題点は、電子部品ヲリードフレームに装着して
なる電子部品装置において、前記リードフレームの前記
電子部品装着部が凹部となっている事を特徴とする本発
明の電子部品装置によって解決される。The above problems are solved by the electronic component device of the present invention, in which the electronic component is mounted on a lead frame, wherein the electronic component mounting portion of the lead frame is a recess. Ru.
以下、本発明の実施例を図面を用いて詳細に説明する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図は本発明の電子部品装置の１実施例であシ、体）
は平面図、（Ｂ）は断面図を示す。Figure 1 shows one embodiment of the electronic component device of the present invention.
shows a plan view, and (B) shows a cross-sectional view.
第１図（４）、ノ）において、１は電子部品であシ、例
えば半導体チ、ｆ、抵抗体、コンデンサ等である。２は
接着剤で、例えば熱硬化性ペーストが用いられる。３は
リードフレームの電子部品装着部（以下、装着部と呼ぶ
）であシ、電子部品１の装着部分面５に対応して凹部４
の底面６が形成されている。装着部３の凹部４の底面６
゛の適所に、接着剤２が注射器等によって適量塗布され
、その上に電子部品１がコレット等によシ上方よシ押し
付けられ、凹部４の底面６に取シ付けられる。電子部品
１の固定される位置は、凹部４によシ確定されるため、
位置精度の極めて良い成子部晶鉄［を提供する事ができ
る。In FIG. 1 (4), (-), 1 is an electronic component, such as a semiconductor chip, f, a resistor, a capacitor, etc. 2 is an adhesive, for example, a thermosetting paste is used. Reference numeral 3 denotes an electronic component mounting portion (hereinafter referred to as the mounting portion) of the lead frame, and a recess 4 corresponds to the mounting portion surface 5 of the electronic component 1.
A bottom surface 6 is formed. Bottom surface 6 of recess 4 of attachment part 3
An appropriate amount of adhesive 2 is applied to the appropriate place using a syringe or the like, and the electronic component 1 is pressed upwardly onto the adhesive using a collet or the like and attached to the bottom surface 6 of the recess 4. Since the position where the electronic component 1 is fixed is determined by the recess 4,
We can provide Narikobe crystal iron with extremely high positional accuracy.
又、第２図（８）、（Ｂ）に示すように凹部にチー・９
−を持たせると、電子部品１を装着する時に非常に装着
し易く、位置精度も電子部品１がチー・ザーを伝わりて
凹部４の底面６に固定されるので極めて良いものとなる
。凹部４の加工はプレス式の型成形等によりて行なわれ
、その加工精度は±０．０５鵡以下の誤差とする事がで
きる。又、この方法によれば、何枚でも同一に加工する
事ができる。Also, as shown in Fig. 2 (8) and (B), there is a chi 9 in the recess.
If the electronic component 1 is provided with -, it will be very easy to mount the electronic component 1, and the positional accuracy will be extremely good as the electronic component 1 will be fixed to the bottom surface 6 of the recess 4 through the teaser. The recess 4 is processed by press molding or the like, and the processing accuracy can be within ±0.05 mm. Moreover, according to this method, any number of sheets can be processed in the same way.
以上、詳細に説明したように本発明の電子部品装置によ
れば、電子部品とリードフレームとの位置合わせを容易
かつ正確に、且つ安価で、簡易な製造工程でおこなうこ
とができる。As described above in detail, according to the electronic component device of the present invention, it is possible to easily and accurately align the electronic component and the lead frame through a simple manufacturing process at low cost.
第１図は本発明の電子部品装置の１実施例であシ、（４
）は平面図、■）は断面図である。
第２図は本発明の電子部品装置の他の実施例であシ、（
４）は平面図、（Ｂ）は断面図である。
第３図は従来の電子部品装置であや、（４）は平面図、
■）は断面図である。
１・・・電子部品、２・・・接着剤、３・・・リードフ
レームの電子部品装着部、４・・・凹部、５・・・電子
部品の装着部分面、６・・・凹部の底面。FIG. 1 shows one embodiment of the electronic component device of the present invention.
) is a plan view, and ■) is a cross-sectional view. FIG. 2 shows another embodiment of the electronic component device of the present invention.
4) is a plan view, and (B) is a sectional view. Figure 3 shows a conventional electronic component device; (4) is a plan view;
■) is a cross-sectional view. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Adhesive, 3... Electronic component mounting part of lead frame, 4... Recessed part, 5... Electronic component mounting part surface, 6... Bottom surface of recessed part .
Claims (1)
において、前記リードフレームの前記電子部品装着部が
凹部となっている事を特徴とする電子部品装置。An electronic component device comprising an electronic component mounted on a lead frame, wherein the electronic component mounting portion of the lead frame is a recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9636585A JPS61255043A (en) | 1985-05-07 | 1985-05-07 | Electronic part device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9636585A JPS61255043A (en) | 1985-05-07 | 1985-05-07 | Electronic part device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61255043A true JPS61255043A (en) | 1986-11-12 |
Family
ID=14162951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9636585A Pending JPS61255043A (en) | 1985-05-07 | 1985-05-07 | Electronic part device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61255043A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5635756A (en) * | 1990-04-06 | 1997-06-03 | Hitachi, Ltd. | Semiconductor device, lead frame therefor and memory card to provide a thin structure |
| JP2006032775A (en) * | 2004-07-20 | 2006-02-02 | Denso Corp | Electronic device |
-
1985
- 1985-05-07 JP JP9636585A patent/JPS61255043A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5635756A (en) * | 1990-04-06 | 1997-06-03 | Hitachi, Ltd. | Semiconductor device, lead frame therefor and memory card to provide a thin structure |
| JP2006032775A (en) * | 2004-07-20 | 2006-02-02 | Denso Corp | Electronic device |
| JP4590961B2 (en) * | 2004-07-20 | 2010-12-01 | 株式会社デンソー | Electronic equipment |
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