JPS6125247Y2 - - Google Patents

Info

Publication number
JPS6125247Y2
JPS6125247Y2 JP1980119230U JP11923080U JPS6125247Y2 JP S6125247 Y2 JPS6125247 Y2 JP S6125247Y2 JP 1980119230 U JP1980119230 U JP 1980119230U JP 11923080 U JP11923080 U JP 11923080U JP S6125247 Y2 JPS6125247 Y2 JP S6125247Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
foil
semiconductor device
mount plate
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980119230U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5741655U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980119230U priority Critical patent/JPS6125247Y2/ja
Publication of JPS5741655U publication Critical patent/JPS5741655U/ja
Application granted granted Critical
Publication of JPS6125247Y2 publication Critical patent/JPS6125247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1980119230U 1980-08-21 1980-08-21 Expired JPS6125247Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980119230U JPS6125247Y2 (cs) 1980-08-21 1980-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980119230U JPS6125247Y2 (cs) 1980-08-21 1980-08-21

Publications (2)

Publication Number Publication Date
JPS5741655U JPS5741655U (cs) 1982-03-06
JPS6125247Y2 true JPS6125247Y2 (cs) 1986-07-29

Family

ID=29479879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980119230U Expired JPS6125247Y2 (cs) 1980-08-21 1980-08-21

Country Status (1)

Country Link
JP (1) JPS6125247Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2589358B2 (ja) * 1988-12-12 1997-03-12 日立電線株式会社 両面実装型ｔａｂ用テープキャリア

Also Published As

Publication number Publication date
JPS5741655U (cs) 1982-03-06

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