JPS6125237B2 - - Google Patents

Info

Publication number
JPS6125237B2
JPS6125237B2 JP54114494A JP11449479A JPS6125237B2 JP S6125237 B2 JPS6125237 B2 JP S6125237B2 JP 54114494 A JP54114494 A JP 54114494A JP 11449479 A JP11449479 A JP 11449479A JP S6125237 B2 JPS6125237 B2 JP S6125237B2
Authority
JP
Japan
Prior art keywords
chip
adhesive
printed circuit
magazine
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54114494A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5638890A (en
Inventor
Tatsuaki Watanabe
Tsutomu Koino
Naoshige Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11449479A priority Critical patent/JPS5638890A/ja
Publication of JPS5638890A publication Critical patent/JPS5638890A/ja
Publication of JPS6125237B2 publication Critical patent/JPS6125237B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP11449479A 1979-09-06 1979-09-06 Device for mouning chip part Granted JPS5638890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11449479A JPS5638890A (en) 1979-09-06 1979-09-06 Device for mouning chip part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11449479A JPS5638890A (en) 1979-09-06 1979-09-06 Device for mouning chip part

Publications (2)

Publication Number Publication Date
JPS5638890A JPS5638890A (en) 1981-04-14
JPS6125237B2 true JPS6125237B2 (enrdf_load_stackoverflow) 1986-06-14

Family

ID=14639156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11449479A Granted JPS5638890A (en) 1979-09-06 1979-09-06 Device for mouning chip part

Country Status (1)

Country Link
JP (1) JPS5638890A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012189465A (ja) * 2011-03-11 2012-10-04 Hitachi High-Technologies Corp 自動分析装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666095A (en) * 1979-10-31 1981-06-04 Matsushita Electric Ind Co Ltd Part mounting device
JPS59132700U (ja) * 1983-02-25 1984-09-05 シ−ケ−デイ株式会社 チツプ部品の供給装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012189465A (ja) * 2011-03-11 2012-10-04 Hitachi High-Technologies Corp 自動分析装置

Also Published As

Publication number Publication date
JPS5638890A (en) 1981-04-14

Similar Documents

Publication Publication Date Title
EP0071303B1 (en) Method of and device for positioning electrical and or electronic components on a substrate
US4386464A (en) Method and apparatus for mounting electronic components in position on circuit boards
DE2834836A1 (de) Vorrichtung zum aufbringen elektronischer bauelemente auf einen hybrid- leitertraeger
CA1128674A (en) Method of mounting electronic components
US4345371A (en) Method and apparatus for manufacturing hybrid integrated circuits
GB2076703A (en) Apparatus for mounting a chip-type electronic component on a substrate
DE1064127B (de) Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen
JP2000068687A (ja) チップ部品のマウント装置
JPS6125237B2 (enrdf_load_stackoverflow)
DE4447701C2 (de) Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen
DE3805841A1 (de) Verfahren zum bestuecken von bauelementetraegern mit bauelementen in oberflaechenmontagetechnik
JPS622785Y2 (enrdf_load_stackoverflow)
JPH0682953B2 (ja) 混成集積回路の製造方法
JP3296661B2 (ja) 部品供給装置
JPS63114B2 (enrdf_load_stackoverflow)
JPH05152782A (ja) 電子部品装着装置
RU2082291C1 (ru) Устройство для монтажа электронных компонентов на печатной плате
JPS5856277B2 (ja) 電子部品装着方法
JPH0543595U (ja) ラジアルリード形テーピング電子部品
JPS6024100A (ja) 電子部品実装装置
CA1171975A (en) Process and apparatus for assembling electric microcomponents on printed circuit boards
DE4433378C2 (de) Verfahren zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen
JP3612749B2 (ja) Ｔａｂ式半導体装置の中間構体の樹脂塗布装置
JPH0428286A (ja) 電子部品のプリント基板への取付方法および電子部品装置
DE112022007092T5 (de) Verbindungsarbeitmaschine