JPS61251195A - Resin sealed printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a resin-sealed printed board in which the periphery of a printed board housed in a case is sealed with an insulating resin.

[Prior art and its problems]

Generally, as shown in FIG. 3, an electric circuit is used by attaching an electric component 2 to a printed board 1 which has already been basically wired to complete the wiring, and storing it in a case 3 to protect it. However, electrical components used in electrical circuits are generally becoming smaller and have higher performance and higher functionality, and as a result, the distance between bare live parts such as terminals and lead wires has become smaller, and the distance between each component has become smaller. The disadvantage is that the insulation distance of bare live parts is insufficient.

Therefore, in order to increase reliability, conventionally, as shown in FIG. 3, after a printed board 1 with electrical components 2 attached is housed in a case 3, an insulating resin 4 in a fluid state is poured in with a nozzle 5.
This resin 4 is solidified to insulate each electrical component.

In this way, it is resistant to moisture and can prevent damage caused by photographing the device. However, if resin is poured from above the printed board 1 as in the past, air and gas between the printed board 1 and the bottom of the case 3 will escape at the bottom of the printed board 1 due to the resin flowing from the surroundings. It is difficult to form air bubbles and stays under the printed board 1. For this reason, the entire printed board with electrical components attached is sealed with resin, but for example, the bare part where the lead wire of the electrical component passes through the printed board and is soldered to the printed wiring from the back side. remains in the bubble, and if similar lead wires of electrical parts in contact with 1111 are trapped in the same bubble, there is no insulation between the bacterial strain parts and there is no sealing effect.

[Purpose of the invention]

The present invention provides a highly reliable resin-sealed printed board in which each electrical component is completely sealed by sufficiently removing air and gas around the printed board when resin is injected into a case housing the printed board. With the goal.

[Key points of the invention]

The present invention provides a resin-sealed printed board in which electrical parts are attached and housed in a case, and an insulating resin is injected. When injecting resin moxibustion, the injection port of the nozzle is pressed against this resin injection hole, and the resin in a fluid state is first guided to the bottom of the printed board, and then air and The idea is to inject the gas while expelling it.

[Funny example of invention]

An embodiment of the present invention will be described in detail based on FIGS. 1 and 2. In Fig. 1, electrical components 2 are attached to a printed board 1 which is basically wired, as in the conventional one, but unlike the conventional one, this printed board 1 has mounting holes 1.
A and a resin injection hole 1b are provided in the center of the printed board 1.The case 3 is provided with a protrusion 3a having a height d□ that separates the printed board 1 from the bottom of the case 3. A blind hole 3b matching the hole 1a is provided. Furthermore, a fixing pin 6 is provided which is press-fitted into the blind hole 3b.

The printed board 1 is housed in a case 3, and the fixing pin 6 is passed through the hole 1a, and then press-fitted into the blind hole 3b- to be fixed. A printing machine 1 is fixed to a case 3 and fat 4 is injected. Then, the resin 4 gradually flows outward from approximately the center of the printed board 1 and the bottom of the case 3 without expelling air or gas.
Finally, the cabinets of printing machine 1 and case 3 are filled. At this time, since the printed board 1 is fixed to the case 3, it will not float up. The resin 4 further reaches the top of the printed board 1,
Finally, the part shown by the broken line is injected and solidified ~ [Effects of the Invention] According to the present invention, the printed board is fixed at a fixed position in the case, and the insulating resin is poured into the resin injection hole provided in the printed board. It is injected to expel air and gas from under the printed circuit board. Therefore, the printed board is sealed without leaving any air bubbles in the proper position, and the bare live parts of the electrical components attached to the printed board are completely covered with resin, providing a resin-sealed printed board that is sufficiently reliable in terms of insulation. be able to.

[Brief explanation of the drawing]

Figures g1 and 8g2 show an embodiment of the resin-sealed printed board according to the present invention, and Figure 1 is an exploded perspective view before sealing. 2
The figure is a cross-sectional view showing the state of resin injection, and Figures 3 and 4 show conventional examples of resin-sealed printed boards. Figure s3 is an exploded perspective view before sealing, and Figure 4 is a sectional view showing the state of resin injection. 1...Printed board, lb...resin injection hole, 2...
Electrical Department, a J,, lIW
l/e2;i. Figure 1

Claims (1)

[Claims] 1) In a resin-sealed printed board in which electrical components are attached and housed in a case and insulating resin is injected, the printed board has a resin press-fit hole, and when resin is injected, the resin is poured from the bottom of the case through the resin injection hole. A resin-sealed printed board characterized in that the resin-sealed printed board is sequentially injected from the bottom of the case.