JPS61251194A - Resin sealed printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a resin-sealed printed board in which the periphery of a printed board housed in a case is sealed with an insulating resin.

[Prior art and its problems]

As shown in FIG. 3, an electronic circuit is generally arranged by attaching electrical components 2 to a printed circuit board 1 on which basic wiring has already been done, and then storing it in a case 3 for protection.

By the way, electrical components used in electronic circuits are generally becoming smaller and more sophisticated, and as a result, the distance between bare live parts such as terminals and lead wires has become smaller, and the bare parts of each component have become smaller. There is a drawback that the insulation distance between the optical and electrical parts is insufficient.

Therefore, in order to increase reliability, conventionally, as shown in FIG. 4, after a printed board 1 with electrical components 2 attached is housed in a case 3, insulating resin 4 in a fluid state is poured through a nozzle 5. Let it solidify.

Insulate between each electrical component 2. This makes it resistant to moisture and prevents damage caused by equipment movement. However, when pouring the resin, the resin injected under the printed board causes the printed board to float in the direction of the arrow P.

Therefore, there is a drawback that the position of the printed board rises to the top of the case or is inclined, reducing the effect of resin injection. Therefore, the resin must be injected while holding down the printed board, which has the drawback of poor workability and high cost.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin-sealed printed board having a structure in which the printed board does not float when resin is injected into a case housing the printed board.

[Key points of the invention]

The present invention provides a resin-sealed printed board in which electrical parts are attached and housed in a case and sealed with an insulating resin, in which the printed board is provided with a fixing pin that passes through a hole in the printed board and is press-fitted into a blind hole in the case. The idea is to fix the printed board to the case to prevent the printed board from floating up when resin is injected.

[Embodiments of the invention]

An embodiment of the present invention will be explained in detail based on FIGS. However, unlike the conventional one, this printed board has hole 1a.
The case 3 is also provided with a protrusion 3a having a height dl that separates the printed circuit board 1 from the bottom of the case 3, and a blind hole 3b corresponding to the protrusion 3aK hole 1a is provided. Also, the diameter d2 of the blind hole 3b at the tip is slightly thinner.

A fixed bottle 6 whose body is slightly thicker than the diameter d2 is prepared. After the printed board 1 is stored in the case 3,
The fixing pin 6 is passed through the hole 18, and the pin 6 is press-fitted into the blind hole 3b&c to be fixed.

If the fixed bottle 6 is thin, use the collar 7 to adjust the diameter. After fixing the printed circuit board 1 to the case 3 in this way, as shown in FIG. A bamboo that insulates between bare live parts or between bare live parts even if they are the same electrical component. In this way, the printed board is resin-sealed to the case at a predetermined height.

〔Effect of the invention〕

As described above, according to the present invention, a hole is provided in the printed board, and when the printed board is housed in the case, a fixing bottle passing through the hole in the printed board is press-fitted into the blind hole of the protrusion provided in the case. Since the resin-sealed printed board is fixed in place, the printed board does not float up when the resin is injected, and is sealed in a predetermined position, allowing the resin-sealed printed board to fully exhibit its effects.

[Brief explanation of drawings]

Figures 1 and 2 show an embodiment of the resin-sealed printed board according to the present invention, and Figure 1 is an exploded perspective view before resin injection, and Figure 2 is an exploded perspective view before resin injection.
The figure is a sectional view showing the state of resin injection, Figures 3 and 4 show conventional examples of resin-sealed printed circuit boards, Figure 3 is an exploded perspective view before resin injection, and Figure 4 is the state of resin injection. FIG. 1... Printed board, 1a... Hole in printed board, 2.
...Electrical parts, 3...Case, 3a...Blind hole in the case. 4...Resin, 6...Fixed bottle. m1 figure 2

Claims (1)

[Claims] 1) In a resin-sealed printed board in which electrical parts are attached, housed in a case, and sealed with an insulating resin, the printed board is press-fitted into a blind hole provided in the case with a fixing pin passing through a hole in the printed board. A resin-sealed printed board characterized by being fixed in place.