JPS61248294A - Magnetic bubble memory device - Google Patents

Abstract

PURPOSE:To make the titled device thin and small by forming a positioning setting part for positioning a magnetic bubble memory chip on the inside of a rotating magnetic field confining case. CONSTITUTION:A board assembling body BND is stored in a case RFS, a polyimide film 36 is adhered to the bottom of an outer case RFSa as an electric insulating sheet and the board assembling body BND and a magnetic circuit PFC are arranged on the film 36 and its peripheral edge part respectively. Then, an epoxy bonding agent is applied to the upper surface of the board assembling body BND and an inner case RFSb is inserted into the upper part of the board assembling body BND. Since a drawing part 37 positions a chip CHI, the chip CHI is set up on a specific position about the magnetic circuit PFC and the magnet body BIM.

Description

[Detailed description of the invention] [Field of invention] The present invention is a magnetic breadboard memory that can be made directly and thinly.

The present invention relates to a magnetic bubble memory device suitable for miniaturization, reduction in power consumption, and improvement in ease of assembly.

[96-inch back type] Magnetic bubble memory devices, which have been put into practical use in recent years, have a rectangular shape with an asymmetrical structure on a single-shaped wiring board made of ceramic or synthetic resin, on which a magnetic bubble memory chip is mounted. An X coil for generating a rotating magnetic field consisting of a solenoid coil.

It has a structure in which Y coils are inserted and arranged orthogonally. Since the X coil and l'=r coil are made of not only a magnetic ball memory chip, but also a wiring board that is much larger than the tick, the length from the end of each coil to the end is short.

Drive voltage and power consumption will increase. In addition, since the X coil and Ys coil require a uniform inductor balance in order to provide a uniform and stable in-plane rotating magnetic field to the magnetic bubble memory element, the coil shapes are different from each other and have an asymmetrical structure, which is advantageous. It had to be a structure. Furthermore, a pair of permanent magnet plates that apply a perpendicular bias magnetic field to the magnetic bubble memory element and its f magnetic plate are arranged on the outer surfaces of these X coils and Y coils, and their peripheral portions are covered with resin molding. Because of this structure, the stacking thickness in the vertical direction increases, which is an obstacle to the efforts to make memory devices thinner and smaller.

A prior art that is close to the present invention proposed by the present applicant is JP-A-54-55129. This publication describes the amount surrounding the chip! The construction of ffi cores and a magnetic field reflection box that completely surrounds them is described. However, no further concrete lectures have been presented.1
For example, it is theoretically impossible to make electrical connections to a chip that is completely surrounded by a conductor case from outside the conductor case without shortening it, such as permanent magnets, wafer plates, etc. Including the fact that I don't know how to install bias coils, etc., I decided to make it a joke without mentioning it! This is clearly insufficient.

[Object of the Invention] An object of the present invention is to provide a buggy memo VtC that can be made thinner and smaller in size.

[Summary of the invention]

In the present invention, magnetic bubble memory chips mounted on a wiring board and electrically connected thereto are wound on two pairs of opposing sides, f! 8 is placed in a position surrounded by a rectangular ring-shaped core, and the magnetic bubble memory chip, chip, and core are covered with a rotating magnetic field confinement case. The present invention is characterized in that five positioning setting portions for positioning the magnetic bubble memory chip are provided on the inner surface of the rotating magnetic field confinement case.

[Embodiments of the invention]

Next figure Ii! An embodiment of the original example will be explained using I'ft.

FIG. 1 and FIGS. 2A and 2B are diagrams for explaining an embodiment 7gt of a magnetic bubble memory device that is the object of the present invention, FIG. 1 is a partially cutaway oblique view, and FIG. 2A is a Fig. 2B is a 2B-2E cross-sectional view of @2Gang A. In these figures, CHI is a magnetic bubble memory chip 1 (hereinafter referred to as chip), and in these figures only one tick CHI is omitted, but in this example two are placed side by side. (The chip yield is better with a chip structure that divides the total memory capacity into a number of values than with one large-capacity tray chip.) The ppc is equipped with two chips CHI and It is a seven-sided cable wiring board (hereinafter referred to as the board) that has extensions at the four corners for connecting ICHI and external connection terminals.

COI is a chip CHIf of 2111, and drive coils (hereinafter referred to as "coils") are rearranged into 5 so that the opposing sides are parallel to each other and surrounded by 9 on almost the same plane.

In FIG. 5, the symbols 20g, 204, 20c
, 20d are attached. ), COR consists of a square coil and a soft magnetic material fixedly distributed so as to penetrate the entire center of the COI (hereinafter referred to as the core).
, and this = A COR and each coil COI make the chip C
Magnetic N that applies an in-plane rotating magnetic field to 11l PFC'%:
The RFS is a rotating magnetic field confinement case (hereinafter referred to as the case) that houses the central rectangular part of the board FPC, two steps CEI, and the entire magnetic circuit pFC.
It is. The case RFS is formed by processing two individual plates, and the upper and lower plates are electrically connected at the side of the case. In these cases RFS, the gap in the center part is narrowed in a slightly wider range than the part where the chip CHI is rearranged.
5) is formed. This constriction can also be used for positioning the magnet body that is to be retracted. Case RFS is waiting for the effect of killing two birds with one stone by confining the rotating magnetic field and mechanically supporting the soft board Fpc2.

There is a gap SIR between case RFS and chip 1CIiI, especially at 1jIII1110 of chip CHI.

This gap SIR, including the flat surface of the ICHI, is coated with silicone resin or coated with light, making it perfect for the Chiku Tien! How many layers of J% wisdom are there? Afterwards, moisture is less likely to enter the chip surface or the IXIJIllflS (5. Budgege carbon effect is intended. If complete air leakage is possible on the outside of the case AFS, the resin SIH Filling may be omitted.

INN is a pair of inclined plates made of magnetic material arranged 91tlK outside the case RFS, and in Fig. 2, the upper inclined plate I
As NN moves to the left, the lower inclined plate INN moves to the right V.
The thickness of the plate increases as the value of c increases.1 and 9. Both are case A
An inclined surface is formed on the FS side. As a material for inclined plate INN.

The magnetic permeability μ is high (soft 7elite, permalloy, etc. with small coercive force Hc can be used and it is easy to process the sloped surface in the case of a single-layer case). Is RAG a pair of inclined plates INH? 39111 is a pair of permanent magnet plates (hereinafter referred to as "magnetic plates") arranged in parallel with it. The HOM is a pair of magnetic materials such as Soft 7 Elite placed inside the 4!1 magnet plate RAG and connected to it. It is a 1E4111 board. The magnet plate NAG is formed with a uniform plate thickness VW over the entire surface. INS
are a pair of inclined plates made of a material with good thermal conductivity (non-repellent) such as copper, which are disposed on the Pl side facing surfaces of the pair of U magnetic plates 110M and aligned with the U magnetic plates 110M.

These inclined plates INN are formed with substantially the same inclination angle as the inclined plates INM, and have rigid surfaces in opposite directions. Inclined plate INN, magnetic plate HAG, distorted magnetic plate HOM, and Fuchutsuba IN
N is placed in a single layer and integrated, and after the bias magnetic field generating magnet body BIN (hereinafter referred to as the magnet body) is incinerated, # is set so that the thickness of the entire laminated magnet body is almost the entire surface. It is formed into a uniform shape. A pair of magnet bodies BIN are removed from the center flat part surrounded by the constriction part of the case RFS.

BIC is a bias magnetic field stopping coil (
(hereinafter referred to as bias coil). The bias coil BIC adjusts the magnetic force of the magnet plate MAG to the characteristics of the chip CHI, and when testing the presence or absence of unnecessary bugs, it clears all the bubbles of the chip ICHI (all γ
R), mW is applied.

5lit is a board FPC equipped with Sokichi "fcItl"
and magnetic circuit PFCw: a converging Kuss RFS and a pair of magnets BINα outside thereof.

This is an outer magnetic shield case (hereinafter referred to as a shield case) made of a magnetic material that houses the BIMb and the bias coil BIC. The material of the shield case SII has a high magnetic permeability μ.

Magnetic materials with large saturation magnetic flux @ME JF (and small Hc are preferable, and permalloy and ferrite are expected to have similar properties, but in this example, they are suitable for bending and bending.) A familiar permalloy iron-nickel alloy was selected. ◎PKG is a heat conductor 4" attached to the outer circumferential surface of the Soji Shield Case SHI by layering or fitting.
4 is a packaging case made of a material such as A4, which is easy to machine. CMP is W board F
1 from the four corners of PC. Provided with a shield case SH
This is a contact pad placed so as to make contact with the outer S connection loop that is folded back on the back of the I. TEF is %; contact with CNp of opening! It is a terminal surface foot plate made of an insulating member ρ) which is fixed at the R part. REG is sealed in the 94114th corner of packaging case PKG, and the shield case SK1 assembly is inserted into packaging case P.
This is a resin molding agent that fixes to KGFl'3 part.

FIG. 3 is an assembled perspective view showing the assembly procedure of each component constituting the above-described magnetic bubble memory device, and the same reference numerals as above indicate the same members. In the figure, first, there are input/output wiring connection parts 5 protruding from the four corners, and a chip is mounted in the center. A two-piece board assembly END with two chips CHI mounted on a board FpC to be mounted is placed inside an outer case RFSa with an insulating sheet 36 on the bottom surface.
After inserting the magnetic circuit PFC on top, insert the silicone lubricant 5.
Fill the IR (not shown) and place the inner case RFS on top of it.
b is assembled into the outer case RFSα, and the surface contact portions of the outer case RFS a and the inner case RFSb are connected in a t-legal manner by soldering or the like.

Next, these inner case RFSb and outer case RF
The upper magnet body BINα and the lower 114111iIi stone body B are attached to the concave apertures mso and ss provided on the outer surface of Sα.
After rearranging IMb, align-wound bias coils BIC are placed in the gap (not shown) formed between the outside #IN of this upper magnet body EIM a and the inside of the inner case RFSJ, and these are connected to the outside 11111 shield. Case 5HIa
Further, the inner shield case 5Klb is incorporated, and the side contact portions of the outer shield case 5HIa and the inner shield case 51114 are magnetically connected by welding or the like.

Next, from the four corners of the shield case SHI to the outer case RFS
The external connection terminal connecting part 3 of the O-period bonded FPC protruding through the notch 35 of α and the notch 54 of the outer shield case SHIα is connected to the back side of the inner shield case SHI b through the notch sb8. With the bent part 2,
Fold back to 5 as shown in the figure, inner shield case 5EIb
Rearranged the entire back area of ``Agaiyo 5'' by combining it with ``5''.

A contact pad CN is attached to each external connection terminal 96 covered with solder or the like provided on each of these contacts Mg3.
p'4f The terminal fixing plate TEF' mounted in each opening is arranged in contact with each other, and each external connection layer 2b and the contact pad CNP are electrically bonded by a semicircular shape or the like using a thermopressure layer or the like.

Next, these assemblies are stored in the packaging case PKG, and the terminal fixing plate TEF and the packaging case pK are
Gf) The contact portion is sealed with a metal seal or the like and then assembled.

A partially cut-away perspective view '4r of the device, which has been cut to 1 m12 in this way, is shown in Fig. 1, and a @ side view is shown in Fig. 2B.

Fig. 4 is a diagram showing the board FPC, and Fig. 4A shows the connection part of the outer S connection terminal protruding from the four corners. ) is a plan view arranged in a manner that coincides with the return opportunity.

In the figure, the board FPC has a rectangular chip mounting part 1 in the center and small bent parts 2 (2α) in the four corners.
, 2b.

2C, 2d), and a square outer S connection terminal connection part (hereinafter referred to as the connection part) 3 (3α) is attached to this additional part.

sb, sc, sd), and are integrally formed with an almost windmill-like overall shape, and the two chips CHI shown in FIG.
A rectangular opening 4 (4α.

4b) and five positioning holes 5 (5α).

5b, sc), and one connection 3
A substrate protrusion g6 for positioning is provided at the tip of C.

This FPC board has a five-layer structure consisting of an insulating layer, a wiring layer, and an edge layer.The base film Z is made of a polyimide resin film with a thickness of about 50 μm, for example, and is coated with an epoxy thread adhesive. By forming a thin copper layer Pm through the wafer and etching it into the desired pattern shape,
A large wiring lead 9a and a circular external terminal 9b are shown in FIG.

Patterns such as an elliptical coil lead connection terminal 9c, a symbol 9d, and an index mark 9C are formed, and a transparent or semi-transparent pattern is formed on the upper surface of these through an N contacting agent made of the same material as described above. A cover film 10 is arranged in contact.

In the opening 4 of this substrate FPC, the base film 7 on which the chip CEIfi is mounted is formed with an opening with a high +1 dimension, and the cover film 10 on the upper surface side thereof has an opening with a relatively large dimension. Furthermore, between the base film 7 and the cover film 10, a reed 9α for arranging chicks is formed, and this reed for arranging chicks 9α is formed. For example, a tin plating layer is formed on the surface of a, and the cross section is formed to have a two-layer structure and a two-frame structure.

Is the chip CHI connected to this exposed wiring lead? α
For example, lead bonding is performed on top.

On the other hand, when the connection @S is 8, the 'f' of the cover film 10 is
A circular opening 12 is formed in a portion corresponding to the non-circular N5 terminal 9b and the oval external terminal 90 (not shown), and the external terminal 94 exposed through the opening 12 is fitted onto the copper thin film pattern 9c. Alternatively, a solder layer is formed by dipping or the like.

(, te, each external terminal 9 provided in these connection parts 5
b, 9c are each connection part 3α, 51r, 3c,
5cL and bent portions 2α, 2b, 2c,
2d and each wiring lead 9αlC formed continuously on the chip mounting part 1.
Each connection part 3α, 54 is attached to a part of the open end of α, 4A.
They are gathered in blocks 5c and 5d, and their tips are exposed in the respective openings 4α and 4b. That is, the fourth
As shown in the figure, M! The wiring leads 9a of the connecting part 3.6 are located at the lower left of the opening 4b, and the wiring leads 9α of the connecting part 30 are located at the upper left of the opening 4a. The wiring lead 9α of the connecting portion 3d is arranged at the lower right corner of the opening s4b.

Then, in the process explained in FIG.
α, 2b, 2c, 2tt are bent and the entire back circle of the inner shield case SHI b is assembled in a vague manner, forming a quick-release layer 9b, 9c.
is placed on the front side, and the wiring lead 9α, symbol 9d and index mark 9- have the surface covered by the cover film 1.
0, these patterns are arranged in such a way that each station can read them through the cover film 10.

Now, the present invention is characterized in the internal structure of the case RFS in the above-described bubble memory device. This will be explained in detail below using the example shown in FIG. li
! I will clarify.

Figure 5 shows the board assembly END in case NFS.

This is a cross-sectional view of a magnet body EIM and a bias Illumination BIC mounted. In the same figure, the internal case RFS b has a frame-shaped aperture part 30 whose central part is concave, and its opposite end faces upward. A bent portion 31 bent approximately 90 degrees, and 9 notches f cut diagonally at each of its four corners.
iI 552 (not shown) and a second accommodation section 37 for positioning the ICHI inside the aperture section 50.
and in this case RF
54 is formed by pressing a highly conductive material 1, for example, an undefeated copper plate. In this case, the constricted portion 50 and the bent portion 31 improve the mechanical strength of the inner case RFSb in the torsional direction.

The outer diameter dimensions in the longitudinal and lateral directions between the bending portions 31 facing each other can be appropriately limited. Also.

The aperture part 50 includes a magnet body BIMb arranged on the outer surface side of this case RFSh, and a magnet body 70HI arranged on the inner surface side.
You can adjust the distance between the
Reference numeral 57 is for positioning the rCHI. In addition,
The notches 32 provided at the four corners of this case RFS,
Each bent portion 2α, 2 of the board FpC disposed in 6
6, 2c, and 2d form the drawer portions.

According to the more compact structure, the inner case RFSb can be formed by a press working method, so it can be manufactured with high precision dimensions and at low cost.

Although the inner case RFS b is made of invincible steel, other materials such as copper, makoto, gold plate, or plated with these alloy plates may also be used.

Now, the outer (b) case RFSα is formed using the same material and manufacturing method as the inner case RFSb described above, and its structure is almost the same as described above, including a frame-shaped aperture part 33 whose center part is concave, and It has a bent portion 34 whose opposing end sides are bent upward at approximately 90 degrees, and cutout portions 35 (not shown) each of which has four corners cut in the circumferential direction. . In this case, the mutually opposing bent portions 34 have an inner dimension that is approximately the same as the outer dimension between the bent portions 31 of the inner case RFS b described above, and have a thick height. The constricted portion 33 and the cutout portion 35 have a weight of 1 g.
It is formed to have approximately the same dimensions as the inner case RFSI) which has 111 turns.

The outer case RFS and the inner case RFSb configured in this way are arranged in the outer case RFSa circle and the inner case R
Push in the FS b and fold the bent part 3 of the outer case RFSα.
The integrated case RFS is assembled by contacting and connecting the outer surfaces of 1 and 1 to each other.

Now, the board assembly END is housed and arranged within this case RFS. First, a polyimide film 36 having a thickness of about 0.11 ML, for example, is placed as an electrically insulating sheet on the bottom surface of the outer case RFSα, and the board assembly END is placed on this film 36, and the board assembly END is placed on the periphery thereof. A magnetic circuit pFC is placed on each of the R-sides, and an Evo medium-based spring layer agent ft is applied to the top surface of the board assembly END.

An inner case RFSb is inserted into the upper part of these parts and arranged to be joined. In this case, the aperture section 37 is connected to the chip CI
Since the digit of II is determined in step 5, the tick C11l is set at a specific position with respect to the magnetic circuit ppc and the magnet body BI&. Note that the Fr9 bent portion 34 of this outer case RFSα
The inner surface of the inner case RFSb and the outer surface of the bent portion 31 of the inner case RFSb are electrically and mechanically connected at the portion indicated by the X mark by metal 7cr- or half-extrusion. Also.

The gap between the outer case RFSa and the inner case RFSb is filled with silicone resin SIR, and the substrate assembly END and magnetic circuit PFC are fixed therein. In this case, the bent portions 2 (
2α* 2b# 2's 2') is drawn out.

38 [ecoil (,' OI comrade connection or coil C
This is a glue board for connecting the OI and an external terminal 9at provided on the FPC board.

In a stiffer configuration, when a leakage magnetic field is generated by driving the magnetic circuit PFC, an induced current flows through the case RFS to form a closed roof, and this induced 1! The rotating magnetic field is confined within the case R15 due to the current, and therefore a special rotating magnetic field is applied to the chip CMI.

According to this configuration, the chip CMIt mounted on the tic board FPC can be positioned at the position determined by the ridge 37 between the outer case RFSα and the inner case RFSb, and the chip CMIt mounted on the tic board FPC can be positioned within the convex portion of the peripheral portion. Magnetic rotation p / (
, ' 4 are arranged so that they are sandwiched, so the packaging effect is not the same as above, and the ease of assembly is the same as above. Also.

By reducing the volume emitted in the apocryphal case RFSα and the internal case N F S J, r), Vl (one volume) can be reduced, and the magnetic circuit PF that generates the Ifx magnetic field
C can be made smaller. Further outside 11111 case R
Restricted portions 30 and 55 are provided in FSα and inner case RFSb.
The concave portions formed by the gap 1 between the opposing concave portions are
By reducing this, the four components (Z component) perpendicular to the plane of the chip CHI in one rotational magnetic field become close to zero, resulting in only a horizontal component, and the integrity can be improved. Moreover, since the magnetic circuit PFC and the case RFS are almost symmetrical with respect to the axis perpendicular to the confectionery 11flK of Chi7CHI, the integrity can be further improved.

In addition, although the example in which the aperture part 37 was provided on the case RFSb side was shown in the above-mentioned case RFSb side, the board FPC is
When it is inscribed in S b 1llJ, the aperture capital 37 may be provided on the case RF Sa side.

〔Effect of the invention〕

As described above, according to the present invention, case R
The positioning setting part (diaphragm part 37) provided in the inner part of the FS positions the chip CHI5, so the chip 7CIi
l is set at a predetermined position with respect to the magnetic circuit PFC that generates a rotating magnetic field and the a'cuboid EIM that generates a bias magnetic field, improving the reliability of information stored on the chip.
It also has the effect of greatly contributing to ease of assembly.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view showing the entire magnetic bubble memory device to which the present invention is applied. Figure 2A is a bottom view, Figure 2B is 2B-2Bl of Figure A.
3 is an exploded perspective view showing the stacked structure, and FIG. 4 is a board FPC'4! 5 is a cross-sectional view of a main part of a magnetic bubble memory device according to the present invention. CHI: 4B bugle memory chip FpC: 7 Lexiguru distribution board' BND: Board assembly RFSα: Outer rotating magnetic field confinement case RFSb: Inner rotating magnetic field confinement case 50: Aperture section 37: Positioning setting section (aperture section) BIM ：Magnet

Claims (1)

[Claims] A magnetic bubble memory chip mounted on a wiring board and electrically connected thereto is placed in a position surrounded by two sets of rectangular annular cores each having a wire wound on two opposing sides.
A magnetic bubble memory device in which the magnetic bubble memory chip, the winding, and the core are covered with a rotating magnetic field confinement case, wherein a device determination setting is performed to position the magnetic bubble memory chip on the inner surface of the rotating magnetic field confinement case. 1. A magnetic bubble memory device comprising: a magnetic bubble memory device;