JPS61240666A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61240666A
JPS61240666A JP60081828A JP8182885A JPS61240666A JP S61240666 A JPS61240666 A JP S61240666A JP 60081828 A JP60081828 A JP 60081828A JP 8182885 A JP8182885 A JP 8182885A JP S61240666 A JPS61240666 A JP S61240666A
Authority
JP
Japan
Prior art keywords
heat sink
thermal expansion
metal substrate
layers
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60081828A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322707B2 (enExample
Inventor
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP60081828A priority Critical patent/JPS61240666A/ja
Publication of JPS61240666A publication Critical patent/JPS61240666A/ja
Publication of JPH0322707B2 publication Critical patent/JPH0322707B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP60081828A 1985-04-17 1985-04-17 半導体装置 Granted JPS61240666A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60081828A JPS61240666A (ja) 1985-04-17 1985-04-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60081828A JPS61240666A (ja) 1985-04-17 1985-04-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS61240666A true JPS61240666A (ja) 1986-10-25
JPH0322707B2 JPH0322707B2 (enExample) 1991-03-27

Family

ID=13757332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60081828A Granted JPS61240666A (ja) 1985-04-17 1985-04-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS61240666A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939214A (en) * 1989-05-31 1999-08-17 Advanced Technology Interconnect, Incorporated Thermal performance package for integrated circuit chip
US7362001B2 (en) 2002-10-28 2008-04-22 Toyota Jidosha Kabushiki Kaisha Generator-motor
US7411324B2 (en) 2002-10-28 2008-08-12 Toyota Jidosha Kabushiki Kaisha Generator-motor
US7456531B2 (en) 2003-07-24 2008-11-25 Toyota Jidosha Kabushiki Kaisha Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
EP2056344A4 (en) * 2006-07-28 2012-12-19 Kyocera Corp STORAGE PACKAGING FOR ELECTRONIC COMPONENTS AND ELECTRONIC ARRANGEMENT

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939214A (en) * 1989-05-31 1999-08-17 Advanced Technology Interconnect, Incorporated Thermal performance package for integrated circuit chip
US7362001B2 (en) 2002-10-28 2008-04-22 Toyota Jidosha Kabushiki Kaisha Generator-motor
US7411324B2 (en) 2002-10-28 2008-08-12 Toyota Jidosha Kabushiki Kaisha Generator-motor
US7456531B2 (en) 2003-07-24 2008-11-25 Toyota Jidosha Kabushiki Kaisha Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
US7759831B2 (en) 2003-07-24 2010-07-20 Toyota Jidosha Kabushiki Kaisha Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
EP2056344A4 (en) * 2006-07-28 2012-12-19 Kyocera Corp STORAGE PACKAGING FOR ELECTRONIC COMPONENTS AND ELECTRONIC ARRANGEMENT

Also Published As

Publication number Publication date
JPH0322707B2 (enExample) 1991-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term