JPS61229332A - 半導体素子製造装置 - Google Patents
半導体素子製造装置Info
- Publication number
- JPS61229332A JPS61229332A JP60069015A JP6901585A JPS61229332A JP S61229332 A JPS61229332 A JP S61229332A JP 60069015 A JP60069015 A JP 60069015A JP 6901585 A JP6901585 A JP 6901585A JP S61229332 A JPS61229332 A JP S61229332A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- workpiece
- predetermined position
- predetermined
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60069015A JPS61229332A (ja) | 1985-04-03 | 1985-04-03 | 半導体素子製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60069015A JPS61229332A (ja) | 1985-04-03 | 1985-04-03 | 半導体素子製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61229332A true JPS61229332A (ja) | 1986-10-13 |
| JPH0337858B2 JPH0337858B2 (enExample) | 1991-06-06 |
Family
ID=13390338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60069015A Granted JPS61229332A (ja) | 1985-04-03 | 1985-04-03 | 半導体素子製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61229332A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104518A (ja) * | 2010-11-05 | 2012-05-31 | Sumitomo Heavy Ind Ltd | 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法 |
-
1985
- 1985-04-03 JP JP60069015A patent/JPS61229332A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104518A (ja) * | 2010-11-05 | 2012-05-31 | Sumitomo Heavy Ind Ltd | 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337858B2 (enExample) | 1991-06-06 |
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