JPS6122859B2 - - Google Patents
Info
- Publication number
- JPS6122859B2 JPS6122859B2 JP53097251A JP9725178A JPS6122859B2 JP S6122859 B2 JPS6122859 B2 JP S6122859B2 JP 53097251 A JP53097251 A JP 53097251A JP 9725178 A JP9725178 A JP 9725178A JP S6122859 B2 JPS6122859 B2 JP S6122859B2
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- plate
- insulating plate
- wiring metal
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/68—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9725178A JPS5524464A (en) | 1978-08-11 | 1978-08-11 | Complex semiconductor system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9725178A JPS5524464A (en) | 1978-08-11 | 1978-08-11 | Complex semiconductor system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5524464A JPS5524464A (en) | 1980-02-21 |
| JPS6122859B2 true JPS6122859B2 (index.php) | 1986-06-03 |
Family
ID=14187343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9725178A Granted JPS5524464A (en) | 1978-08-11 | 1978-08-11 | Complex semiconductor system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5524464A (index.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5642410Y2 (index.php) * | 1976-08-12 | 1981-10-05 |
-
1978
- 1978-08-11 JP JP9725178A patent/JPS5524464A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5524464A (en) | 1980-02-21 |
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