JPS61226933A - Mounting apparatus - Google Patents

Mounting apparatus

Info

Publication number
JPS61226933A
JPS61226933A JP6781985A JP6781985A JPS61226933A JP S61226933 A JPS61226933 A JP S61226933A JP 6781985 A JP6781985 A JP 6781985A JP 6781985 A JP6781985 A JP 6781985A JP S61226933 A JPS61226933 A JP S61226933A
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor chip
tape
chip
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6781985A
Other languages
Japanese (ja)
Inventor
Yasumasa Noda
野田　康昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP6781985A priority Critical patent/JPS61226933A/en
Publication of JPS61226933A publication Critical patent/JPS61226933A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enable the application of the same mount tape to every size of semiconductor chips by a construction wherein a light source unit applying ultraviolet rays to each separate semiconductor chip from below the mount tape is disposed in a take-out stage. CONSTITUTION:A mount tape 4 is stretched on a flat ring 3, and a semiconductor wafer 1 is put on the mount tape 4 and fixed thereon by the adhesion thereof. Then, a light source unit 10 is moved in the three-dimentional direction relatively to the semiconductor wafer 1 and set below a semiconductor chip 5a to be taken out, and applies ultraviolet rays to the mount tape under said semiconductor chip 5a. By this application, an adhesive in the irradiated part of the mount tape is set and consequently the adhesion thereof is reduced. Thus, an adsorption head 6 of a vacuum tweezers or the like or a take-out device such as a collet is lowered to hold the chip 5a, and thereby the chip 5a is taken out.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は半導体ウェーハを切断して１ｑられた半導体チ
ップを個々に分離して取り出し、リードフレームに搭載
するマウント装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mounting device for cutting a semiconductor wafer, separating and taking out 1q semiconductor chips individually, and mounting the semiconductor chips on a lead frame.

〔発明の技術的背題とその問題点〕[Technical background of the invention and its problems]

半導体装置をｖｌ造する際に使用される従来のマウント
装置は、ダイシングの完了した半導体つ工−ハを接着し
たマウントテープを張設置るフラットリングを備え、同
一平面内を前後、左右方向に移動する可動ステージと、
半導体チップをリードフレームに固着させるためのダイ
ボンディングステージと、半導体チップを吸着保持して
取出ステージからダイボンディングステージへ移送する
取出し装置を備えている。Conventional mounting equipment used when manufacturing semiconductor devices is equipped with a flat ring that attaches mounting tape to which diced semiconductor chips have been bonded, and moves back and forth and left and right within the same plane. A movable stage to
It is equipped with a die bonding stage for fixing a semiconductor chip to a lead frame, and a take-out device that suction-holds the semiconductor chip and transfers it from the take-out stage to the die bonding stage.

この装置においては、あらかじめダイシング装置によっ
て半導体チップごとの所定の分断が行われた半導体つ■
−ハを接着したマウン１−テープを取出ステージ」−の
フラットリングに張設し、その後、マウント・テープを
伸ばしＣ個々の半導体チップに分１ｌ１１１シ、マウン
１へテープ下方から帽状体で所望の半導体チップを押上
げながらその半導体チップを真空ヂャック等の取出し装
置で取り出してダイボンディングステージに移送し、リ
ードフレームにマウントする動作を行う。This device uses a dicing device to cut semiconductor chips into predetermined pieces for each semiconductor chip.
- Take out the mount 1 with the tape attached to it and put it on the flat ring of the removal stage. Then, stretch the mount tape and place it on each semiconductor chip for 1 l111 minutes. While pushing up the semiconductor chip, the semiconductor chip is taken out by a take-out device such as a vacuum jack, transferred to a die bonding stage, and mounted on a lead frame.

しかしながら、このＪ：うな従来装置にａ３いては、半
導体チップの大ぎさに応じてマウンｈ−ｙ−プを交換す
る必要がある。’Ｊ’　＜Ｋわち、半導体チップが小さ
な揚台には粘着力の大きなマウン１〜テープを使用し、
半導体デツプが大ぎい場合には粘着力の小ざなマウント
テープを使用する。これは常に粘着力の人ぎ／Ｚマウン
トテープを使用するど大ぎな半導体デツプの取出しが良
好に行えなくなると共に、粘着力が小さな場合には所望
の半導体チップの取出しの際に取出Ｊべき半導体プツシ
に隣接りる他の半導体チップも剥離してしまうためであ
る。However, in this conventional device, it is necessary to replace the mounting hyope depending on the size of the semiconductor chip. ``J''
If the semiconductor depth is large, use mounting tape with a small amount of adhesive strength. This is because if you use adhesive tape/Z mount tape, you will not be able to take out a large semiconductor depth well, and if the adhesive strength is small, you will not be able to remove the semiconductor chip that should be taken out when taking out the desired semiconductor chip. This is because other semiconductor chips adjacent to the wafer also peel off.

このため、マウントテープの交換が煩雑ぐあり、またダ
イシングを確実に行うためにダイシング装置の精度を向
上させな【プればならず、装置の高価格化を招くという
問題がある。For this reason, it is troublesome to replace the mounting tape, and the precision of the dicing apparatus must be improved in order to perform dicing reliably, leading to problems such as an increase in the cost of the apparatus.

また、マウントテ−プとして紫外線の照射により粘着力
が低下するものが開発されている。これを用いる場合に
はマウントテープの裏面Ｊ：り紫外線を全面に照射する
ことにより取出しが容易になる。Additionally, mounting tapes have been developed whose adhesive strength decreases when irradiated with ultraviolet rays. When this is used, removal is facilitated by irradiating the entire back side of the mounting tape with ultraviolet rays.

しかし、この方法では所望の半導体チップに隣接する半
導体チップも同時に取れてしまい取出しの安定性に欠け
るという問題点がある。However, this method has the problem that the semiconductor chips adjacent to the desired semiconductor chip are also removed at the same time, resulting in a lack of stability in removal.

〔発明の目的〕[Purpose of the invention]

本発明は上記事情に鑑みてなされたもので、同一のマウ
ンＩ・テープをあらゆる大ぎさの半導体チップに適用覆
ることができ、又、半導体チップの取出しも確実に行う
ことができるマウン１〜装置を提供することを目的とし
ている。The present invention has been made in view of the above circumstances, and is capable of covering semiconductor chips of any size with the same mount I tape, and also is capable of reliably taking out semiconductor chips. is intended to provide.

〔発明の概要］ 上記目的を達成するため、本発明によるマウン１〜装首
はマウン１〜テープとして紫外線の照射で粘着ツノが低
下する材質のテープを使用すると共に、このテープに紫
外線を照射Ｊ−る光源装置を取出しステージ内部に配設
してこの光源装置による照Ｑ＝１を個々の半導体チップ
ごとに行うようにしている。[Summary of the Invention] In order to achieve the above object, the present invention uses a tape made of a material whose adhesive horns decrease when irradiated with ultraviolet rays, and a tape made of a material whose adhesive horns decrease when irradiated with ultraviolet rays. A light source device is disposed inside the takeout stage, and the light source device illuminates each semiconductor chip with Q=1.

これにＪ：す、所望の半導体チップだ（プの取り出しを
容易に行うことが可能となっている。This is the desired semiconductor chip (the chip can be easily removed).

〔発明の実施例〕[Embodiments of the invention]

以下、本発明ににるマウン１〜装置の一実施例を図面を
参照して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, one embodiment of a mounting 1 to a device according to the present invention will be described in detail with reference to the drawings.

図は本発明にかかるマウント装置の要部である取出しス
テージの断面図である。あらかじめ回転ダイＡ７モンド
ブレードあるいはレー１）−等で個々の！１′導体デツ
プ５ごどの切断線２を形成された半導体ウェーハ１はマ
ウントテープ４のＬ面に接着され、このマウンＩ・テー
プ４は前後、左右方向に移動するテーブル（図示せず）
に設番ノられたフラツトリング３下面に張設されている
。ここで、マウントテープ４はその外周端面がフラット
リング３下簡に貼着しており、前記半導体ウェーハ１は
中心線がフラットリング３の中心線ど略一致するように
マウ、ン１〜テープ４上面に接着される。The figure is a sectional view of a take-out stage which is a main part of the mounting device according to the present invention. In advance, use a rotating die A7 mondo blade or ray 1) - etc. to make each individual! The semiconductor wafer 1, on which cutting lines 2 such as 1' conductor depths 5 have been formed, is adhered to the L side of a mounting tape 4, and this mounting tape 4 is attached to a table (not shown) that moves back and forth and left and right.
It is stretched on the bottom surface of flat ring 3, which is numbered. Here, the outer peripheral end surface of the mounting tape 4 is attached to the lower plate of the flat ring 3, and the semiconductor wafer 1 is mounted so that the center line of the semiconductor wafer 1 substantially coincides with the center line of the flat ring 3. Glued to the top surface.

半導体ウェーハ１の上方には切断により分離された半導
体チップを吸着ヘッド６で吸着保持し、この半導体チッ
プをリードフレーム上の所定位置に固着させるダイボン
ディングステージ（図示せず）の方へ移動する取出し装
置が設けられている。Above the semiconductor wafer 1, there is a take-out stage where the semiconductor chips separated by cutting are held by suction with a suction head 6, and the semiconductor chips are moved toward a die bonding stage (not shown) which fixes the semiconductor chips in a predetermined position on a lead frame. equipment is provided.

このようなマウント装置において、マウントテープ４と
しては紫外線の照射で接着剤が硬化して粘着力が低下す
る材質のテープが使用される。In such a mounting device, the mounting tape 4 used is a tape made of a material whose adhesive hardens upon irradiation with ultraviolet rays and whose adhesive strength decreases.

このようなテープとしては不二紙■■の商品名Ｄ４７等
が知られている。また、取出しステージ内のマウントチ
ー１４下方には光源装置１０が配設されている。光源装
置１０は紫外線を照射する光源ランプ１１と、光源ラン
プ１１からの紫外線を焦光させる組合せレンズ１２．１
３と、これらを移動させる駆動装置１５とからなってい
る。駆動装＠１５はマウントテープ４上面の半導体つ工
−ハ１に対して三次元方向に相対的に移動するようにな
っており、半導体ウェーハ１が前後、左右に移動づ°る
構成であれば光源装置は上下方向、あるいは前後、ノ１
−右、上下方向に移＃Ｊ　するにうに構成される。そし
て、この移動により、取出すべき半導体チップ５）ａの
下方に移動して、その半導体デツプ５ａを接着する部分
のみのマウン１〜テープに紫外線を照射してその部分の
粘着力を低下さ°１遍、半導体デツプ５ａのみの取出し
を容易ならしめるようになっている。As such a tape, the product name D47 of Fujishi ■■ is known. Further, a light source device 10 is disposed below the mount chip 14 in the take-out stage. The light source device 10 includes a light source lamp 11 that irradiates ultraviolet rays, and a combination lens 12.1 that focuses the ultraviolet rays from the light source lamp 11.
3, and a drive device 15 for moving these. The drive unit @ 15 is configured to move in a three-dimensional direction relative to the semiconductor wafer 1 on the top surface of the mounting tape 4, and if the semiconductor wafer 1 is configured to move back and forth and left and right, The light source device can be used in the vertical direction, or in the front and rear directions.
- It is configured to move #J to the right and up and down. As a result of this movement, the semiconductor chip 5)a to be taken out is moved below, and ultraviolet rays are irradiated to only the part of the mount 1 to the tape to which the semiconductor depth 5a is to be bonded, reducing the adhesive strength of that part. This makes it easy to take out only the semiconductor dip 5a.

この紫外線の照射に際しては、光源装置ｕ１０のレンズ
系１２．１３に絞り１４を設（Ｊることも可能で、絞り
１／Ｉの開口度を変化させることで紫外線の照射面積お
Ｊ、び照（ト）強度を変更させ、半導体チップの面積に
応じて最適な粘着力低下を起こざぜることができる。When irradiating this ultraviolet ray, it is possible to set an aperture 14 in the lens system 12.13 of the light source device u10. (g) By changing the strength, it is possible to cause an optimal decrease in adhesive strength depending on the area of the semiconductor chip.

次に、以上のような装置よって半導体チップを取り出−
ｊ”Ｉ）Ｊ作を説明する。Next, the semiconductor chip is taken out using the device described above.
j"I) Explain J's work.

まず、フラットリング３にマウントチー−１４を張設」
ハ半導体ウェーハ１をマウンｌ−テープ４上に載置し、
その粘着力で半導体ウェーハ１をマウンｌ−テープ４十
に固定づる。そして、光源装置１０を半導体ウェーハ１
に対して相対的に三次元方向に移動させて、取出すべき
半導体デツプ５ａの下方にセラ］〜し、紫外線をその半
導体デツプ５ａの下部のマウントテープに照射する。こ
の照射にＪ一つて、マウントテープの照射部分の接着剤
が硬化し、粘着力が低下するため、バキュームピンセッ
ト等の吸着ヘッド６あるいはコレット等の取出し装置を
半導体チップ７ａに保持するように下降させて、チップ
７ａの取り出しが行われる。First, attach mount chi-14 to flat ring 3.
Place the semiconductor wafer 1 on the mounting tape 4,
The semiconductor wafer 1 is fixed to the mounting tape 40 by the adhesive force. Then, the light source device 10 is attached to the semiconductor wafer 1.
The mounting tape is moved in a three-dimensional direction relative to the semiconductor layer 5a to be removed, and the mounting tape at the bottom of the semiconductor layer 5a is irradiated with ultraviolet rays. During this irradiation, the adhesive on the irradiated part of the mounting tape hardens and its adhesive strength decreases, so the suction head 6 such as vacuum tweezers or the ejecting device such as a collet is lowered to hold it on the semiconductor chip 7a. Then, the chip 7a is taken out.

（発明の効果〕 以上説明したように、本発明によれば、紫外線照射で粘
着力が低下するマウン１〜テープに半導体ウェーハを接
着し、このマウン１〜テープの裏側から半導体チップ毎
に紫外線を照射するような紫外線照ＯＡ装置を備えてい
るので取出すべき半導体チップ部のみのテープの粘着力
が低下して、その半導体チップだけを安定に取り出すこ
とができ、伯の半導体チップがマウントテープから剥離
することがない。また、半導体チップの大きさに応じて
粘着力の相違づるマウントテープを交換する必要なく、
単一のテープだ【プを使用するためマウントテープ交換
の煩雑さがなくなり作業効率を向上さぜることができる
。(Effects of the Invention) As explained above, according to the present invention, a semiconductor wafer is adhered to the mount 1~tape whose adhesive strength decreases when irradiated with ultraviolet rays, and ultraviolet rays are applied to each semiconductor chip from the back side of the mount 1~tape. Since it is equipped with an ultraviolet irradiation OA device that irradiates the semiconductor chip, the adhesive force of the tape only on the semiconductor chip part that needs to be taken out is reduced, making it possible to take out only that semiconductor chip stably, and the semiconductor chip peels off from the mounting tape. In addition, there is no need to replace the mounting tape, which has different adhesive strength depending on the size of the semiconductor chip.
Using a single tape eliminates the hassle of replacing mounting tape, improving work efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例によるマウント装置の要部の断面
図である。 １・・・半導体ウェーハ、２・・・切断線、３・・・フ
ラットリング、４・・・マウントテープ、５，５ａ・・
・半導体チップ、６・・・吸着ヘッド、１ｏ・・・光源
装置。 出願人代理人　　猪　　股　　　　清 −８＝The figure is a sectional view of essential parts of a mounting device according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor wafer, 2... Cutting line, 3... Flat ring, 4... Mounting tape, 5, 5a...
- Semiconductor chip, 6... Suction head, 1o... Light source device. Applicant's agent Kiyoshi Inomata-8=

Claims (1)

【特許請求の範囲】 １、個々の半導体チップに分割された半導体ウェーハが
上面に接着され紫外線の照射で粘着力が低下するマウン
トテープを張設するフラットリングを備えた可動取出ス
テージと、前記半導体チップをリードフレーム上の所定
位置に固着させるダイボンディングステージと、前記半
導体チップを吸着保持して前記ダイボンディングステー
ジへ移送させる取出し装置と、を備えたマウント装置に
おいて、 前記取出ステージ内に、前記マウントテープの下方から
紫外線を個々の半導体チップごとに照射する光源装置が
配設されていることを特徴とするマウント装置。 ２、光源装置の照射光の照射面積および／または照射強
度が半導体チップの面積に応じて変更可能になつている
ことを特徴とする特許請求の範囲第１項記載のマウント
装置。[Scope of Claims] 1. A movable take-out stage equipped with a flat ring on which a semiconductor wafer divided into individual semiconductor chips is adhered and a mounting tape whose adhesive strength decreases when irradiated with ultraviolet rays is stretched; A mounting device comprising: a die bonding stage that fixes a chip to a predetermined position on a lead frame; and a take-out device that suction-holds the semiconductor chip and transfers it to the die-bonding stage; A mounting device characterized by being provided with a light source device that irradiates each semiconductor chip with ultraviolet rays from below the tape. 2. The mounting device according to claim 1, wherein the irradiation area and/or irradiation intensity of the irradiation light of the light source device can be changed according to the area of the semiconductor chip.
JP6781985A 1985-03-30 1985-03-30 Mounting apparatus Pending JPS61226933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6781985A JPS61226933A (en) 1985-03-30 1985-03-30 Mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6781985A JPS61226933A (en) 1985-03-30 1985-03-30 Mounting apparatus

Publications (1)

Publication Number Publication Date
JPS61226933A true JPS61226933A (en) 1986-10-08

Family

ID=13355930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6781985A Pending JPS61226933A (en) 1985-03-30 1985-03-30 Mounting apparatus

Country Status (1)

Country Link
JP (1) JPS61226933A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1458012A2 (en) * 2003-03-12 2004-09-15 Nitto Denko Corporation Ultraviolet light irradiating method and an apparatus using the same
JP2007194433A (en) * 2006-01-19 2007-08-02 Canon Machinery Inc Pickup device and pickup method
JP2023031741A (en) * 2021-08-25 2023-03-09 株式会社 東京ウエルズ Conveyance device and conveyance method for chip-shaped workpiece

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1458012A2 (en) * 2003-03-12 2004-09-15 Nitto Denko Corporation Ultraviolet light irradiating method and an apparatus using the same
EP1458012A3 (en) * 2003-03-12 2006-05-10 Nitto Denko Corporation Ultraviolet light irradiating method and an apparatus using the same
US7091499B2 (en) 2003-03-12 2006-08-15 Nitto Denko Corporation Ultraviolet irradiating method and an apparatus using the same
JP2007194433A (en) * 2006-01-19 2007-08-02 Canon Machinery Inc Pickup device and pickup method
JP4624931B2 (en) * 2006-01-19 2011-02-02 キヤノンマシナリー株式会社 Pickup device and pickup method
JP2023031741A (en) * 2021-08-25 2023-03-09 株式会社 東京ウエルズ Conveyance device and conveyance method for chip-shaped workpiece

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